IEEE 802.15

Packetcraft Announces Solutions for UWB and Joins FiRa Consortium

Retrieved on: 
Tuesday, May 11, 2021
Telecommunications engineering, Telecommunications, Wireless, IEEE 802, Working groups, FiRa Consortium, Radio technology, Data transmission, Wireless networking, Ultra-wideband, IEEE 802.15, Fira

b'SAN DIEGO, May 11, 2021 /PRNewswire/ --Expanding its world-leading wireless software offering for semiconductor companies, Packetcraft, Inc. today announces software solutions for ultra-wideband (UWB) technology.Packetcraft has also joined the FiRa Consortium, an industry consortium dedicated to growing the UWB ecosystem and ensuring device interoperability.\nPacketcraft\'s UWB solution consists of a MAC layer for IEEE 802.15.4z and higher layer protocol software defined by FiRa Consortium specifications.

Key Points: 
  • b'SAN DIEGO, May 11, 2021 /PRNewswire/ --Expanding its world-leading wireless software offering for semiconductor companies, Packetcraft, Inc. today announces software solutions for ultra-wideband (UWB) technology.Packetcraft has also joined the FiRa Consortium, an industry consortium dedicated to growing the UWB ecosystem and ensuring device interoperability.\nPacketcraft\'s UWB solution consists of a MAC layer for IEEE 802.15.4z and higher layer protocol software defined by FiRa Consortium specifications.
  • Packetcraft is accelerating its time-to-market by creating UWB solutions from the same building blocks used in Packetcraft\'s industry-proven Bluetooth low energy stack and 802.15.4 MAC for 2.4GHz.
  • Packetcraft has also partnered with nanoelectronics research center imec to run Packetcraft\'s UWB protocol software on imec\'s next-gen UWB transceiver.
  • "UWB ranging and direction finding, as specified by IEEE 802.15.4z and FiRa Consortium specifications, will enable the precise location of connected devices to be known, indoors and out.

Newradio Technology Selects LitePoint IQgig-UWB™ Platform to Ensure Performance of Ultra Wide Band (UWB) Devices

Working groups, Computing, LitePoint, Telecommunications, UWB, IEEE 802.15, PHY, IEEE 802, Computer networking, Data transmission, Radio technology, FiRa Consortium

The LitePoint team really understands UWB and has the advanced test technology to help us develop the highest quality UWB chips and system solutions, said ZhenQi Chen, Co-founder and CEO of NewRadio Technology.

Key Points: 
  • The LitePoint team really understands UWB and has the advanced test technology to help us develop the highest quality UWB chips and system solutions, said ZhenQi Chen, Co-founder and CEO of NewRadio Technology.
  • LitePoints IQgig-UWB test platform is the first fully integrated test solution to calibrate and validate devices with UWB technology.
  • The test platform offers complete physical-layer testing and calibration of devices enabled with UWB technology including IEEE 802.15.4z.
  • Newradio Technology Co., Ltd. (NRT) is a pioneer in 5G technology and one of the world leading companies in the field of UWB.

Inpixon Receives FCC Certification For Ultra-WideBand (UWB) Module

Retrieved on: 
Monday, August 10, 2020
IEEE 802, Telecommunications, Working groups, Data transmission, Computing, Radio technology, Information and communications technology, Ultra-wideband, IEEE 802.15, UWB

PALO ALTO, Calif. and TORONTO, Aug. 10, 2020 /PRNewswire/ --Inpixon (Nasdaq: INPX), a leading indoor data company that delivers Indoor Intelligence solutions, today announced it has received certification for its Ultra-WideBand (UWB) module from the U.S. Federal Communications Commission (FCC).

Key Points: 
  • PALO ALTO, Calif. and TORONTO, Aug. 10, 2020 /PRNewswire/ --Inpixon (Nasdaq: INPX), a leading indoor data company that delivers Indoor Intelligence solutions, today announced it has received certification for its Ultra-WideBand (UWB) module from the U.S. Federal Communications Commission (FCC).
  • The FCC-certified UWB module is designed and developed by Inpixon for use in Inpixon and third-party sensors, built to meet the IEEE 802.15.4 UWB standard and has an ability to provide positional accuracy of under 30 centimeters.
  • "We are especially proud of our research and development team for these technological achievements, as well as rapid prototyping, testing and development of this UWB module," commented Adam Benson, Inpixon CTO.
  • Inpixon disclaims any intention to, and undertakes no obligation to, update or revise forward-looking statements.

