Digital signal processing

Spectra7 to Demonstrate 800Gbps Active Copper Interconnects with Arista, Cisco and Other Leading Ethernet Alliance Members at OFC

Retrieved on: 
Tuesday, March 26, 2024
Ethernet Alliance, Communication, OSFP, Conference, The Company, DSP, Wire, Digital signal processing, Broadcom Inc., SAN, Cisco, Arista, AOCS, San Diego Convention Center, ACC, Digital signal

SAN DIEGO, March 26, 2024 /PRNewswire/ -- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be demonstrating 800Gbps Active Copper Cable (ACC) interconnects connecting with Arista, Cisco and other leading equipment makers at the 2024 Optical Fiber Communication Conference and Exhibition (OFC). The demonstration will be in the Ethernet Alliance booth #1415. The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.

Key Points: 
  • The demonstration will be in the Ethernet Alliance booth #1415.
  • The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.
  • Spectra7 will be demonstrating 800Gbps OSFP ACC interconnects with Arista's TH5/X93160 Ethernet switch based on Broadcom's newest Tomahawk 5 switch chip as well as 800G QSFP-DD ACC interconnects with Cisco's 64 port switch based on their own SiliconOne switch chip.
  • In total Spectra7 will have six 800Gbps ACC interconnects in the demo connecting a wide range of switches, routers and test equipment.

Spectra7 to Participate in Ethernet Alliance Multivendor 800Gbps Demonstration at OFC

Retrieved on: 
Tuesday, March 19, 2024
Ethernet Alliance, Communication, OSFP, Conference, The Company, DSP, Wire, Digital signal processing, SAN, AOCS, Ethernet, San Diego Convention Center, ACC, Digital signal

SAN JOSE, Calif., March 19, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be participating in the Ethernet Alliance 800Gbps demonstration at booth #1415 during the 2024 Optical Fiber Communication Conference and Exhibition (OFC). The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.

Key Points: 
  • SAN JOSE, Calif., March 19, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be participating in the Ethernet Alliance 800Gbps demonstration at booth #1415 during the 2024 Optical Fiber Communication Conference and Exhibition (OFC).
  • The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.
  • Spectra7 will be demonstrating 800Gbps QSFP-DD and OSFP Active Copper Cable (ACC) interconnects with industry-leading Ethernet Alliance members.
  • The demo incorporates a wide range of switches, routers and test equipment.

Spectra7 and ACES Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects

Retrieved on: 
Wednesday, February 7, 2024
SAN, Digital signal processing, DSP, Electronics, Exhibition, The Company, Wire, AOCS, ACES, ACC, Digital signal, OSFP, Conference, Printed circuit board

SAN JOSE, Calif., Feb. 7, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and ACES Electronics Co., Ltd ("ACES"), a leading Taiwan-based connector and cable supplier, announced that they successfully demonstrated best-in-class performance of 800G Active Copper Cables (ACC's) at this year's annual DesignCon Conference Exhibition held last week in Santa Clara, California.

Key Points: 
  • In the demonstration, ACES 800Gbps OSFP ACCs with Spectra7's embedded GC1122 chips successfully interoperated with test equipment from several vendors to produce very robust low pre-FEC bit error rates (BERs) significantly below standard required BER.
  • "We are extremely proud to be working with ACES to broaden access to our 800G ACC solutions using Spectra7's innovative GaugeChanger™ integrated chips," said Spectra7 CEO Raouf Halim.
  • "We are delighted to have showcased our technology with them at DesignCon 2024. "
  • Spectra7's analog based GaugeChanger™ GC1122 chips are used in ACCs and offer significant cost, size, latency and energy consumption value versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.

Spectra7 and Volex Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects

Retrieved on: 
Tuesday, February 6, 2024
Cloud, SAN, Growth, Data center, Digital signal processing, DSP, Exhibition, The Company, Wire, AOCS, Network switch, DAC, Digital signal, Conference, Printed circuit board

SAN JOSE, Calif., Feb. 6, 2024 /PRNewswire/ -- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Volex plc ("Volex"), a global leader in high-speed data center interconnect products, announce that they successfully demonstrated industry leading performance of 800G Active Copper Cables (ACCs) at this year's annual DesignCon Conference Exhibition held last week in Santa Clara, California.

Key Points: 
  • "New network architectures and increased server speeds are causing the market for connectivity inside the data center to embrace active solutions," said Alan Weckel, Founder and Technology Analyst with 650 Group.
  • "By 2026, we expect over 70% of the Cloud server market to be active copper.
  • Active copper cables also help support the US$22B, and growing, Ethernet market in the data center, which is critical for the future growth of Cloud and AI/ML applications."
  • 1
    "We are proud to have Volex as a partner for 800G interconnects using our GaugeChanger™ integrated chips," said Spectra7 CEO Raouf Halim.

Spectra7 and MultiLane to Demonstrate Robust Performance Testing of 800G Active Copper Interconnects at DesignCon 2024

Retrieved on: 
Thursday, February 1, 2024
Conference, SAN, DSO, Digital signal processing, DSP, TDR, Hyperscale computing, Exhibition, The Company, Wire, AOCS, ACC, Digital signal, Cable television

SAN JOSE, Calif., Feb. 1, 2024 /PRNewswire/ -- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and MultiLane Technologies Inc. (MultiLane), a market leading manufacturer of High-Speed IO and Data Center Interconnect test solutions, announced they will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.

Key Points: 
  • The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.
  • DesignCon is the premier high-speed interconnect and system design conference attended by engineers from around the world.
  • "MultiLane prides itself on offering solutions that enable top-tier testing at a large scale," said Elias Khoury, MultiLane Product Line Manager for TDR and cable and transceiver testing.
  • "We are delighted to be working with Spectra7 and their cable partners as they anticipate bringing their 112Gbps products to mass production in 2024."

