Semiconductor

Sakuu Collaborates with Livent on Application of LIOVIX® Printable Lithium Formulation for Next-Generation Printed Batteries

Retrieved on: 
Thursday, April 20, 2023

Sakuu is collaborating with Livent Corporation (“Livent”; NYSE: LTHM) under an existing joint development agreement (“JDA”) for the use of Livent’s proprietary LIOVIX® printable lithium formulation in Sakuu’s battery 3D printing process.

Key Points: 
  • Sakuu is collaborating with Livent Corporation (“Livent”; NYSE: LTHM) under an existing joint development agreement (“JDA”) for the use of Livent’s proprietary LIOVIX® printable lithium formulation in Sakuu’s battery 3D printing process.
  • View the full release here: https://www.businesswire.com/news/home/20230420005044/en/
    We're happy to announce our collaboration with Livent Corporation for the use of their proprietary LIOVIX® printable lithium formulation in Sakuu’s pioneering battery 3D printing process—enabling an entirely new paradigm in batteries and manufacturing.
  • (Graphic: Business Wire)
    In February, Sakuu announced consistent and successful 3D printing of fully functional high-performance patterned batteries.
  • These printed cells used Livent’s LIOVIX® printable lithium formulation in the anode, which enhanced the unique patterning capabilities of Sakuu’s proprietary 3D printing process.

TSMC Files Annual Report on Form 20-F for 2022

Retrieved on: 
Thursday, April 20, 2023

TSMC (TWSE: 2330, NYSE: TSM) today filed its 2022 annual report on Form 20-F with the U.S. Securities and Exchange Commission.

Key Points: 

Fluree Closes $10M Series A Round for Web3 Data Management & Modern Data Infrastructure

Retrieved on: 
Thursday, April 20, 2023

The funding also will enable Fluree to assist enterprise organizations in data transformation journeys for upgrading legacy infrastructure into collaborative modern data platforms.

Key Points: 
  • The funding also will enable Fluree to assist enterprise organizations in data transformation journeys for upgrading legacy infrastructure into collaborative modern data platforms.
  • “Our data-management vision always has been to rebuild data architecture for the modern enterprise,” said Brian Platz, Fluree co-founder and CEO.
  • “As we move from 'data as a byproduct’ of applications to ‘data being the product,’ Fluree will provide best-in-class data infrastructure to service this shift.
  • For companies steeped in legacy infrastructure grappling with disparate data sets, data silos and outdated data-governance systems, Fluree’s product Fluree Sense will guide them toward a modern data architecture.

ChipMOS SCHEDULES FIRST QUARTER 2023 FINANCIAL RESULTS CONFERENCE CALL

Retrieved on: 
Thursday, April 20, 2023

HSINCHU, April 20, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will report first quarter 2023 results and host a conference call after the close of trading on the Taiwan Stock Exchange on Thursday, May 4, 2023.

Key Points: 
  • HSINCHU, April 20, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will report first quarter 2023 results and host a conference call after the close of trading on the Taiwan Stock Exchange on Thursday, May 4, 2023.
  • Investors and analysts are encouraged to participate using the dial-in phone number noted below.
  • A webcast and replay will be available on the Company's website.

Tower Semiconductor Announces First Quarter 2023 Earnings Release Date

Retrieved on: 
Thursday, April 20, 2023

MIGDAL HAEMEK, Israel – April 20, 2023 – Tower Semiconductor (NASDAQ/ TASE: TSEM ), the leading foundry of high value analog semiconductor solutions, will issue its first quarter 2023 earnings on Monday, May 15, 2023.

Key Points: 
  • MIGDAL HAEMEK, Israel – April 20, 2023 – Tower Semiconductor (NASDAQ/ TASE: TSEM ), the leading foundry of high value analog semiconductor solutions, will issue its first quarter 2023 earnings on Monday, May 15, 2023.
  • In light of the previously announced transaction with Intel, Tower will not provide guidance for the second-quarter 2023 and will not host an earnings conference call.

Corsair Gaming to Report Q1 2023 Financial Results on May 10

Retrieved on: 
Thursday, April 20, 2023

Corsair Gaming® (NASDAQ: CRSR), a world leader in enthusiast components for gamers, creators, and PC builders, today announced it will release its first quarter 2023 results and financial outlook after the NASDAQ close on Wednesday, May 10, 2023, with its management hosting a conference call to discuss results at 2:00 p.m. Pacific Time that same day.

Key Points: 
  • Corsair Gaming® (NASDAQ: CRSR), a world leader in enthusiast components for gamers, creators, and PC builders, today announced it will release its first quarter 2023 results and financial outlook after the NASDAQ close on Wednesday, May 10, 2023, with its management hosting a conference call to discuss results at 2:00 p.m. Pacific Time that same day.
  • The 2:00 p.m. PDT conference call will be accessible on Corsair’s Investor Relations website at https://ir.corsair.com , or by dialing 1-877-407-0784 (USA) or 1-201-689-8560 (International) with conference ID 13737369.
  • A replay will be available approximately 3 hours after the live call ends on Corsair's Investor Relations website, or through May 17, 2023 by dialing 1-844-512-2921 (USA) or 1-412-317-6671 (International), with passcode 13737369.

Plataine & NEPES Sign MoU to Jointly Develop and Market AI-Based Solutions for Semiconductor Manufacturing

Retrieved on: 
Thursday, April 20, 2023

TEL AVIV, Israel, April 20, 2023 /PRNewswire-PRWeb/ -- Plataine, a leading provider of advanced software solutions for manufacturing, and NEPES, a leading provider of semiconductor packaging solutions, have announced that they have signed a Memorandum of Understanding (MoU) to jointly develop and market AI-based solutions for the semiconductor manufacturing industry.

Key Points: 
  • TEL AVIV, Israel, April 20, 2023 /PRNewswire-PRWeb/ -- Plataine, a leading provider of advanced software solutions for manufacturing, and NEPES, a leading provider of semiconductor packaging solutions, have announced that they have signed a Memorandum of Understanding (MoU) to jointly develop and market AI-based solutions for the semiconductor manufacturing industry.
  • Based on the MoU, the companies will work together to develop products and software solutions for intelligent automation and optimization for advanced manufacturing in the field of semiconductors.
  • The products will combine Plataine's AI and IoT Based Total Production Optimization (TPO) software with NEPES' industry know-how and expertise.
  • The Parties will also form a joint venture in the Republic of Korea that will market, distribute, and sell these solutions.