ACM Research Introduces Thin Wafer Cleaning System for High-volume Power Semiconductor Device Manufacturing
The system is intended for the manufacture of both MOSFET and insulated-gate bipolar transistor (IGBT) devices for the power semiconductor market, and features complete touch-free handling and processing based on the Bernoulli effect to eliminate possible wafer damage and improve final device yield.
- The system is intended for the manufacture of both MOSFET and insulated-gate bipolar transistor (IGBT) devices for the power semiconductor market, and features complete touch-free handling and processing based on the Bernoulli effect to eliminate possible wafer damage and improve final device yield.
- ACMs Thin Wafer Cleaning System has been designed to meet manufacturers needs.
- ACM delivered its first Thin Wafer Cleaning System to a China-based analog/power semiconductor manufacturer in the second quarter of 2020, with revenue recognition subject to qualification and acceptance.
- ACM develops, manufactures and sells semiconductor process equipment for single wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes critical to advanced semiconductor device manufacturing, as well as wafer-level packaging.