Socs

Endura Technologies Appoints New CEO, and Strategic Board Members to Accelerate Growth of System-on-Chip Power Delivery Pioneer

Retrieved on: 
Tuesday, January 16, 2024
Manufacturing, Senior, Socs, Silicon, Noise, IP, Synopsys, SAN, AI, Aquantia Corporation, Initial public offering, QCOM, ADAS, IPO, SNPS, ICS, Chiplet, General partnership, Advanced driver-assistance system, Growth, Management

"We are poised to lead the next generation in performance, scalability and efficiency in SoC power delivery applications."

Key Points: 
  • "We are poised to lead the next generation in performance, scalability and efficiency in SoC power delivery applications."
  • His appointment as CEO is expected to elevate Endura Technologies' go-to-market and growth.
  • His insights and experience in nurturing technology ventures will be invaluable in steering Endura Technologies' strategic direction.
  • Endura Technologies is leading this transformation by providing end-to-end SoC power delivery solutions, integrating their revolutionary, patented architectures, test silicon, design IP, design services, passive technology (inductors, capacitors, etc.)

Quanta and Ambarella Expand Strategic Partnership to Innovate Broader Range of Cutting-Edge AI Solutions

Retrieved on: 
Thursday, January 11, 2024
Senior, Socs, Process capability index, CV7, PCI Express, Architecture, Partnership, AI, Robotics, CES, Quanta Computer, Medical device

"We are excited to collaborate with Ambarella on CV3-AD, CV7 and N1-powered products that provide groundbreaking AI visual system solutions," said Alan Chai, Senior Vice president at Quanta.

Key Points: 
  • "We are excited to collaborate with Ambarella on CV3-AD, CV7 and N1-powered products that provide groundbreaking AI visual system solutions," said Alan Chai, Senior Vice president at Quanta.
  • "We are thrilled to expand our partnership with Quanta in delivering innovative AI technologies," said Fermi Wang, president and CEO of Ambarella.
  • Quanta and Ambarella are demonstrating and providing more details on their new AI Box and AI PCIe card joint solutions, at Ambarella’s invitation-only exhibition during CES in Las Vegas this week.
  • For more information about Quanta, please visit https://www.quantatw.com or reach out to the below Quanta media and sales contacts.

Ambarella Launches Comprehensive Edge AI Developer Platform

Retrieved on: 
Wednesday, January 10, 2024
Quanta, Socs, TensorFlow, Model, Metric prefix, Library, PyTorch, OS, Collection, Cooper Foundation, VVDN, AI, Linux, Ecosystem, Software, Exhibition, CES, Som, Video game

SANTA CLARA, Calif., Jan. 10, 2024 (GLOBE NEWSWIRE) -- Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced during CES the leading-edge Cooper™ Developer Platform.

Key Points: 
  • SANTA CLARA, Calif., Jan. 10, 2024 (GLOBE NEWSWIRE) -- Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced during CES the leading-edge Cooper™ Developer Platform.
  • Cooper offers seamless integration of software, hardware, state-of-the-art fine-tuned AI models, and services that provide universal support for Ambarella’s entire portfolio of AI systems-on-chip (SoCs).
  • In addition, the Cooper Developer Platform’s unified set of tools facilitates the creation of multi-chip systems using any Ambarella AI SoC.
  • By integrating these familiar industry-standard tools within the Cooper Developer Platform, developers can readily leverage the substantial associated online communities, making their edge AI app development and deployments easier than ever.

Ambarella Expands Autonomous Driving AI Domain Controller Family With Two New Members; Provides Broadest Software-Compatible AI Performance Range

Retrieved on: 
Tuesday, January 9, 2024
Cortex, Level 4, Socs, Family, BEV, SDK, DRAM, GPU, SOC, Partnership, NCAP, Perception, AI, Vision Zero, NN, Algorithm, ADAS, Software, Investment, Acceleration, Original equipment manufacturer, NNS, EV, CES, ARM Cortex-A53, Video game

Additionally, this is the automotive industry’s broadest performance range for any software-compatible AI domain control family, spanning an 18x AI performance increase from the CV72AQ to the CV3-AD685.