Spectra7 and Teledyne LeCroy to Demonstrate Robust Performance Testing of 800Gbps Active Copper Interconnects at DesignCon 2024

Retrieved on: 
Wednesday, January 31, 2024
SAN, Digital signal processing, DSP, Architecture, Exhibition, Teledyne Technologies, The Company, Wire, AOCS, Xena, ACC, Digital signal, Conference

SAN JOSE, Calif., Jan. 31, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Teledyne LeCroy, a leading provider of electronic design, test and software solutions, announced they will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.

Key Points: 
  • The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.
  • The demo will highlight Spectra7's ACCs successfully interoperating with the Teledyne LeCroy's Xena Z800 800GE QSFP-DD800 Test System at 800Gbps speeds.
  • "Spectra7 has created a compelling solution to address the dramatically increasing power and cost of data center interconnects."
  • "Teledyne LeCroy is a global leader in the test and measurement solutions market," said Spectra7 CEO Raouf Halim.

Spectra7 and Keysight Successfully Achieve Robust Performance Testing of 800Gbps Active Copper Interconnects and Plan Demonstration at DesignCon 2024

Retrieved on: 
Wednesday, January 24, 2024
Exhibition, DSP, SAN, Digital signal, ACC, AOCS, Conference, Ethernet, Wire, Digital signal processing, The Company

SAN JOSE, Calif., Jan. 24, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Keysight, a leading provider of electronic design, test, security, and software solutions, announced they successfully achieved robust performance testing and will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.

Key Points: 
  • The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.
  • In the testing, Spectra7's ACCs successfully interoperated with the Keysight AresONE-M 800GE QSFP-DD800 Layer 1-3 Test System at 800Gbps speeds.
  • Link training produced a very robust low bit error rate (BER) of 3.3e-9 which demonstrates a wide margin over standard required BER.
  • "Their validation of robust performance of our GaugeChangerTM technology in 800Gbps interconnects is a significant milestone in the coming volume deployment of our data center product line."

Spectra7 and Leading Equipment Suppliers to Demonstrate Robust Performance of 800Gbps Active Copper Interconnects at DesignCon 2024

Retrieved on: 
Wednesday, January 17, 2024
Exhibition, DSP, SAN, Digital signal, OSFP, AOCS, Conference, Wire, Digital signal processing, The Company

SAN JOSE, Calif., Jan. 17, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with several leading equipment suppliers at this year's annual DesignCon Conference Exhibition being held in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications.

Key Points: 
  • SAN JOSE, Calif., Jan. 17, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with several leading equipment suppliers at this year's annual DesignCon Conference Exhibition being held in Santa Clara, California from Jan 31-Feb 1, 2024.
  • The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications.
  • DesignCon is the premier high speed interconnect and system design conference attended by engineers from around the world.
  • Spectra7's analog based GaugeChanger™ GC1122 chips are used in Active Copper Cables (ACCs) and offer significant cost, size and energy consumption value vs. competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.

Spectra7 Receives Initial Order for Production GC1122 Chips

Retrieved on: 
Tuesday, January 16, 2024
Artificial intelligence, Silicon, DSP, SAN, Digital signal, Data-rate units, ACC, AOCS, Ethernet, Wire, Digital signal processing, The Company

SAN JOSE, Calif., Jan. 16, 2024 /PRNewswire/ -- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced that it has received its first order for production GC1122 chips supporting Active Copper Cables (ACCs) operating at speeds up to 800 Gbps and 1.6 Tbps. The order has come from a major China cable supplier who serves both the North America and China data center markets.

Key Points: 
  • SAN JOSE, Calif., Jan. 16, 2024 /PRNewswire/ -- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced that it has received its first order for production GC1122 chips supporting Active Copper Cables (ACCs) operating at speeds up to 800 Gbps and 1.6 Tbps.
  • The order has come from a major China cable supplier who serves both the North America and China data center markets.
  • "We are excited to receive the first order for our production GC1122 chips," said Spectra7 CEO Raouf Halim.
  • 1 Spectra7 internally generated model based on 650Group silicon chipsets for Ethernet optical transceivers and active cable alternatives posted July 2023.

Intel and NewPhotonics Achieve Breakthrough with 224Gbps Electrical SerDes and Photonics Engine Integration

Retrieved on: 
Tuesday, December 5, 2023
Intel, PAM4, PD, Modulation, Digital signal processing, ECOC, DSP, Photonics, Digital signal, TEL, SerDes, Renewable energy

TEL AVIV, Israel, Dec. 5, 2023 /PRNewswire/ -- Intel Corporation and NewPhotonics Ltd are proud to announce a milestone achievement: the successful integration of Intel new 224Gbps electrical SerDes design with NewPhotonics cutting-edge Photonics Engine, resulting in an end-to-end direct modulation electrical-to-optical link utilizing PAM4 modulation.

Key Points: 
  • TEL AVIV, Israel, Dec. 5, 2023 /PRNewswire/ -- Intel Corporation and NewPhotonics Ltd are proud to announce a milestone achievement: the successful integration of Intel new 224Gbps electrical SerDes design with NewPhotonics cutting-edge Photonics Engine, resulting in an end-to-end direct modulation electrical-to-optical link utilizing PAM4 modulation.
  • Unprecedented Speed and Scalability: The integration of Intel SerDes design and the NewPhotonics Photonics Engine achieved a 224Gbps end-to-end data transmission rate with exceptional performance.
  • "We are thrilled to have achieved the successful integration of our photonics technology with Intel most advanced 224Gbps SerDes."
  • Noam Avni, Intel Vice President, added, "Our advanced SerDes designs, combined with NewPhotonics optical engine, demonstrates the power of pushing the boundaries of technology.