TTM Technologies Speeds Up PCB Solder Mask Processing With Orbotech Neos™ 800 Additive Printing Solution
YAVNE, Israel, July 21, 2021 /PRNewswire/ -- Orbotech, a KLA (NASDAQ: KLAC) company, today announced that TTM Technologies, a global manufacturer of printed circuit boards and radio frequency components and assemblies, purchased and installed an Orbotech Neos™ 800, transforming the way solder mask is applied to PCBs. The recently available Orbotech Neos 800 inkjet solution replaces conventional solder mask (SM) processing with innovative additive SM printing. In this new installation, TTM cut the SM sequence by half compared to the existing conventional process, making it more efficient, reducing chemical waste and significantly cutting manufacturing turn-around time – an important capability in today's fast-moving electronics industry.
- The recently available Orbotech Neos 800 inkjet solution replaces conventional solder mask (SM) processing with innovative additive SM printing.
- TTM selected the Orbotech Neos 800 for its Stafford, Connecticut site following a rigorous testing and qualification program.
- "Additive printing of solder mask is a significant improvement for us, as it eliminates process steps compared to the way we typically apply solder mask.
- At the core of the Orbotech Neos are two proprietary technologies: the new Structural Printing Technology, enabling 3D-like quality printing, and the field-proven DotStream Pro Technology,enabling precise solder mask printing at high speeds.