Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.
- Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.
- The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.
- Eliyan's chiplet interconnect technology achieves up to 4x the performance and half the power of other solutions.
- The company's NuLink PHY, proven on advanced process nodes, addresses both Die-to-Die and Die-to-Memory interconnect with its highly efficient performance metrics.