Bluetooth stack

Tuya Smart Releases an All-In Bluetooth Development Capability

Retrieved on: 
Tuesday, August 3, 2021

In terms of Bluetooth protocol, Tuya Smart supports connection approaches such as point-to-point, Bluetooth mesh, and broadcast Bluetooth.

Key Points: 
  • In terms of Bluetooth protocol, Tuya Smart supports connection approaches such as point-to-point, Bluetooth mesh, and broadcast Bluetooth.
  • In terms of device access, Tuya Smart provides SDK development, MCU common connection, and SoC development-free solutions so that Bluetooth developers with different product needs can find their own development methods and quickly realize low-cost and efficient development.
  • Apart from significantly reducing development costs, the All-In Bluetooth development capability of Tuya Smart can also effectively reduce energy consumption and utility bills for users.
  • The release of Tuya Smart All-In Bluetooth development capability lays a solid foundation for Bluetooth technology innovation and large-scale commercial application, and helps more developers realize the potential of the Bluetooth market and jointly seize the opportunity of the "blue market."

CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth® 5.3 IP

Retrieved on: 
Thursday, July 22, 2021

ROCKVILLE, Md., July 22, 2021 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced the general release of its RivieraWaves Bluetooth 5.3 IP.

Key Points: 
  • ROCKVILLE, Md., July 22, 2021 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced the general release of its RivieraWaves Bluetooth 5.3 IP.
  • Having powered more than 520 million Bluetooth devices in 2020 alone, our RivieraWaves Bluetooth IP is an integral part of the Bluetooth ecosystem.
  • CEVA's RivieraWaves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth low energy and Bluetooth dual mode connectivity.
  • CEVA is the leading licensor of wireless connectivity and smart sensing technologies for a smarter, safer, connected world.

First Single-system Protocol Analyzer for Bluetooth® Technology and Wi-Fi 6E

Retrieved on: 
Wednesday, July 7, 2021

Multiple wireless communication standards have proliferated into Internet-of-things (IoT), automotive, smart cities and buildings, and consumer electronics.

Key Points: 
  • Multiple wireless communication standards have proliferated into Internet-of-things (IoT), automotive, smart cities and buildings, and consumer electronics.
  • "With nearly five billion Bluetooth enabled devices shipping annually, our ecosystem relies on test and measurement equipment to validate designs for interoperability and conformance," said Mark Powell, CEO, Bluetooth SIG.
  • "We are pleased to see companies like Teledyne LeCroy continue to aid Bluetooth developers in testing and troubleshooting devices as they create exciting new Bluetooth enabled innovations across the world."
  • Bluetoothand Bluetooth LE are trademarks of the Bluetooth SIG.

EQS-News: u-blox AG: Bluetooth 5.1 module enables mesh networking for 'massive IoT' applications

Retrieved on: 
Tuesday, May 18, 2021

The small (10 by 15 by 2.2 mm) Bluetooth LE/Bluetooth 5.1 MCU modules with open CPU architecture are optimized for, and can be supplied preinstalled with, Wirepas Massive (previously Wirepas Mesh), a decentralized large-scale mesh networking solution.

Key Points: 
  • The small (10 by 15 by 2.2 mm) Bluetooth LE/Bluetooth 5.1 MCU modules with open CPU architecture are optimized for, and can be supplied preinstalled with, Wirepas Massive (previously Wirepas Mesh), a decentralized large-scale mesh networking solution.
  • This greatly reduces time, cost, and effort for u-blox customers integrating Bluetooth LE in their designs.
  • (The module is also able to run third-party device applications alongside the Wirepas protocol.)
  • Wirepas claims the software is the only solution to combine sensing, monitoring, control, positioning, and large-scale inventory in a single technology.

CEVA's Bluetooth® Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More

Retrieved on: 
Thursday, May 6, 2021

b'ROCKVILLE, Md., May 6, 2021 /PRNewswire/ --CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth Dual Mode 5.2 Platform has achieved Bluetooth SIG Qualification .

Key Points: 
  • b'ROCKVILLE, Md., May 6, 2021 /PRNewswire/ --CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth Dual Mode 5.2 Platform has achieved Bluetooth SIG Qualification .
  • Together with our unique portfolio of DSP-based audio and motion sensing IPs including the recently announced Bluebud wireless audio platform, the RivieraWaves Bluetooth Dual Mode 5.2 Platform helps our customers expedite their flexible and differentiated wireless audio IC designs for booming markets such as TWS earbuds.
  • "\nCEVA\'s RivieraWaves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth LE and Bluetooth dual mode connectivity.
  • For wireless IoT, we offer the industry\'s most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT.

