EEPROM

Octavo Systems Unveils the OSD32MP2 Series: Revolutionizing System Design in the Electronics Industry

Retrieved on: 
Tuesday, April 9, 2024
Cortex, SIP, Arm, Automation, GPU, Memory, DDR4, Electronics, Vulkan, API, ARM architecture family, Family, STMicroelectronics, EEPROM, Mobile phone

NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Octavo Systems , a leader in system integration technology, proudly announces the launch of its OSD32MP2 family , featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM .

Key Points: 
  • NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Octavo Systems , a leader in system integration technology, proudly announces the launch of its OSD32MP2 family , featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM .
  • The OSD32MP2 family caters to a diverse range of applications, from industrial automation to consumer electronics, offering unparalleled processing power, connectivity, and security features.
  • "Octavo Systems is committed to empowering electronics design engineers by simplifying the complexities of modern electronic design," said Harley Walsh, President of Octavo Systems.
  • For additional information, including detailed specifications and ordering details, please visit https://octavosystems.com or contact Octavo Systems at [email protected] .

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Solid State Cooling Market worth $1.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 27, 2024
Cloud, Genomics, External, SLC, Urbanization, MLC, Biomedical Research, Transport, Enterprise, Molecular biology, NvSRAM, USB, PMC, Statistics, PCR, FRAM, Biotechnology, EVS, Row, Form, Air conditioning, Electronics, DNA, PCI Express, TLC, USB flash drive, Payment card, Region, Polymerase chain reaction, EEPROM, SAS, Agriculture, SATA, Refrigeration, Food, Authentication, PCI, Resistive random-access memory, LED, Defense, Temperature, Consumer electronics, Growth, Access management, SSD, LAN, Internal, MRAM, Content, Near-field communication, EPROM, Protection, Coherent Corp., NRAM, Government, Hardware, Adhesive

Solid state cooling market for electrocaloric technology to hold the highest CAGR during the forecast period.

Key Points: 
  • Solid state cooling market for electrocaloric technology to hold the highest CAGR during the forecast period.
  • Solid state cooling market for thermocycler type to hold the highest CAGR during the forecast period.
  • Solid state cooling market for automotive vertical to hold the highest CAGR during the forecast period.
  • These players have a strong market presence for Solid state cooling s across various North America, Europe, Asia Pacific, and RoW countries.

Avalanche Technology Announces Two New Products in Its Upgradeable Small Form Factor Family of Gb STT-MRAM For Aerospace Applications

Retrieved on: 
Monday, March 25, 2024
Transfer, Temperature, SRAM, EEPROM, EAP, System, MRAM, Engineering, Life, RAM, Marketing, Low Earth orbit, STT-MRAM, GEO, Persistent, PDC, Parallel, FBGA, Video game

FREMONT, Calif., March 25, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today two new densities of its 3rd generation space-grade parallel asynchronous x32-interface high-reliability P-SRAM (Persistent SRAM) memory devices, based on its latest Spin Transfer Torque Magneto-resistive RAM (STT-MRAM) technology.

Key Points: 
  • With this development, Avalanche Technology is leading an evolution toward a new level of performance versus cost for modern space electronic systems.
  • "We welcome the addition of Avalanche's higher densities in the same physical footprint.
  • With the new 8Gb P-SRAM device, customers can design unified memory architecture systems for high reliability aerospace applications, all in one small form factor."
  • All density options in Avalanche's Parallel x32 Space Grade series will be available to customers participating in the early access program.

Global Embedded FPGA Market Soars to $7.1 Billion in 2022, Set for Remarkable 16.7% CAGR Growth by 2028

Retrieved on: 
Wednesday, November 8, 2023
Antifuse, SRAM, FPGA, EEPROM, Intellectual property, Socs, LTE, Common, Telecommunications, Field-programmable gate array, Safety, Application-specific integrated circuit, AI, IP, Compound annual growth rate, Mobile phone, Growth

DUBLIN, Nov. 7, 2023 /PRNewswire/ -- The "Embedded FPGA Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Nov. 7, 2023 /PRNewswire/ -- The "Embedded FPGA Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" report has been added to ResearchAndMarkets.com's offering.
  • The global embedded FPGA (Field-Programmable Grid Array) market has experienced substantial growth, with a market size of US$ 7.1 billion in 2022.
  • The global embedded FPGA market is driven by the increasing adoption of wireless connectivity in various applications.
  • The industrial sector is adopting embedded FPGA to regulate voltage, current, and motor speed, further driving market expansion.

DNA Data Storage Market worth $3,348 million by 2030 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, November 6, 2023
Cloud, Sequence, FRAM, BGI, Twist Bioscience, HMC, Volatile memory, Bay, Biotechnology, EEPROM, Region, NvSRAM, NAND, MRAM, NRAM, Research, Investment, Illumina, Inc., NAS, Enterprise, Genomics, Thermo Fisher Scientific, 3D NAND, University, 3D XPoint, Holographic Data Storage System, Cloud computing, PMC, STT-MRAM, Oxford Nanopore Technologies, HBM, Agilent Technologies, EPROM, Quantum Corporation, Consumer electronics, Molecular assembler, Resistive random-access memory, Longevity, DNA, Computer data storage, Catalog, Health care, Microsoft, Automotive industry

Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.

