Semiconductors

Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices

Retrieved on: 
Monday, January 25, 2021
Packaging, Semiconductor, Technology, Manufacturing, Other Manufacturing, Hardware, Packaging, Semiconductor device fabrication, Sumitomo Group, Electronic engineering, Electronics industry, Semiconductors, Integrated circuit, Mitsui, ON Semiconductor, Multi-chip module

For the commercialization of HRDP1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, Mitsui Kinzoku) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki).

Key Points: 
  • For the commercialization of HRDP1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, Mitsui Kinzoku) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki).
  • Mitsui Kinzoku is pleased to announce today that mass production of HRDP has started for a domestic multi-chip module manufacturer.
  • HRDP is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 m or less4.
  • As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021.

eInfochips Wins Design Services Company of the Year Award from IESA

Retrieved on: 
Thursday, January 21, 2021
Semiconductor device fabrication, Fabless manufacturing, SEMI, Semiconductors, Electronics industry, Electronics and semiconductor manufacturing industry in India, Technology, KLE Technological University, Fabless semiconductor companies

SAN JOSE, Calif., Jan. 21, 2021 /PRNewswire/ --eInfochips, a leading provider of product engineering and semiconductor design services, has won the Design Services Company of the Year award for 2020 from Indian Electronics and Semiconductor Association (IESA).

Key Points: 
  • SAN JOSE, Calif., Jan. 21, 2021 /PRNewswire/ --eInfochips, a leading provider of product engineering and semiconductor design services, has won the Design Services Company of the Year award for 2020 from Indian Electronics and Semiconductor Association (IESA).
  • IESA is the premier industry body representing the Electronics & Semiconductor Design and Manufacturing (ESDM) industry in India.
  • IESA aims to grow the ESDM industry in India to make it the preferred destination for ESDM business.
  • It has two broad segments for companies - products (fabless companies, OEMs) and services (design services, manufacturing services).

Silexica's New SLX FPGA 2020.4 Ushers in a New Level of Usability

Retrieved on: 
Monday, January 11, 2021
Xilinx, Field-programmable gate array, SLX, Electronics industry, Semiconductors, Technology

In addition, SLX FPGA 2020.4 incorporates optimizations to the profiling capability that allow designers to understand the execution costs from an FPGA implementation vs a CPU implementation and quickly identify bottlenecks, improving time-to-market.

Key Points: 
  • In addition, SLX FPGA 2020.4 incorporates optimizations to the profiling capability that allow designers to understand the execution costs from an FPGA implementation vs a CPU implementation and quickly identify bottlenecks, improving time-to-market.
  • "The release of SLX FPGA 2020.4 represents another significant step forward in bridging the gap between software development and designing an FPGA," said Jordon Inkeles, VP of Product at Silexica.
  • "SLX FPGA 2020.4 includes major improvements towards usability to help users achieve better results in less time.
  • SLX FPGA 2020.4 also includes support for the new SLX Plugin, the first commercially available plugin to expand the capabilities of Xilinx's Vitis Unified Software Platform.

Global Wide-Bandgap Power Semiconductor Devices Market will Grow by $ 2.86 Billion During 2020-2024 | Technavio Identifies APAC as Key Growth Region

Retrieved on: 
Monday, December 14, 2020
Technology, Semiconductor, Semiconductor devices, Electronics industry, MOSFETs, Power semiconductor device, SEMI, Semiconductors, Industries, Wide-bandgap semiconductor

Wide-Bandgap Power Semiconductor Devices Market: Application Landscape

Key Points: 
  • Wide-Bandgap Power Semiconductor Devices Market: Application Landscape
    Based on the application, the market saw maximum growth in the UPS and PS systems segment in 2019.
  • This is due to the extensive use of WBG power semiconductor devices in UPS and PS applications.
  • Wide-Bandgap Power Semiconductor Devices Market: Geographic Landscape
    By geography, APAC is going to have a lucrative growth during the forecast period.
  • Market growth in this region will be faster than the growth of the market in other regions.

Global Semiconductor Intellectual Property (IP) Market with COVID-19 Impact Analysis to 2025 - ResearchAndMarkets.com

Retrieved on: 
Thursday, December 10, 2020
Technology, Hardware, Semiconductor, Digital electronics, Electronic engineering, Electronic design automation, Logic design, Semiconductor device fabrication, Semiconductor intellectual property core, SEMI, Semiconductors, Fabless semiconductor companies, Electronics and semiconductor manufacturing industry in India

The "Semiconductor Intellectual Property (IP) Market with COVID-19 Impact Analysis by Design IP, IP Core, IP Source, End User, Vertical (Consumer Electronics, Telecom & Data Centers, Automotive, Commercial, Industrial), and Geography - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Semiconductor Intellectual Property (IP) Market with COVID-19 Impact Analysis by Design IP, IP Core, IP Source, End User, Vertical (Consumer Electronics, Telecom & Data Centers, Automotive, Commercial, Industrial), and Geography - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.
  • The interface design IP segment is projected to grow at the second-highest CAGR from 2020 to 2025 for semiconductor IP market, by design IP.
  • The automotive segment for semiconductor IP market is estimated to register higher CAGR growth during the forecast period, by vertical.
  • The report also provides a comprehensive review of market drivers, restraints, opportunities, and challenges in the semiconductor IP market.