Renesas Introduces Bluetooth Low Energy Module for Ultra-Low Power IoT Applications

Retrieved on: 
Tuesday, August 4, 2020
Networks, Other Manufacturing, Hardware, Engineering, Technology, Semiconductor, Manufacturing, Mobile, Wireless, Telecommunications engineering, Telecommunications, IEEE 802, Wireless networking, Home automation, Mesh networking, Bluetooth Low Energy, Bluetooth, Zigbee, RF module, IEEE 802.15, Wireless

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced sample shipment availability of the new RYZ012 Bluetooth module targeting ultra-low power IoT applications.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced sample shipment availability of the new RYZ012 Bluetooth module targeting ultra-low power IoT applications.
  • The RYZ012 is Renesas' first Bluetooth Low Energy 5 module.
  • It integrates a 2.4 GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol, Bluetooth Low Energy (LE), Bluetooth LE Mesh, and ZigBee.
  • The RYZ012 also includes a battery monitor to measure battery capacity and detect low power in battery-operated devices.

FiRa Consortium Publishes UWB MAC Technical Requirements to Build Ultra-Wideband Interoperable Ecosystem

Retrieved on: 
Tuesday, May 5, 2020
Hardware, Semiconductor, Security, Construction & Property, Satellite, Technology, Elections, Campaigns, Public policy, Government, Other Technology, Telecommunications, Software, Interior design, Networks, VoIP, Internet, Mobile, Wireless, IEEE 802, Working groups, Computer networking, Telecommunications, IEEE 802.15, PHY, Information and communications technology, WiMedia Alliance

As the second step in ensuring an interoperable UWB ecosystem across chipsets, devices and services infrastructures, the FiRa Consortium today announced the availability of the FiRa Consortium UWB MAC Technical Requirements that prescribes UWB ranging protocols and behavior of the ranging devices.

Key Points: 
  • As the second step in ensuring an interoperable UWB ecosystem across chipsets, devices and services infrastructures, the FiRa Consortium today announced the availability of the FiRa Consortium UWB MAC Technical Requirements that prescribes UWB ranging protocols and behavior of the ranging devices.
  • The UWB MAC Technical Requirements and the recently released PHY Technical Requirements Specification have been developed by the FiRa Consortium using the High Rate Pulse (HRP) portion of the IEEE 802.15.4-2015 technical specification and 802.15.4z/D08 draft amendment for fine-ranging UWB technology.
  • The UWB MAC Technical Requirements and previously released PHY Technical Requirements Specification are available to FiRa Consortium members.
  • FiRa, FiRa Consortium, the FiRa logo, the FiRa Certified logo, and FiRa tagline are trademarks or registered trademarks of FiRa Consortium or its licensor(s)/supplier(s) in the US and other countries and may not be used without permission.

FiRa Consortium Publishes PHY Technical Requirements Specification to Jumpstart the Development of the Ultra-Wideband Interoperable Ecosystem

Retrieved on: 
Tuesday, April 7, 2020
Hardware, Semiconductor, Electronic design automation, Security, Data management, Satellite, Consumer electronics, Technology, Audio, Video, Other Technology, Telecommunications, Software, Networks, VoIP, Internet, Mobile, Wireless, IEEE 802, Articles, Technology, IEEE 802.15, Specification, Evaluation, Fira

Additionally, the FiRa Consortium Technical Working Group has completed the MAC Technical Requirements Specification which is now in the review process.

Key Points: 
  • Additionally, the FiRa Consortium Technical Working Group has completed the MAC Technical Requirements Specification which is now in the review process.
  • The basis for the new FiRa Consortium PHY Technical Requirements Specification is the High Rate Pulse (HRP) portion of the IEEE 802.15.4-2015 technical specification and 802.15.4z/D06 draft amendment for fine-ranging UWB technology.
  • The FiRa Consortium PHY Technical Requirements Specification will be used as the foundation for other specifications and certifications being driven by the FiRa Consortium.
  • FiRa, FiRa Consortium, the FiRa logo, the FiRa Certified logo, and FiRa tagline are trademarks or registered trademarks of FiRa Consortium or its licensor(s)/supplier(s) in the US and other countries and may not be used without permission.

Packetcraft Announces World's First Qualified Bluetooth Software Stack for LE Audio

Retrieved on: 
Tuesday, March 10, 2020
Telecommunications, Wireless, Wireless networking, IEEE 802, Open standards, Bluetooth, IEEE 802.15, Stonestreet One, Bluetooth stack

LE Audio is the next generation of lower power, higher quality Bluetooth audio that operates on the Bluetooth Low Energy (LE) radio.

