Semiconductor And IC Packaging Material Market Is Expected to be worth Around USD 34.8 Billion By 2025 - Zion Market Research
According to the report, the global semiconductor and IC packaging material market was USD 25.6 billion in 2018 and is expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025.
- According to the report, the global semiconductor and IC packaging material market was USD 25.6 billion in 2018 and is expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025.
- Growing R&D investments by numerous leading companies to develop better packaging materials and technologies is also driving the semiconductor and IC packaging material market.
- However, difficulty in implementing new technologies and latest packaging materials in small companies might slow down the semiconductor and IC packaging material market.
- This report segments the global semiconductor and IC packaging material market into:
Global Semiconductor and IC Packaging Material Market: By Type