Soitec

STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology

Retrieved on: 
Thursday, December 1, 2022

The goal of this cooperation is the adoption by ST of Soitecs SmartSiC technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm.

Key Points: 
  • The goal of this cooperation is the adoption by ST of Soitecs SmartSiC technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm.
  • The goal of the technology cooperation with Soitec is to continue to improve our manufacturing yields and quality.
  • The combination of Soitecs SmartSiC substrates with STMicroelectronics industry-leading silicon carbide technology and expertise is a game-changer for automotive chip manufacturing that will set new standards.
  • SmartSiC is a proprietary Soitec technology which uses Soitec proprietary SmartCut technology, to split a thin layer of a high quality SiC donor wafer,and bond it on top of a low resistivity handle polySiC wafer.

Paul Boudre appointed chairman of UnitySC

Retrieved on: 
Friday, September 23, 2022

MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.

Key Points: 
  • MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.
  • Paul Boudre was the CEO of Soitec [EPA:SOI], a world leader in silicon-on-insulator (SOI) design and manufacturing, from September 2015 to July 2022.
  • Paul Boudre also serves on the boards of directors of the Association for European NanoElectronics Activities (AENEAS) and the semiconductors company Alphawave IP Groupe.
  • Paul Boudre holds a graduate degree in chemistry from Ecole Nationale Suprieure de Chimie in Toulouse, France.

Paul Boudre appointed chairman of UnitySC

Retrieved on: 
Friday, September 23, 2022

MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.

Key Points: 
  • MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.
  • Paul Boudre was the CEO of Soitec [EPA:SOI], a world leader in silicon-on-insulator (SOI) design and manufacturing, from September 2015 to July 2022.
  • Paul Boudre also serves on the boards of directors of the Association for European NanoElectronics Activities (AENEAS) and the semiconductors company Alphawave IP Groupe.
  • Paul Boudre holds a graduate degree in chemistry from Ecole Nationale Suprieure de Chimie in Toulouse, France.

Global Silicon Carbide in High Voltage Applications Market (2022 to 2027) - Players Include Sumitomo Electric Industries, Mitsubishi Chemicals and Kyocera - ResearchAndMarkets.com

Retrieved on: 
Wednesday, June 22, 2022

The global semiconductor material for harsh environment market is expected to grow with a CAGR of 7% to 9% from 2022 to 2027.

Key Points: 
  • The global semiconductor material for harsh environment market is expected to grow with a CAGR of 7% to 9% from 2022 to 2027.
  • Sumitomo Electric Industries, Mitsubishi Chemicals, Kyocera, GaN Systems, Sciocs, Toshiba, and Soitec are among the major material suppliers for the semiconductor harsh environment applications.
  • The study includes trends and forecast for the global semiconductor material for harsh environment market by material, application, end use, and region.
  • Q.11 What M&A activities did take place in the last five years in the semiconductor material for harsh environment market?

Silicon Carbide (SiC) Patent Landscape Report 2022: Market Revenues Exceeded $1Billion in 2021 - Market is Growing Fast, Driven by the Adoption of SiC Technology in Electric Vehicle (EV) Applications

Retrieved on: 
Wednesday, June 15, 2022

DUBLIN, June 15, 2022 /PRNewswire/ --The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, June 15, 2022 /PRNewswire/ --The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.
  • The Silicon Carbide (SiC) power device market is growing fast, driven by the adoption of SiC technology in electric vehicle (EV) applications.
  • In this context, the publisher is releasing a new patent landscape report which aims to provide a comprehensive view of the power SiC patent landscape along the whole supply chain/value chain (bulk SiC & bare SiC wafers, epitaxial SiC substrates, SiC devices, SiC modules and circuits).
  • ), priority date, title, abstract, patent assignees, patent's current legal status, and segments (bulk SiC, epitaxial SiC substrates, SiC diodes, planar SiC MOSFETs, trench SiC MOSFETs, SiC modules, circuits, etc.).

