Toppan

Toppan Photomask Signs Agreement with IBM for Joint R&D on Semiconductor EUV Photomasks

Retrieved on: 
Wednesday, February 7, 2024
IBM, Growth, Research, Mask, Toppan, Miniaturization, ARF, EUV, Semiconductor, Printing

TOKYO, Feb. 6, 2024 /PRNewswire/ -- Toppan Photomask, the world's premier semiconductor photomask provider, announced that it has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. This agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.

Key Points: 
  • TOKYO, Feb. 6, 2024 /PRNewswire/ -- Toppan Photomask, the world's premier semiconductor photomask provider, announced that it has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography.
  • Based on this agreement, for a period of five years starting 1Q 2024, IBM and Toppan Photomask plan to develop photomask capability at the Albany NanoTech Complex (Albany, NY, USA) and Toppan Photomask's Asaka Plant (Niiza, Japan).
  • The IBM and Toppan Photomask agreement brings these essential material and process control skills together to provide commercial solutions for 2nm node and beyond printing.
  • From 2005 to 2015, IBM and Toppan Photomask (then Toppan Printing) jointly developed photomasks for advanced semiconductors.

HeartCore Signs Partnership Agreement with Toppan Inc.

Retrieved on: 
Wednesday, May 24, 2023
Maintenance, Partnership, CMS, Marketing, Yamamoto, Digital transformation, DX, Digital asset management, Sales, Toppan

NEW YORK and TOKYO, May 24, 2023 (GLOBE NEWSWIRE) -- HeartCore Enterprises, Inc. (Nasdaq: HTCR) (“HeartCore” or “the Company”), a leading software development company offering Customer Experience Management Platform (“CXM Platform”) and Digital Transformation (“DX”), has signed a partnership agreement with Toppan Inc. (“Toppan”) effective May 22, 2023.

Key Points: 
  • NEW YORK and TOKYO, May 24, 2023 (GLOBE NEWSWIRE) -- HeartCore Enterprises, Inc. (Nasdaq: HTCR) (“HeartCore” or “the Company”), a leading software development company offering Customer Experience Management Platform (“CXM Platform”) and Digital Transformation (“DX”), has signed a partnership agreement with Toppan Inc. (“Toppan”) effective May 22, 2023.
  • As part of the partnership agreement, HeartCore intends to strengthen and expand Toppan’s digital marketing business utilizing HeartCore’s Contents Management System (“CMS”), in addition to both companies collaborating on joint business ventures.
  • Toppan is a renowned Japanese global printing company that is aimed at strengthening its development system and expanding its digital marketing business.
  • Additionally, the collaboration between Toppan and HeartCore combines Toppan’s digital marketing know-how with HeartCore's technological prowess and development capabilities in the CMS field.

Hydrogen Fuel Cells for Electric Vehicles Global Patent Landscape 2022: German Automakers Lead the Charge on Hydrogen Fuel - ResearchAndMarkets.com

Retrieved on: 
Wednesday, October 26, 2022
Alternative Vehicles, Fuels, Manufacturing, Automotive, EV, Electric Vehicles, Chemicals, Plastics, Hydrogen, PEMFC, Transport, Toppan, Policy, CAGR, OEM, Toyota, Dongfeng Motor Corporation, Yutong, Carbon, Denso, Research, Electrode, AFC, LG, MCFC, Technology, Hitachi, SOFC, Samsung, Electrolyte, US, BMW, Ford Motor Company, Aisin, IP, Patent, Safety, Membrane, PAFC, Toray Industries, Weichai Group, Nippon Steel, Mitsubishi, SAIC Motor, Hyundai Kia R&D Museum, Toshiba, Renewable energy, Electric battery, Motor vehicle, Sumitomo Group, Nissan, Volkswagen Audi Group AMB Engine

The "Hydrogen Fuel Cells for Electric Vehicles Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Hydrogen Fuel Cells for Electric Vehicles Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.
  • Patent landscape analysis is a powerful tool to understand global hydrogen fuel cell electric vehicles competitive and technological environment.
  • have been active all along the value chain, from electrode materials and fuel cell stacks to system integration into vehicles.
  • ), stacking of fuel cells, fuel cell system, hydrogen storage, etc.