Semtech’s New 1N5822 QPL Schottky Diode Now Qualified to Space Grade

Retrieved on: 
Wednesday, November 18, 2020
Mobile, Wireless, Technology, Semiconductor, Engineering, Satellite, Other Technology, Aerospace, Software, Manufacturing, Hardware, Diodes, Semiconductors, Electronics industry, Semiconductor devices, Schottky diode, Metal electrode leadless face, Semtech, Diode, 1N58xx Schottky diodes, SMTC, Schottky

Semtech Corporation (Nasdaq: SMTC), a leading supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced the qualification of its new Schottky diode to space grade.

Key Points: 
  • Semtech Corporation (Nasdaq: SMTC), a leading supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced the qualification of its new Schottky diode to space grade.
  • View the full release here: https://www.businesswire.com/news/home/20201118005428/en/
    The new addition, JANS1N5822 (also available as JANS1N5822US in MELF surface mount packaging), is Semtechs first Schottky diode for use in space applications.
  • This diode will add to the range of QPL high reliability devices available from Semtech.
  • This qualification will make Semtech the second qualified manufacturer for this highly specialized diode.

Amkor Technology to Present at Upcoming Conferences

Retrieved on: 
Tuesday, November 17, 2020
Technology, Other Manufacturing, Semiconductor, Manufacturing, Amkor Technology, Companies, NASDAQ, Semiconductors, Finance, UTAC Group

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the following conferences:

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the following conferences:
    Bank of America Securities 2020 Leveraged Finance Virtual Conference on Tuesday, December 1, 2020.
  • Amkors presentation will occur at 9:00 am Eastern Time (7:00 am Mountain Time).
  • Credit Suisse 24th Annual Technology Conference on Thursday, December 3, 2020.
  • Amkor Technology, Inc. is one of the worlds largest providers of outsourced semiconductor packaging and test services.

Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement

Retrieved on: 
Thursday, November 5, 2020
Semiconductor device fabrication, Semiconductors, Technology, Science and technology, Microtechnology, MOSFETs, Soitec, Silicon on insulator, GlobalFoundries, Wafer, SOI, 5G

The primary driver of this wafer supply agreement is the growth of GFs most advanced RF-SOI solution, 8SW RF SOI .

Key Points: 
  • The primary driver of this wafer supply agreement is the growth of GFs most advanced RF-SOI solution, 8SW RF SOI .
  • The 5G revolution would not be possible without GLOBALFOUNDRIES and our industry-leading specialty RF solutions.
  • Securing this critical supply of wafers, from our longstanding partner Soitec, enables GF to meet the ever-growing demand for our 5G solutions.
  • In 2017, the two companies entered into a five-year supply agreement for fully depleted silicon-on-insulator (FD-SOI) wafers for GFs 22FDX platform.

Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement

Retrieved on: 
Thursday, November 5, 2020
Semiconductors, Semiconductor device fabrication, Electronics industry, Microtechnology, Soitec, GlobalFoundries, Silicon on insulator, Wafer

Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement

Key Points: 
  • Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement
    Strategic supply agreement positions GLOBALFOUNDRIES to meet the growing demand for its most advanced RF-SOI solution, 8SW, used by top FEM providers to 5G sub-6 GHz smartphones
    Santa Clara, Calif., and Bernin (Grenoble), France, November 5, 2020 GLOBALFOUNDRIES (GF), the worlds leading specialty foundry, and Soitec, a world leader in designing and manufacturing innovative semiconductor materials, today announced a multi-year supply agreement for 300mm radio frequency silicon-on-insulator (RF-SOI) wafers.
  • The primary driver of this wafer supply agreement is the growth of GFs most advanced RF-SOI solution, 8SW RF SOI .
  • The 5G revolution would not be possible without GLOBALFOUNDRIES and our industry-leading specialty RF solutions.
  • Securing this critical supply of wafers, from our longstanding partner Soitec, enables GF to meet the ever-growing demand for our 5G solutions.

Ethernity Networks Announces 5G DU vRouter Solution

Retrieved on: 
Thursday, October 22, 2020
Field-programmable gate array, Hardware acceleration, Electronics industry, Semiconductors, Xilinx, Electrical components

Ethernity's solution eliminates the need for a CSR by integrating the virtual routing software with the FPGA SmartNIC within the DU server.

Key Points: 
  • Ethernity's solution eliminates the need for a CSR by integrating the virtual routing software with the FPGA SmartNIC within the DU server.
  • "By utilizing our vast experience and field-proven router data plane on FPGA with our unique Router-on-FPGA-NIC offering, Ethernity is in a strong leading position to assist and optimize the building of 5G networks," said Oded Bergman, VP of Products and Business Development at Ethernity Networks.
  • The Ethernity vRouter solution is available today for 3rd-party vRouter software integration and will be available in Q1 2021 for field trials with Ethernity's own vRouter software.
  • Ethernity Networks (AIM: ENET.L) provides innovative, comprehensive networking and security solutions on programmable hardware for accelerating telco/cloud networks.