Heat sink

Kingston FURY Updates Award-Winning SSD to Include Heatsink Option

Retrieved on: 
Monday, November 14, 2022
Entertainment, Semiconductor, Consumer Electronics, Technology, Electronic Games, Hardware, PCI Express, PS5, Gen4 Energy, Personal computer, Multimedia, Temperature, Gen, Graphics processing unit, Central processing unit, Heat sink, Family, NVM Express, SSD, TB, Video game console

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of Kingston FURY Renegade SSD with Heatsink , its second-generation PCIe 4.0 NVMe M.2 drive for console and PC gamers.

Key Points: 
  • Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of Kingston FURY Renegade SSD with Heatsink , its second-generation PCIe 4.0 NVMe M.2 drive for console and PC gamers.
  • Kingston FURY Renegade SSD with Heatsink maintains speed and temperature while delivering cutting-edge performance in high capacities using the latest Gen 4x4 controller.
  • Kingston FURY Renegade SSD with Heatsink, the ultimate in aesthetics with an additional layer of thermal dispersion, so when the game heats up, your PS5 console stays cool.
  • The design of the Kingston FURY Renegade SSD pushes the limits of PCIe Gen4 technology to provide users with high-performance storage to complement the latest CPUs and GPUs with unbound storage, said Keith Schimmenti, SSD business manager, Kingston.

IDTechEx Reveals How Key Data Center Trends Impact Thermal Interface Materials

Retrieved on: 
Wednesday, June 16, 2021
Thermodynamics, Heat transfer, Heat exchangers, Passive fire protection, Transport phenomena, Temperature, Heating, ventilation, and air conditioning, Immersion cooling, Thermal interface material, Thermal management, Heat sink, Thermal paste

A key area for data centers is thermal management; most data centers rely on air-conditioned rooms and large heat sinks for the individual components.

Key Points: 
  • A key area for data centers is thermal management; most data centers rely on air-conditioned rooms and large heat sinks for the individual components.
  • Power consumption is always a big concern for data centers and IDTechEx expects to see more passively cooled centers, leading to a more careful selection of thermal materials.
  • Direct liquid cooling or even immersion cooling is seeing some greater interest in recent years but regardless of the overall thermal strategy adopted, the considerations around thermal interface materials (TIMs) are crucial.
  • The new report from IDTechEx, " Thermal Interface Materials 2021-2031: Technologies, Markets and Opportunities " considers the forms and compositions of TIMs, benchmarks commercial products, and details new advanced materials.

IDTechEx Reveals How Key Data Center Trends Impact Thermal Interface Materials

Retrieved on: 
Wednesday, June 16, 2021
Thermodynamics, Heat transfer, Heat exchangers, Passive fire protection, Transport phenomena, Temperature, Heating, ventilation, and air conditioning, Immersion cooling, Thermal interface material, Thermal management, Heat sink, Thermal paste

A key area for data centers is thermal management; most data centers rely on air-conditioned rooms and large heat sinks for the individual components.

Key Points: 
  • A key area for data centers is thermal management; most data centers rely on air-conditioned rooms and large heat sinks for the individual components.
  • Power consumption is always a big concern for data centers and IDTechEx expects to see more passively cooled centers, leading to a more careful selection of thermal materials.
  • Direct liquid cooling or even immersion cooling is seeing some greater interest in recent years but regardless of the overall thermal strategy adopted, the considerations around thermal interface materials (TIMs) are crucial.
  • The new report from IDTechEx, " Thermal Interface Materials 2021-2031: Technologies, Markets and Opportunities " considers the forms and compositions of TIMs, benchmarks commercial products, and details new advanced materials.

ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage

Retrieved on: 
Monday, March 29, 2021
Computer storage devices, Computer data storage, Computer buses, Passive fire protection, Non-volatile memory, Solid-state drive, NVM Express, Thermally conductive pad, Thermal management, U.2, Heat sink, Low-density parity-check code

The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities.

Key Points: 
  • The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities.
  • Both come with advanced Power Loss Protection (PLP), Low Density Parity Check (LDPC) ECC algorithm, RAID engine support, and end-to-end data path protection.
  • Most SSDs are equipped with a thermal throttling mechanism, which cools the device by reducing the clock speed when a certain temperature is reached.
  • By combining both hardware and firmware solutions, ATP NVMe SSDs with the customizable Thermal Management Solution delivers higher sustained write performance compared with standard thermal throttling, which causes performance to drop drastically.

Scientists of NUST MISIS Developed an Efficient Way to Produce Low-Cost Heatsinks

Retrieved on: 
Thursday, December 10, 2020
National University of Sciences & Technology, National University of Science and Technology, Zimbabwe, Composite material, Heat sink, Thermodynamics, Transport phenomena

MOSCOW, Dec. 10, 2020 /PRNewswire/ -- NUST MISIS scientists found a way to reduce the cost of industrial and electronics heatsinks production up to 10 times.

Key Points: 
  • MOSCOW, Dec. 10, 2020 /PRNewswire/ -- NUST MISIS scientists found a way to reduce the cost of industrial and electronics heatsinks production up to 10 times.
  • Scientists from NUST MISIS Center for Composite Materials found a way to significantly reduce the manufacturing cost of heat sinks.
  • Next, the mass is placed in a special press-form, where it is shaped in a desired way.
  • That is, it can be used both in industry and in electronics," comments Andrey Stepashkin, researcher at NUST MISIS Center for Composite Materials.