Toppan and Brookman Technology's Next-Generation Time-of-Flight Sensor Is World's First Capable of Measuring Distances of up to 30 Meters

Retrieved on: 
Thursday, June 16, 2022
Solution, CMOS, Time, Industry, Safety, World, Technology, Achievement, Electronics, Electrical engineering technology, Institute, VLSI Technology, Printing, Time of flight, Light, TYO, 3D, Acquisition, Shizuoka University, Communication, Multimedia, Electricity, Electrical engineering, Goal, Camera, Medical imaging, Satellite navigation device, Television, Telescopic sight, Toppan

TOKYO, June 16, 2022 /PRNewswire/ -- Toppan (TYO: 7911), a global leader in communication, security, packaging, décor materials, and electronics solutions, and Brookman Technology, Inc. (Brookman Technology), a Toppan subsidiary originating from Shizuoka University and engaged in the development and sales of CMOS image sensors, have collaborated on employing a hybrid Time-of-Flight (ToF) method[1] to develop a three-dimensional range image sensor (3D sensor) capable of measuring distances from one to 30 meters.

Key Points: 
  • The 3D sensor market is expected to expand as smartphones and game consoles become more sophisticated and the use of autonomous robots in industry grows.
  • Several different types of 3D sensor exist, based on the different principles used to detect distance.
  • ToF sensors estimate distance to an object by measuring the time it takes for emitted light to be reflected back.
  • As a ToF sensor with a conventional CMOS image sensor pixel structure that does not use an avalanche photodiode.

Sappi Casting and Release Announces New Laminate Surface With Superior Aesthetics, Texture and Performance: Arrio™

Retrieved on: 
Tuesday, April 26, 2022
Packaging, Other Manufacturing, Manufacturing, Wood, Awareness, Dissolving pulp, JSE, Mark (given name), Food, GA, Book, Industry, Partnership, Time, Release, Paint, Toppan, Sappi

Arrio, which offers a superior surface to conventional melamine in aesthetics and performance, is a perfect solution for decorative and functional surfaces on furniture, work surfaces, kitchen cabinetry and more.

Key Points: 
  • Arrio, which offers a superior surface to conventional melamine in aesthetics and performance, is a perfect solution for decorative and functional surfaces on furniture, work surfaces, kitchen cabinetry and more.
  • We are excited to introduce Arrio, which is not a mold that imparts texture, but is the actual finished surface, said Mark Hittie, Director of Release Strategy, Sappi Casting and Release.
  • Arrio comes from Sappis spirit and core competence: we make texture, we drive texture.
  • We are also one of the world's leading suppliers of Casting and Release Papers with our lines for the automotive, fashion and engineered films industries.

Toppan Carves Out Semiconductor Photomask Business to Launch New Company

Retrieved on: 
Friday, April 1, 2022
Investment, Growth, TYO, Integral, Communication, Artificial intelligence, Semiconductor, Solution, Electronics, Efficiency, IPO, Toppan

TOKYO, April 1, 2022 /PRNewswire/ -- Toppan (TYO: 7911), a global leader in communication, security, packaging, décor materials, and electronics solutions, has entered into a share transfer agreement to carve out its semiconductor photomask business and establish a new company, Toppan Photomask Co., Ltd. (Toppan Photomask), with independent Japanese private equity company Integral Corporation (Integral) as an investment partner. Toppan Photomask begins operations today as a joint venture between Toppan and Integral. The company will drive further growth and strengthen competiveness as an independent business entity that continues to support the rapidly growing semiconductor industry.

Key Points: 
  • TOKYO, April 1, 2022 /PRNewswire/ -- Toppan (TYO: 7911), a global leader in communication, security, packaging, dcor materials, and electronics solutions, has entered into a share transfer agreement to carve out its semiconductor photomask business and establish a new company, Toppan Photomask Co., Ltd. (Toppan Photomask), with independent Japanese private equity company Integral Corporation (Integral) as an investment partner.
  • Toppan Photomask begins operations today as a joint venture between Toppan and Integral.
  • The company will drive further growth and strengthen competiveness as an independent business entity that continues to support the rapidly growing semiconductor industry.
  • Since entering the photomask business in 1961, Toppan has continued to support growth of the semiconductor industry by deploying its advanced technological capabilities and expanding its manufacturing network from Japan to Asia, North America, and Europe.