Key Points: 
  • Additionally, this is the automotive industry’s broadest performance range for any software-compatible AI domain control family, spanning an 18x AI performance increase from the CV72AQ to the CV3-AD685.
  • All SoCs in the CV3-AD family feature Ambarella’s CVflow® 3.0 AI accelerator.
  • As with the rest of this family, the CV3-AD635 and CV3-AD655 are fabricated in Samsung’s advanced 5nm automotive process technology.
  • Continental and Ambarella have received their first order as a complete Level 4 fallback system, covering the full chain of effects.

Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio

Retrieved on: 
Tuesday, January 9, 2024
Mobile, Wireless, Technology, Construction & Property, Semiconductor, Other Technology, Batteries, Hardware, IOT (Internet of Things), Other Construction & Property, Consumer Electronics, RF, Socs, SOC, Multimedia, QFN, Bluetooth Low Energy, Light, Automation, Thread, Internet of things, IEEE, Video game

Atmosic Technologies , an innovator of ultra-low-power wireless platforms for the Internet of Things (IoT), today unveiled the ATM34/e high-performance system-on-chip (SoC) series with multiprotocol support.

Key Points: 
  • Atmosic Technologies , an innovator of ultra-low-power wireless platforms for the Internet of Things (IoT), today unveiled the ATM34/e high-performance system-on-chip (SoC) series with multiprotocol support.
  • Building on the legacy of Atmosic’s innovative ATM3 and ATM33/e SoCs which support Bluetooth LE, the ATM34/e series adds support for IEEE 802.15.4 based protocols including Thread and Matter, as well as enhanced Bluetooth LE support for the latest 5.4 standard revision.
  • View the full release here: https://www.businesswire.com/news/home/20240109701448/en/
    Atmosic Technologies' new ATM34/e high-performance system-on-chip (SoC) series with multiprotocol support.
  • Both packages are pin-to-pin compatible with Atmosic’s ATM33/e series Bluetooth SoCs for customers looking to add 802.15.4 support without redesigning their product.

Cyware Appoints Alex Bender as Chief Marketing Officer

Retrieved on: 
Tuesday, January 9, 2024
Software, Networks, Internet, Marketing, Data Management, Communications, Technology, Security, Socs, RSA Security, Tripwire, Multimedia, Intelligence, RSA, Environment, CMO, SOAR, Organization, SVP, Growth, Risk management

Cyware, the leading provider of threat intelligence management, security collaboration, and cyber fusion solutions, is pleased to welcome security expert and marketing leader, Alex Bender, as its new Chief Marketing Officer.

Key Points: 
  • Cyware, the leading provider of threat intelligence management, security collaboration, and cyber fusion solutions, is pleased to welcome security expert and marketing leader, Alex Bender, as its new Chief Marketing Officer.
  • View the full release here: https://www.businesswire.com/news/home/20240109636361/en/
    With 22 years of cybersecurity marketing experience, Alex comes to Cyware after serving as the CMO of Invicti Security.
  • “Cyber fusion is a strategic reality that organizations are now implementing, and Cyware is leading the industry in cyber fusion solutions,” said Alex Bender.
  • Cyware stands uniquely poised to address these challenges, and I am excited to be on board.”
    Alex Bender will be leading all marketing functions including brand, corporate communications, product marketing, demand creation, demand capture, business development, partner and alliance marketing as well as corporate and field events.

Intel Drives ‘AI Everywhere’ into Automotive Market at CES

Retrieved on: 
Tuesday, January 9, 2024
Automotive Manufacturing, Semiconductor, Green Technology, Manufacturing, Vehicle Technology, Environment, Audio, Video, Automotive, EV, Electric Vehicles, Sustainability, Software, Artificial Intelligence, Hardware, Technology, Alternative Vehicles, Fuels, Alternative Energy, Energy, Engineering, Media, Silicon, Socs, Family, EVS, Intel, Credit, OEM, SDV, SOC, Chiplet, ACPI, Multimedia, Intelligence, MPS, Freedom, AI, ECU, Algorithm, Geely, Risk, Acquisition, Acceleration, PC, CES, HERE, SAE, Zeekr, SAE International

Intel Automotive introduced the SoC during a presentation on Tuesday, Jan. 9, 2024, at CES in Las Vegas.