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on IoT Devices

Retrieved on: 
Tuesday, April 6, 2021

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on IoT endpoint devices.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on IoT endpoint devices.
  • Featuring the RX23W 32-bit RX MCU supporting fully integrated Bluetooth Low Energy communication, the new RX23W module is equipped with an antenna, oscillator and custom-matched circuit.
  • This improves the development efficiency of IoT endpoint devices such as home appliance, healthcare and sports and fitness equipment.
  • View the full release here: https://www.businesswire.com/news/home/20210406005312/en/
    Renesas RX23W module with Bluetooth for system control and wireless communication (Graphic: Business Wire)
    The RX23W MCU incorporated in the new module supports full Bluetooth 5.0 Low Energy communication support including long-range and 2 Mbps data throughput.

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

Retrieved on: 
Tuesday, March 23, 2021

Bluetooth Vanguard includes a deep set of state-of-the-art capabilities, including Capture Diversity, a capture quality improvement technique important for audio development that employs aco-operational replication of the Ellisys whole-band digital capture engine.

Key Points: 
  • Bluetooth Vanguard includes a deep set of state-of-the-art capabilities, including Capture Diversity, a capture quality improvement technique important for audio development that employs aco-operational replication of the Ellisys whole-band digital capture engine.
  • For Bluetooth Low Energy devices, LC3 enables a new wave of development for hearing assistive devices, music, speech, and other audio applications.
  • The company's solutions include the Ellisys Bluetooth Qualifier (EBQ) platform, and several protocol analyzer tools supporting both Bluetooth radio types - Low Energy and Classic (BR/EDR).
  • World Class Protocol Test Solutions for Bluetooth, USB, Wi-Fi, and other Technologies
    Ellisys, the Ellisys logo, Better Analysis, Bluetooth Tracker, Bluetooth Explorer, Bluetooth Vanguard, tzero, Capture Diversity are trademarks of Ellisys, and may be registered in some jurisdictions.

Asia-Pacific Mobile Applications Market Assessment and Forecast 2020-2026 - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 9, 2021

The factors that boost the market for mobile applications include the increased application of improved Virtual Reality.

Key Points: 
  • The factors that boost the market for mobile applications include the increased application of improved Virtual Reality.
  • All the temperature, lighting, security controls, and music are controlled by mobile applications that are connected through Bluetooth, or Bluetooth.
  • Mobile applications are becoming a companion for any smartphone user for both native applications by reliable developers and some Third-party developer applications.
  • As there is an interactive and better and user interface, and evolving third party applications developers are now penetrating the market.

Nations' Latest BLE 5 IC Powered By CEVA Bluetooth® Low Energy IP

Retrieved on: 
Tuesday, February 23, 2021

The NZ8801 IC features a 32-bit high performance, low power consumption processor, and connects and communicates with other devices through standard Bluetooth protocol.

Key Points: 
  • The NZ8801 IC features a 32-bit high performance, low power consumption processor, and connects and communicates with other devices through standard Bluetooth protocol.
  • "We are pleased to announce our relationship with CEVA to integrate their Bluetooth low energy IP into our BLE5 IC," said Liang Jie, V.P.
  • CEVA's RivieraWaves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth LE and Bluetooth dual mode connectivity.
  • For wireless IoT, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT.

T2 Software Licenses Bluetooth LC3 to Nordic Semiconductor

Retrieved on: 
Thursday, January 14, 2021

LOUISVILLE, Ky., Jan. 14, 2021 /PRNewswire/ -- T2 Software www.t2software.com (formerly T2 Labs)announces the licensing of their implementation of the Bluetooth Low Complexity Communications Codec (LC3) to Nordic Semiconductor for integration into their recently announced Nordic nRF5340 platform.

Key Points: 
  • LOUISVILLE, Ky., Jan. 14, 2021 /PRNewswire/ -- T2 Software www.t2software.com (formerly T2 Labs)announces the licensing of their implementation of the Bluetooth Low Complexity Communications Codec (LC3) to Nordic Semiconductor for integration into their recently announced Nordic nRF5340 platform.
  • T2 Software is an active participant in the Bluetooth LE Audio focused working groups that create the specifications within the Bluetooth SIG and, in September 2020, was the first company in the world to qualify the Bluetooth LC3 with the Bluetooth SIG.
  • "T2 Software is honored to be working with Nordic, one of the true leaders in Bluetooth LE solutions for more than the last decade," said Tim Reilly, CEO and co-Founder of T2 Software.
  • T2 Software (formerly T2 Labs), based in Louisville, KY, is a software development company focusing on Bluetooth LE Audio and Classic Audio software solutions and providing embedded wireless software development services for its customers.