Electronic packaging

MKS Instruments Reports Second Quarter 2023 Financial Results

Retrieved on: 
Wednesday, August 2, 2023
Eastern Time Zone, MKS Instruments, MKS, GAAP, PC, Acquisition, MKSI, Virtual reality, Electronic packaging, Video game, Electronics, Atotech

Semiconductor market revenue of $440 million, up 42% sequentially and above high end of guidance

Key Points: 
  • Semiconductor market revenue of $440 million, up 42% sequentially and above high end of guidance
    GAAP net loss per share of $26.47, which includes goodwill and intangible asset impairments
    Non-GAAP net earnings per diluted share of $1.32, above the midpoint of guidance
    ANDOVER, Mass., Aug. 02, 2023 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today reported second quarter 2023 financial results.
  • “We delivered strong results in the second quarter, led by solid execution and disciplined cost management,” said John T.C.
  • A conference call with management will be held on Thursday, August 3, 2023 at 8:00 a.m. (Eastern Time).
  • A live and archived webcast and related presentation materials will be available on the Investor Relations section of the MKS website.

MKS Presents Long-Term Strategy and Financial Outlook at 2022 Analyst Day Event

Retrieved on: 
Wednesday, December 14, 2022
Acquisition, Electronics, MKS, MKS Instruments, Wafer fabrication, Chemistry, Electronic packaging, Webcast, Miniaturization, Engineering, Ecosystem, WFE, Energy Independence and Security Act of 2007, Growth, Risk, Senior, COVID-19, Vacuum, Instrumentation, Online shopping, Risk management, Atotech

ANDOVER, Mass., Dec. 14, 2022 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, announced that it will share its long-term strategy and financial outlook today at its 2022 Analyst Day.

Key Points: 
  • ANDOVER, Mass., Dec. 14, 2022 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, announced that it will share its long-term strategy and financial outlook today at its 2022 Analyst Day.
  • The event is being hosted in Boston and via webcast at 9:00 a.m. Eastern Standard Time today.
  • “MKS has evolved into a foundational enabler of the technology applications that we rely on every day,” said Mr. Lee.
  • An archived webcast of the presentations will be available approximately one hour following the completion of the event at https://investor.mks.com/events-and-presentations .

North America Polycarbonate for Electrical and Electronics Market Analysis & Segment Forecasts, 2021-2028 - ResearchAndMarkets.com

Retrieved on: 
Wednesday, December 1, 2021
Chemicals, Plastics, Manufacturing, Electricity, Ford Motor Company, Industry, Housing, CAGR, Electronics, IBM Storwize, Video, USD, Original equipment manufacturer, LED, EVS, Chapter Four, Electronic packaging, Chapter Five, PC, Film, Glass, EV, Thermoplastic, Airline

The "North America Polycarbonate For Electrical and Electronics Market 2021-2028 by IT Electronics, Electrical Enclosures" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "North America Polycarbonate For Electrical and Electronics Market 2021-2028 by IT Electronics, Electrical Enclosures" report has been added to ResearchAndMarkets.com's offering.
  • The North America polycarbonate for electrical and electronics market size is anticipated to reach USD 1.06 billion by 2028, growing at a CAGR of 3.7%
    The product usage in the electrical and electronics market is anticipated to grow due to a rise in the automotive and construction industries in North American countries.
  • North America Polycarbonate for Electrical and Electronics Market: End - Use Estimates & Trend Analysis
    Chapter 5.
  • North America Polycarbonate for Electrical & Electronics Market: Country Estimates & Trend Analysis

Global Industry Analysts Predicts the World Electronic Packaging Market to Reach $2.7 Billion by 2026

Retrieved on: 
Thursday, October 7, 2021
EAS, RFID, Geography, SAN, GIA, CAGR, COVID-19, Marketing, Growth, BASF SE, Internet, Players, Forecasting, BASF, Intelligence, Electronic, Electronic packaging, SE, Research, Pet

SAN FRANCISCO, Oct. 7, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Electronic Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Oct. 7, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Electronic Packaging - Global Market Trajectory & Analytics" .
  • Geographies:World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
  • Preview Registry
    Amid the COVID-19 crisis, the global market for Electronic Packaging estimated at US$996.8 Million in the year 2020, is projected to reach a revised size of US$2.7 Billion by 2026, growing at a CAGR of 18.1% over the analysis period.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Global Semiconductor and IC Packaging Material Market Report 2021 Featuring Profiles of Hitachi Chemical, BASF SE, Henkel AG & Co, Sumitomo Chemical, Alent, and Kyocera Chemical - ResearchAndMarkets.com

Retrieved on: 
Thursday, February 18, 2021
Technology, Packaging, Semiconductor, Manufacturing, Paint manufacturers, Economy of Germany, Companies, Secondary sector of the economy, Henkel, SEMI, Semiconductor, BASF, Electronic packaging

The "Technology Landscape, Trends and Opportunities in the Global Semiconductor and IC Packaging Material Market" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Technology Landscape, Trends and Opportunities in the Global Semiconductor and IC Packaging Material Market" report has been added to ResearchAndMarkets.com's offering.
  • Increasing demand for consumer electronics and increasing R&D by key players towards making the electronic packaging materials are creating new opportunities for various semiconductor and IC packaging material technologies.
  • This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the semiconductor and IC packaging material market.
  • Some of the semiconductor and IC packaging material companies profiled in this report include Hitachi Chemical, BASF SE, Henkel AG & Company, Sumitomo Chemical, Alent, and Kyocera Chemical.