Key Points: 
  • Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage segment is expected to be the fastest growing market of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage is a type of DNA data storage in which data is encoded in the sequence of DNA bases.
  • However, sequence-based DNA data storage is expected to be less durability and more expensive in comparison to structure-based DNA data storage.

DNA Data Storage Market worth $3,348 million by 2030 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, November 6, 2023
Cloud, Sequence, FRAM, BGI, Twist Bioscience, HMC, Volatile memory, Bay, Biotechnology, EEPROM, Region, NvSRAM, NAND, MRAM, NRAM, Research, Investment, Illumina, Inc., NAS, Enterprise, Genomics, Thermo Fisher Scientific, 3D NAND, University, 3D XPoint, Holographic Data Storage System, Cloud computing, PMC, STT-MRAM, Oxford Nanopore Technologies, HBM, Agilent Technologies, EPROM, Quantum Corporation, Consumer electronics, Molecular assembler, Resistive random-access memory, Longevity, DNA, Computer data storage, Catalog, Health care, Microsoft, Automotive industry

Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.

Key Points: 
  • Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage segment is expected to be the fastest growing market of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage is a type of DNA data storage in which data is encoded in the sequence of DNA bases.
  • However, sequence-based DNA data storage is expected to be less durability and more expensive in comparison to structure-based DNA data storage.

The Octavo Systems OSDZU3 System-in-Package and OSDZU3-REF Development Platform Are in Production

Retrieved on: 
Tuesday, October 31, 2023
Power management system, Linux, LPDDR4, Memory, Avnet, EEPROM, AMD, DisplayPort, Programmable logic device, Multiprocessor system on a chip, GPU, SATA, Integration, SIP, Video game, Computer data storage, Ethernet

The OSDZU3 System-in-Package, designed around the AMD Zynq® UltraScale+™ MPSoC, pushes the limits of what is possible with SiP integration.

Key Points: 
  • The OSDZU3 System-in-Package, designed around the AMD Zynq® UltraScale+™ MPSoC, pushes the limits of what is possible with SiP integration.
  • To accompany the OSDZU3 SiP and help customers to get started, Octavo Systems has also released the OSDZU3-REF development platform.
  • The OSDZU3-REF is an open-source development platform that comes with an OSDZU3 installed and as a 4-layer design.
  • Harley Walsh, President of Octavo Systems, expressed his enthusiasm, stating, "Getting the OSDZU3 into production is the culmination of relentless effort and dedication by our exceptional team.

Microchip’s Detroit Automotive Technology Center is the Destination for Automotive Clients  

Retrieved on: 
Wednesday, October 18, 2023
MEMS, Vacuum, Gen 5 Fibre Channel, Ageing, EEPROM, Heart, ADAS, HMI, Certification, Original equipment manufacturer, Tiantong (Satellite), USB, Knob, Vehicle registration plates of Nepal, Silicon carbide, Safety, Silicon, Microchip Technology, ISO, Digital signal controller, MCHP, User interface, EMC, Renewable energy, Television, Video game, Integrated circuit

Microchip Technology (Nasdaq: MCHP), a leading provider of smart, connected and secure embedded control solutions, today announces the expansion of its Detroit Automotive Technology Center in Novi, Michigan.

Key Points: 
  • Microchip Technology (Nasdaq: MCHP), a leading provider of smart, connected and secure embedded control solutions, today announces the expansion of its Detroit Automotive Technology Center in Novi, Michigan.
  • The 24,000-square-foot facility is the destination for automotive clients to explore new technologies and to meet with technical experts to get support for their end applications and designs.
  • Microchip has been part of the Detroit community since 1999, when it first opened its doors as an application and sales office.
  • “In addition to the Detroit location, we have Automotive Technology Centers in Munich, Shanghai, Tokyo and Austin, Texas, to support our global customer base.”
    “Microchip’s Automotive Technology Center demonstrates our commitment to the automotive industry by providing a destination for them to develop, test and refine applications in the design phase,” said Matthias Kaestner, corporate vice president of Microchip’s automotive business.

Chiplet Market worth $148.0 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, October 11, 2023
Apple Inc., Memory, MRAM, System size expansion, Transport, USD, Enterprise Electronics Corporation, USB flash drive, Consumer electronics, Integrated circuit, DSP, 3D NAND, Resistive random-access memory, Application-specific integrated circuit, FPGA, SRAM, MCU, Middleware, NAND, High Assurance Internet Protocol Encryptor, Central processing unit, Nvidia, External, Telecommunications, Patent, MPU, IBM, Intel, Operating system, Hardware, Internal, EEPROM, EPROM, Huawei, NvSRAM, SSD, Defense, Configuration, NRAM, Growth, PMC, FRAM, Graphics processing unit, AMD, SMIC, Video game, Application, Software, Automotive industry, AI, Health care, Chiplet, Flash, Region, Electronics

By processor, the AI ASIC coprocessor is projected to grow at high CAGR of the chiplet market during the forecast.

Key Points: 
  • By processor, the AI ASIC coprocessor is projected to grow at high CAGR of the chiplet market during the forecast.
  • Chiplet-based AI ASICs offer a targeted and efficient approach to offloading AI-related tasks from general-purpose processors like CPUs and GPUs.
  • Enterprise Electronics segment is projected to grow at high CAGR of the chiplet market during the forecast period.
  • The Asia Pacific region is expected to hold the largest share of the chiplet market during the forecast period.