Scientists of NUST MISIS Developed an Efficient Way to Produce Low-Cost Heatsinks

Retrieved on: 
Thursday, December 10, 2020
National University of Sciences & Technology, National University of Science and Technology, Zimbabwe, Composite material, Heat sink, Thermodynamics, Transport phenomena

MOSCOW, Dec. 10, 2020 /PRNewswire/ -- NUST MISIS scientists found a way to reduce the cost of industrial and electronics heatsinks production up to 10 times.

Key Points: 
  • MOSCOW, Dec. 10, 2020 /PRNewswire/ -- NUST MISIS scientists found a way to reduce the cost of industrial and electronics heatsinks production up to 10 times.
  • Scientists from NUST MISIS Center for Composite Materials found a way to significantly reduce the manufacturing cost of heat sinks.
  • Next, the mass is placed in a special press-form, where it is shaped in a desired way.
  • That is, it can be used both in industry and in electronics," comments Andrey Stepashkin, researcher at NUST MISIS Center for Composite Materials.

Global Thermal Interface Materials Market By Products, By Applications, By Region, Industry Analysis and Forecast, 2020 - 2026

Retrieved on: 
Monday, August 24, 2020
Physical sciences, Thermodynamics, Natural sciences, Heat transfer, Thermal interface material, Thermal conductivity, Thermal paste, Heat sink, Interfacial thermal resistance

The materials with high thermal conductivity are termed as thermal interface materials (TIMs).

Key Points: 
  • The materials with high thermal conductivity are termed as thermal interface materials (TIMs).
  • By replacing the thermally insulating air and the voids present between the surfaces, thermal interface materials are used as the second thermal conductive material.
  • Therefore, thermal interface materials play an important role in the electronics industry as these materials have effective heat transferring property.
  • The new site would produce both thermal interface materials for automotive and electronic applications and emulsions for the personal care market.

Thermal Management Market worth $12.8 billion by 2025 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, July 23, 2020
Passive fire protection, Thermodynamics, Heat transfer, Physical sciences, Heat exchangers, Heating, ventilating, and air conditioning, Transport phenomena, Electronic design, Thermal management, Heat sink, Refrigerant, Coolant

The growth of the thermal management market is fueled by rising demand for effective thermal management solutions and systems for use in consumer electronics, increasing use of electronic devices in different end-use industries, and ongoing radical miniaturization of electronic.

Key Points: 
  • The growth of the thermal management market is fueled by rising demand for effective thermal management solutions and systems for use in consumer electronics, increasing use of electronic devices in different end-use industries, and ongoing radical miniaturization of electronic.
  • Moreover, factors such as technological advancements in synthetic cooling systems and interface materials, advent of cool chips for thermal management in electronic devices, and the increasing demand for natural refrigerants play an important role in driving the growth of the market.
  • In 2019, the nonadhesive thermal management material segment accounted for the largest share of the thermal management market.
  • In this process, servers are immersed in a nonreactive fluid or coolant for thermal cooling, thus eliminating the requirement for heat fans and heat sinks.

Thermal Management Market worth $12.8 billion by 2025 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, July 23, 2020
Passive fire protection, Thermodynamics, Heat transfer, Physical sciences, Heat exchangers, Heating, ventilating, and air conditioning, Transport phenomena, Electronic design, Thermal management, Heat sink, Refrigerant, Coolant

The growth of the thermal management market is fueled by rising demand for effective thermal management solutions and systems for use in consumer electronics, increasing use of electronic devices in different end-use industries, and ongoing radical miniaturization of electronic.

Key Points: 
  • The growth of the thermal management market is fueled by rising demand for effective thermal management solutions and systems for use in consumer electronics, increasing use of electronic devices in different end-use industries, and ongoing radical miniaturization of electronic.
  • Moreover, factors such as technological advancements in synthetic cooling systems and interface materials, advent of cool chips for thermal management in electronic devices, and the increasing demand for natural refrigerants play an important role in driving the growth of the market.
  • In 2019, the nonadhesive thermal management material segment accounted for the largest share of the thermal management market.
  • In this process, servers are immersed in a nonreactive fluid or coolant for thermal cooling, thus eliminating the requirement for heat fans and heat sinks.

Hyve Solutions and Cooler Master Double Density of Compute Racks

Retrieved on: 
Tuesday, May 12, 2020
Technology, Digital technology, Articles, Computer industry, Digital media, Technology strategy, Passive fire protection, Hyperscale computing, Synnex, Cooler Master, Heat sink

The density of computing racks is limited by the size and thermal capability of the cooling solution and is placing constraints on the compute capacity of hyperscale racks.

Key Points: 
  • The density of computing racks is limited by the size and thermal capability of the cooling solution and is placing constraints on the compute capacity of hyperscale racks.
  • The Hyve and Cooler Master solution allows for the doubling of compute power while occupying the same heat sink footprint of air-cooled counterparts.
  • "Collaborating with Cooler Master is an important step for Hyve Solutions and positions us to better serve new and existing customers seeking high density hyperscale systems with advanced thermal capabilities," said Steve Ichinaga, President, Hyve Solutions and Hyve Design Solutions.
  • "We are excitedto continue to workwith Hyve Solutions to push the performance of high density hyperscale computing offerings with our leading-edge liquid cooling technology," saysIvan Chiu,General Manager of Customer Focus Teams, Cooler Master Corporation.