Silicon Carbide (SiC) Patent Landscape 2022: Focus on the Top IP Players' Patent Portfolios - ResearchAndMarkets.com

Retrieved on: 
Tuesday, June 14, 2022

The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Silicon Carbide (SiC) Patent Landscape 2022" report has been added to ResearchAndMarkets.com's offering.
  • The Silicon Carbide (SiC) power device market is growing fast, driven by the adoption of SiC technology in electric vehicle (EV) applications.
  • What's more, the technology coverage along the value chain and the geographical coverage of the patent portfolios are narrowly related to the business strategy of IP players.
  • Although historical IP players (Wolfspeed, SiCrystal, II-VI) keeps filing new patents, indicating a continuous improvement of their technology, Sumitomo Electric and Showa Denko took the IP leadership in the SiC substrate patent landscape.

Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications

Retrieved on: 
Friday, April 8, 2022

Semiconductors and FD-SOI innovation are of strategic value to France and the EU as well as to customers globally.

Key Points: 
  • Semiconductors and FD-SOI innovation are of strategic value to France and the EU as well as to customers globally.
  • FD-SOI offers substantial benefits for designers and customer systems including lower power consumption as well as easier integration of additional features such as connectivity and security, a key feature for automotive, IoT and mobile applications.
  • CEA has been, for over 20 years, a pioneer of the FD-SOI technology, within the Grenoble-Crolles ecosystem.
  • Together with our partners and allies, we want to confirm our technological leadership and continue to drive innovation in global microelectronics.

Small/Mid-size Semiconductor Equipment Markets and Strategies Report 2021

Retrieved on: 
Tuesday, June 1, 2021

DUBLIN, June 1, 2021 /PRNewswire/ -- The "Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies" report from The Information Network has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, June 1, 2021 /PRNewswire/ -- The "Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies" report from The Information Network has been added to ResearchAndMarkets.com's offering.
  • In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete.
  • In Chapter 2 we identify high-tech applications that are fabricated on 300mm wafers.
  • In Chapter 3 we discuss high-tech applications that are built on non- 300mm wafers.

Global $850+ Million Silicon on Insulator (RF-SOI, FD-SOI, Power SOI, Others) Markets, 2015-2020 & 2020-2025

Retrieved on: 
Tuesday, May 18, 2021

The importance of RF-SOI wafer types for semiconductor devices, wireless communication will drive the market.\nAmong the Technology in the Silicon on Insulator market (SIMOX, BESOI, Smart Cut and Others), Smart Cut technology is very popular and is expected to keep growing in the forecast period.

Key Points: 
  • The importance of RF-SOI wafer types for semiconductor devices, wireless communication will drive the market.\nAmong the Technology in the Silicon on Insulator market (SIMOX, BESOI, Smart Cut and Others), Smart Cut technology is very popular and is expected to keep growing in the forecast period.
  • Automotive is one of the largest application of SOI technology and demand of SOI wafers in vehicles and hybrid technology among automobile manufacturers across globe which will keep increasing in future.\nThe APAC market is expected to lead the global market throughout the forecasted period.
  • Also, the major opportunities, trends, drivers and challenges of the industry has been analysed in the report.\nThe report tracks competitive developments, strategies, mergers and acquisitions and new product development.
  • The companies analysed in the report include Soitec, Shin-Etsu Chemical, Globalwafers, SUMCO, Globalfoundries, TowerJazz, STMicroelectronics, NXP Semiconductors, SIMGUI, Silicon Valley Microcontrollers and Murata Manufacturing.\nThe report analyses the impact of Covid-19 on Silicon on Insulator market.\nThe report presents the analysis of Silicon on Insulator market for the historical period of 2015-2019 and the forecast period of 2020-2025.\n'

AXT, Inc. Supplies First 8-Inch Gallium Arsenide Wafers to Major Customer

Retrieved on: 
Wednesday, April 28, 2021

b'FREMONT, Calif., April 28, 2021 (GLOBE NEWSWIRE) -- AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrate wafers, today announced that is has developed and shipped its first 8-inch diameter gallium arsenide (GaAs) substrates to a major customer.

Key Points: 
  • b'FREMONT, Calif., April 28, 2021 (GLOBE NEWSWIRE) -- AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrate wafers, today announced that is has developed and shipped its first 8-inch diameter gallium arsenide (GaAs) substrates to a major customer.
  • \xe2\x80\x9cEvery step up in diameter size comes with a major increase in the technical challenge of producing it.
  • Further, the material quality of our first wafers demonstrates our commitment to excellence and the differentiation of our VGF crystal growth process.
  • The company\xe2\x80\x99s substrate wafers are used when a typical silicon substrate wafer cannot meet the performance requirements of a semiconductor or optoelectronic device.