Semiconductor And IC Packaging Material Market Is Expected to be worth Around USD 34.8 Billion By 2025 - Zion Market Research

Retrieved on: 
Thursday, September 16, 2021
Bachelor of Engineering, MG Cars, Semiconductor, Investment, Lead frame, BASF, QFN, Technology, CAGR, ICS, Dual in-line package, Voice recognition, Electronics, USD, DFN, Industry, DuPont, AC, Amkor Technology, Growth, Alent, IC, Toppan, MG, LG Chem, Hitachi, Henkel, Population, Sumitomo Chemical, SOP, Honeywell, Consumer electronics, Electronic component

According to the report, the global semiconductor and IC packaging material market was USD 25.6 billion in 2018 and is expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025.

Key Points: 
  • According to the report, the global semiconductor and IC packaging material market was USD 25.6 billion in 2018 and is expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025.
  • Growing R&D investments by numerous leading companies to develop better packaging materials and technologies is also driving the semiconductor and IC packaging material market.
  • However, difficulty in implementing new technologies and latest packaging materials in small companies might slow down the semiconductor and IC packaging material market.
  • This report segments the global semiconductor and IC packaging material market into:
    Global Semiconductor and IC Packaging Material Market: By Type

Semiconductor And IC Packaging Material Market Is Expected to be worth Around USD 34.8 Billion By 2025 - Zion Market Research

Retrieved on: 
Thursday, September 16, 2021
Bachelor of Engineering, MG Cars, Semiconductor, Investment, Lead frame, BASF, QFN, Technology, CAGR, ICS, Dual in-line package, Voice recognition, Electronics, USD, DFN, Industry, DuPont, AC, Amkor Technology, Growth, Alent, IC, Toppan, MG, LG Chem, Hitachi, Henkel, Population, Sumitomo Chemical, SOP, Honeywell, Consumer electronics, Electronic component

According to the report, the global semiconductor and IC packaging material market was USD 25.6 billion in 2018 and is expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025.

Key Points: 
  • According to the report, the global semiconductor and IC packaging material market was USD 25.6 billion in 2018 and is expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025.
  • Growing R&D investments by numerous leading companies to develop better packaging materials and technologies is also driving the semiconductor and IC packaging material market.
  • However, difficulty in implementing new technologies and latest packaging materials in small companies might slow down the semiconductor and IC packaging material market.
  • This report segments the global semiconductor and IC packaging material market into:
    Global Semiconductor and IC Packaging Material Market: By Type

Toppan Merrill Appoints New President

Retrieved on: 
Thursday, July 15, 2021
Publishing, Public relations, Investor relations, Marketing, Advertising, Communications, Finance, Toppan, Brokerage firms, Primary dealers, Subprime mortgage crisis, Merrill, Companies, Investment

and part of Toppan Inc. , the world's leading printing group, announced JoAnn Kern as the companys president.

Key Points: 
  • and part of Toppan Inc. , the world's leading printing group, announced JoAnn Kern as the companys president.
  • What matters most is for Toppan Merrill to strive to exceed our clients' expectations and help them achieve their goals.
  • Kern, who will assume the president role immediately, started at Toppan Merrill over 20 years ago and most recently held the role of Chief Financial Officer.
  • With global expertise in major capital markets, Toppan Merrill delivers unmatched service around the world.

Toppan Photomasks Receives Supplier Excellence Award from Texas Instruments

Retrieved on: 
Thursday, April 8, 2021
Companies, Toppan, Photomask, Texas Instruments, Industry economics), Economy of Japan

ROUND ROCK, Texas, April 8, 2021 /PRNewswire/ -- Toppan Photomasks, Inc. announced today that it has received the 2020 Supplier Excellence Award from Texas Instruments (TI).

Key Points: 
  • ROUND ROCK, Texas, April 8, 2021 /PRNewswire/ -- Toppan Photomasks, Inc. announced today that it has received the 2020 Supplier Excellence Award from Texas Instruments (TI).
  • The award recognizes the exceptional commitment and performance of an elite group that meets TI's high standards of excellence from its more than 12,000 suppliers.
  • Toppan Photomasks, Inc. is a wholly owned subsidiary of Toppan Printing Co., Ltd. a diversified global company with revenue in excess of US$13 billion in 2019.
  • Toppan Photomasks is part of the Toppan group of photomask companies.