$4.3 Billion Hermetic Packaging Market with COVID-19 Impact Analysis - Global Forecast to 2025 - ResearchAndMarkets.com

Retrieved on: 
Monday, October 19, 2020
Packaging, Manufacturing, Packaging, Labels, Packaging and labeling, Product management, Ceramic capacitor, Integrated circuit packaging, Hermetic, Seal, Articles, Electronic packaging, Product, Economy

The "Hermetic Packaging Market with COVID-19 impact by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Region - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Hermetic Packaging Market with COVID-19 impact by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Region - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.
  • The growth of this market is attributed to the increasing use of hermetic packaging for protecting highly sensitive electronic components and increasing demand from industries such as aerospace and automotive electronics.
  • However, factors such as stringent leak requirements for hermetic packaging and supply chain disruptions due to the COVID-19 pandemic are expected to restrain the market growth.
  • The foreseeable decline in the growth of end-user industries may have a considerable direct impact on the hermetic packaging market.

Global Semiconductor and IC Packaging Material Market Analysis 2020-2024, Featuring Key Players Hitachi Chemical, BASF SE, Henkel AG & Company, Sumitomo Chemical, Alent and Kyocera Chemical

Retrieved on: 
Friday, June 12, 2020
Packaging, Inventions, Semiconductor device fabrication, Technology, Economy, Integrated circuit packaging, Semiconductor, Packaging and labeling, Integrated circuit, Electronic packaging, Henkel, SEMI

Technologies in semiconductor and IC packaging materials have undergone significant change in recent years, with traditional dual in line packaging to advanced integrated circuit packaging.

Key Points: 
  • Technologies in semiconductor and IC packaging materials have undergone significant change in recent years, with traditional dual in line packaging to advanced integrated circuit packaging.
  • Increasing demand for consumer electronics and increasing R&D by key players towards making the electronic packaging materials are creating new opportunities for various semiconductor and IC packaging material technologies.
  • This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the semiconductor and IC packaging material market.
  • The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global semiconductor and IC packaging material technology by application, technology, and the region as follows:
    Some of the semiconductor and IC packaging material companies profiled in this report include Hitachi Chemical, BASF SE, Henkel AG & Company, Sumitomo Chemical, Alent, and Kyocera Chemical.

StratEdge Features Its High-frequency, High-power Semiconductor Packages and Assembly Services at Three Trade Shows in March

Retrieved on: 
Tuesday, February 25, 2020
Other Manufacturing, Technology, Packaging, Semiconductor, Engineering, Other Technology, Manufacturing, Hardware, Electronic design automation, Physical sciences, Chemistry, Semiconductor devices, Ceramic, Integrated circuit, Gallium, Semiconductors, LED lamps, Electronic packaging

Off-the-shelf molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz.

Key Points: 
  • Off-the-shelf molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz.
  • These packages provide enhanced thermal dissipation for high-power gallium nitride devices and come in fully hermetic versions in over 200 standard outlines.
  • The packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies.
  • StratEdge has developed a proprietary eutectic die attach method that drops junction temperatures by 20 degrees when compared to standard assembly methods with ceramic packages.

The global potting compounds market was valued at $2,904.2 million in 2017, and it is expected to reach $3,836.5 million by the end of 2025, growing at CAGR of 3.6% from 2018 to 2025

Retrieved on: 
Tuesday, September 24, 2019
Electronics manufacturing, Electronic design, Potting, Design, Engineering, Human activities, Electronic packaging

Potting compounds are used as encapsulants to protect electronic components and equipment from water, chemical chock, voltage discharge, vibration, and physical damage.

Key Points: 
  • Potting compounds are used as encapsulants to protect electronic components and equipment from water, chemical chock, voltage discharge, vibration, and physical damage.
  • Potting process can be performed either manually or by using automated meter-mix-dispense (MMD) equipment.
  • With this the need for protecting the components also increase, thereby driving the potting compounds market.
  • The global potting compounds market is segmented into resin type, curing techniques, application, end user, and region.

Global Outlook on the Potting Compounds Market (2018-2022) - Increased Demand for Better Barrier Protection

Retrieved on: 
Thursday, July 5, 2018
Electronics manufacturing, Electronic design, Potting, Electric arc, Electromagnetism, Electronic packaging

The "Global Potting Compounds Market 2018-2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Potting Compounds Market 2018-2022" report has been added to ResearchAndMarkets.com's offering.
  • The Global Potting Compounds Market is forecast to grow at a CAGR of 3.77% during the period 2018-2022.
  • According to the report, one driver influencing this market is the increased demand for better barrier protection.
  • The increased use of potting compounds for curing and encapsulation of electronics and electricals for offering protection from moisture, chemicals, shock, voltage, discharge, and physical damage is boosting the market growth in the recent years.