Key Points: 
  • Intel Automotive introduced the SoC during a presentation on Tuesday, Jan. 9, 2024, at CES in Las Vegas.
  • Driving innovative AI solutions across the vehicle platform will help the industry navigate the transformation to EVs,” said Jack Weast, vice president and general manager of Intel Automotive.
  • Intel will work with imec to ensure the packaging technologies meet the rigorous quality and reliability requirements of the automotive industry.
  • The move underscores a commitment to be the first automotive supplier to support the integration of third-party chiplets into its automotive products.

Black Sesame Technologies and LeddarTech Collaborate to Provide High-Performance and Cost-Effective ADAS Solutions to Chinese and Global Automakers

Retrieved on: 
Wednesday, January 10, 2024
Socs, OEM, SOC, NCAP, Perception, Tesla Autopilot, ADAS, Level 3, Original equipment manufacturer, NOA, CES, SAE

Automotive OEMs and Tier 1s arrange a meeting with Black Sesame Technologies and LeddarTech at CES 2024 Las Vegas.

Key Points: 
  • Automotive OEMs and Tier 1s arrange a meeting with Black Sesame Technologies and LeddarTech at CES 2024 Las Vegas.
  • Automotive OEMs and Tier 1s arrange a meeting with Black Sesame Technologies and LeddarTech at CES 2024 Las Vegas.
  • To meet with Black Sesame Technologies or LeddarTech regarding other requirements:
    Schedule a meeting with the team of Black Sesame Technologies after your application is confirmed; please present the confirmation email to visit our booth.
  • Black Sesame Technologies' Meeting room is at W316, Level 3, West Hall, CES 2024, in Las Vegas.

Morse Micro and Zetifi Announce Next-Generation Remote-Area Connectivity Solution for Smart IoT Farming at CES 2024

Retrieved on: 
Wednesday, January 10, 2024
Socs, Silicon, Farm, IEEE 802.11ah, Hertz, Internet, Morse Micro, Farmer, HD, Radio, Partnership, Agriculture, Internet of things, Tree, Range, Marketing, IEEE, Mobile phone

"The Internet of Things is revolutionizing farming, and now Wi-Fi HaLow – the first version of Wi-Fi optimized for the IoT -- is helping Zetifi deliver on the promise of smart, connected farming technology," said Dan Winson, CEO and founder of Zetifi. "Our collaboration with Morse Micro is a defining moment in Zetifi's mission to bring digital advancements to modern farming through remote-area connectivity."

Key Points: 
  • Morse Micro's Wi-Fi HaLow technology will take Zetifi's farm-wide Wi-Fi connectivity with the ZetiCell and ZetiRover to a whole new level.
  • "The Internet of Things is revolutionizing farming, and now Wi-Fi HaLow – the first version of Wi-Fi optimized for the IoT -- is helping Zetifi deliver on the promise of smart, connected farming technology," said Dan Winson, CEO and founder of Zetifi.
  • "Our collaboration with Morse Micro is a defining moment in Zetifi's mission to bring digital advancements to modern farming through remote-area connectivity."
  • Morse Micro's Wi-Fi HaLow SoCs provide 10x the range, 100x the coverage area and 1000x the volume of traditional Wi-Fi solutions.

Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped

Retrieved on: 
Wednesday, January 10, 2024
Vizio, Socs, Silicon, Razer, Boat, IP, LAS, Sony, DSP, Artificial intelligence, SOC, IC, Noise, AI, CEVA, TCL, Original equipment manufacturer, Human, Actions Semiconductor, IPS, Inherit, Mobile phone

LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- CES 2024 -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, and Actions Technology Co, Ltd. ("Actions Space Technology"), the leading fabless semiconductor company of AIoT (Artificial Intelligence of Things) SoC, are celebrating a monumental achievement today, with Actions surpassing sales of more than 100 million wireless audio and AIoT chips powered by Ceva's audio, voice, AI sensing and wireless communications IPs.

Key Points: 
  • Actions Technology produces AIoT SoCs which power wireless audio, portable audio-visual, and edge AI processor applications.
  • Ceva and Actions Technology have collaborated closely in the fields of DSP and AI processing in the audio field and related wireless workloads.
  • Zhenyu Zhou, Chairman & CEO of Actions Technology, stated: "For the past decade, Actions Technology has been at the forefront of wireless audio innovation, thanks to our deep understanding of these technologies and our joint work with Ceva.
  • Surpassing 100 million Ceva-powered wireless audio chipsets shipped is an incredible achievement for our companies.