Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking
These yield-killing defects are becoming more prevalent as chipmakers implement angstrom era designs with narrower line and space patterns.
- These yield-killing defects are becoming more prevalent as chipmakers implement angstrom era designs with narrower line and space patterns.
- In foundry-logic, Sym3 Y Magnum has already been adopted for critical etch applications at leading chipmakers and is now being deployed for EUV patterning in angstrom era nodes.
- Since 2012, Applied Materials has made patterning a research and development priority, investing to deliver new products and solutions that help customers overcome their toughest patterning challenges, particularly in emerging EUV and High-NA EUV applications.
- The company’s patterning product portfolio today includes CVD and ALD deposition; four types of materials removal (etch, selective materials removal, pattern shaping and CMP); thermal processes; and eBeam metrology.