SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
- WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
- “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
- “SK hynix is the global pioneer and dominant market leader in memory chips for AI,” Purdue President Mung Chiang said.
- This historic announcement is the next step in Purdue University’s persistent pursuit of semiconductor excellence as part of the Purdue Computes initiative.