Key Points: 
  • LE Audio is the next generation of lower power, higher quality Bluetooth audio that operates on the Bluetooth Low Energy (LE) radio.
  • LE Audio is made possible by new features introduced in Bluetooth Core Specification version 5.2, which was published earlier this year by the Bluetooth SIG.
  • Since its founding in April 2019 Packetcraft has provided its leading Bluetooth LE software solution to multiple semiconductor companies and product companies.
  • Packetcraft's Bluetooth LE software solution consists of the following protocol stacks:
    Multi-protocol controller with Bluetooth link layer and IEEE 802.15.4 MAC.

New Wireless SoCs Enable Eco-Friendly Zigbee Green Power IoT Devices

Retrieved on: 
Wednesday, February 19, 2020
IEEE 802, Computer networking, Telecommunications, Computer networks, Building automation, Wireless networking, Wireless sensor network, Home automation, Zigbee, Silicon Labs, IEEE 802.15, Internet of things

The EFR32MG22 (MG22) family expands Silicon Labs' Zigbee portfolio by delivering the smallest, lowest power SoCs optimized for Zigbee Green Power applications.

Key Points: 
  • The EFR32MG22 (MG22) family expands Silicon Labs' Zigbee portfolio by delivering the smallest, lowest power SoCs optimized for Zigbee Green Power applications.
  • Energy-friendly Zigbee Green Power technology can help address environmental concerns by reducing residential, commercial and industrial energy footprints, one IoT device at a time.
  • Using the same 802.15.4 PHY and MAC of the already energy-efficient Zigbee 3.0 protocol, Zigbee Green Power further reduces power consumption by decreasing the amount of data required for wireless transmission.
  • From its inception, Zigbee Green Power was designed to be a highly efficient protocol enabling IoT devices, whether powered by batteries or by "battery-less" energy harvesting options.

Bluetooth IoT Market Set to Nearly Quadruple by 2024 as Smart Home Exceeds 800 Million Device Shipments

Retrieved on: 
Tuesday, January 14, 2020
Computer networking, Telecommunications, Wireless networking, Computing, Internet of things, Building automation, Home automation, Mesh networking, Bluetooth, Z-Wave, Wi-Fi, IEEE 802.15

LONDON, Jan. 14, 2020 /PRNewswire/ --The smart home market is forecasted to account for over 13% of Bluetooth device shipments by 2024, equating to over 815 million Bluetooth-enabled products at this time, finds global tech market advisory firm ABI Research.

Key Points: 
  • LONDON, Jan. 14, 2020 /PRNewswire/ --The smart home market is forecasted to account for over 13% of Bluetooth device shipments by 2024, equating to over 815 million Bluetooth-enabled products at this time, finds global tech market advisory firm ABI Research.
  • Wi-Fi, 802.15.4, and Z-Wave smart home products are all anticipated to see device shipments grow between now and 2024.
  • "The smart home market is made up of numerous different device types, each with their own specific throughput, power, range, and topology requirements.
  • Smart lighting device shipments will break the 300-million-unit barrier by 2024, with 60% of these based on 802.15.4 technology.

Bluetooth IoT Market Set to Nearly Quadruple by 2024 as Smart Home Exceeds 800 Million Device Shipments

Retrieved on: 
Tuesday, January 14, 2020
Computer networking, Telecommunications, Wireless networking, Computing, Internet of things, Building automation, Home automation, Mesh networking, Bluetooth, Z-Wave, Wi-Fi, IEEE 802.15

LONDON, Jan. 14, 2020 /PRNewswire/ --The smart home market is forecasted to account for over 13% of Bluetooth device shipments by 2024, equating to over 815 million Bluetooth-enabled products at this time, finds global tech market advisory firm ABI Research.

Key Points: 
  • LONDON, Jan. 14, 2020 /PRNewswire/ --The smart home market is forecasted to account for over 13% of Bluetooth device shipments by 2024, equating to over 815 million Bluetooth-enabled products at this time, finds global tech market advisory firm ABI Research.
  • Wi-Fi, 802.15.4, and Z-Wave smart home products are all anticipated to see device shipments grow between now and 2024.
  • "The smart home market is made up of numerous different device types, each with their own specific throughput, power, range, and topology requirements.
  • Smart lighting device shipments will break the 300-million-unit barrier by 2024, with 60% of these based on 802.15.4 technology.