Central processing unit

TECNO Introduces Two Mini PC Models at MWC24 Barcelona, Showcasing MEGA MINI Gaming G1 as the Industry's Smallest Water-Cooled Gaming Mini PC Redefining Standards

Retrieved on: 
Wednesday, February 28, 2024
Intel, Wi-Fi 6, Multimedia, Mobile, Nettop, MWC, DDR4, DDR5, MEGA, M1, Intel Turbo Boost, Graphics processing unit, Thunderbolt (interface), Ultra, PCI, Central processing unit, Video game

TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.

Key Points: 
  • TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.
  • The MEGA MINI Gaming G1 is cutting-edge hardware and cooling system design by integrating the latest generation of gaming CPUs and powerful dedicated GPUs.
  • It empowered by Intel®Core™ Ultra processor and also optional with 13th I9-13900H high-performance gaming processor, with Turbo Boost reaching up to 5.4GHz.
  • The MEGA MINI Gaming G1 is also designed with metal body with dazzling lights, very attractive by game users.

TECNO Introduces Two Mini PC Models at MWC24 Barcelona, Showcasing MEGA MINI Gaming G1 as the Industry's Smallest Water-Cooled Gaming Mini PC Redefining Standards

Retrieved on: 
Wednesday, February 28, 2024
Intel, Wi-Fi 6, Mobile, Nettop, MWC, DDR4, DDR5, MEGA, M1, Intel Turbo Boost, Graphics processing unit, Thunderbolt (interface), Ultra, PCI, Central processing unit, Video game

TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.

Key Points: 
  • TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.
  • The MEGA MINI Gaming G1 is cutting-edge hardware and cooling system design by integrating the latest generation of gaming CPUs and powerful dedicated GPUs.
  • It empowered by Intel®Core™ Ultra processor and also optional with 13th I9-13900H high-performance gaming processor, with Turbo Boost reaching up to 5.4GHz.
  • The MEGA MINI Gaming G1 is also designed with metal body with dazzling lights, very attractive by game users.

Supermicro Accelerates Performance of 5G and Telco Cloud Workloads with New and Expanded Portfolio of Infrastructure Solutions

Retrieved on: 
Monday, February 26, 2024
Cloud, Gigabit Ethernet, ARM, Generative, RAN, TB, LLM, 2U, A40, AS, A10, Central processing unit, Fujitsu, PCI Express, 3D, MWC, CPU, MIMO, Vodafone, Memory, AMD, Synchronous Ethernet, NEBS, A2, SAN, Total, IO, DDR5, Building block, Service, NVIDIA, Mobile World Congress, EPYC, Intel, AI, GNSS, Temperature, Samsung, Synthetic media, COTS, Graphics processing unit, H100, Video game

SAN JOSE, Calif., and BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel® Xeon® processors, AMD EPYC™ 8004 Series processors, and the NVIDIA Grace Hopper™ Superchip.

Key Points: 
  • "Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro.
  • Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption.
  • The platform's versatility empowers our customers to adapt our solutions to their specific needs, giving them control over their infrastructure.
  • Supermicro will demonstrate a wide range of solutions for the 5G and telco markets at MWC Barcelona 2024.

Supermicro Accelerates Performance of 5G and Telco Cloud Workloads with New and Expanded Portfolio of Infrastructure Solutions

Retrieved on: 
Monday, February 26, 2024
Cloud, Gigabit Ethernet, ARM, Generative, RAN, TB, LLM, 2U, A40, AS, A10, Central processing unit, Fujitsu, PCI Express, 3D, MWC, CPU, MIMO, Vodafone, Memory, AMD, Synchronous Ethernet, NEBS, A2, SAN, Total, IO, DDR5, Building block, Service, NVIDIA, Mobile World Congress, EPYC, Intel, AI, GNSS, Temperature, Samsung, Synthetic media, COTS, Graphics processing unit, H100, Video game

SAN JOSE, Calif., and BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel® Xeon® processors, AMD EPYC™ 8004 Series processors, and the NVIDIA Grace Hopper™ Superchip.

Key Points: 
  • "Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro.
  • Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption.
  • The platform's versatility empowers our customers to adapt our solutions to their specific needs, giving them control over their infrastructure.
  • Supermicro will demonstrate a wide range of solutions for the 5G and telco markets at MWC Barcelona 2024.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

Supermicro Drives Advanced AI Capabilities to Edge Computing Environments with New Industry-Leading System Portfolio

Retrieved on: 
Tuesday, February 20, 2024
Cloud, A2, SAN, Total, NVM Express, AI, Mobile, Temperature, Health, SAS, SYS, 3D, Internet of things, DDR5, H100, TB, Mobile World Congress, Memory, 2U, Graphics processing unit, Deep learning super sampling, A40, SATA, A10, Central processing unit, AC, NVIDIA, Video game

SAN JOSE, Calif., Feb. 20, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, is expanding its portfolio of AI solutions, allowing customers to leverage the power and capability of AI in edge locations, such as public spaces, retail stores, or industrial infrastructure. Using Supermicro application-optimized servers with NVIDIA GPUs makes it easier to fine-tune pre-trained models and for AI inference solutions to be deployed at the edge where the data is generated, improving response times and decision-making.

Key Points: 
  • "Supermicro has the broadest portfolio of Edge AI solutions, capable of supporting pre-trained models for our customers' edge environments," said Charles Liang, president and CEO of Supermicro.
  • Supermicro continues to provide the industry with optimized solutions as enterprises build a competitive advantage by processing AI data at their edge locations."
  • "The new Supermicro NVIDIA-Certified Systems, powered by the NVIDIA AI platform, are built to deliver the highest-performing accelerated computing infrastructure, as well as NVIDIA AI Enterprise software to help run edge AI workloads."
  • These GPUs give the Supermicro Hyper-E sufficient computing power to process AI workloads at edge environments where data is collected, analyzed, and stored.

Supermicro Drives Advanced AI Capabilities to Edge Computing Environments with New Industry-Leading System Portfolio

Retrieved on: 
Tuesday, February 20, 2024
Cloud, A2, SAN, Total, NVM Express, AI, Mobile, Temperature, Health, SAS, SYS, 3D, Internet of things, DDR5, H100, TB, Mobile World Congress, Memory, 2U, Graphics processing unit, Deep learning super sampling, A40, SATA, A10, Central processing unit, AC, NVIDIA, Video game

SAN JOSE, Calif., Feb. 20, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, is expanding its portfolio of AI solutions, allowing customers to leverage the power and capability of AI in edge locations, such as public spaces, retail stores, or industrial infrastructure. Using Supermicro application-optimized servers with NVIDIA GPUs makes it easier to fine-tune pre-trained models and for AI inference solutions to be deployed at the edge where the data is generated, improving response times and decision-making.

Key Points: 
  • "Supermicro has the broadest portfolio of Edge AI solutions, capable of supporting pre-trained models for our customers' edge environments," said Charles Liang, president and CEO of Supermicro.
  • Supermicro continues to provide the industry with optimized solutions as enterprises build a competitive advantage by processing AI data at their edge locations."
  • "The new Supermicro NVIDIA-Certified Systems, powered by the NVIDIA AI platform, are built to deliver the highest-performing accelerated computing infrastructure, as well as NVIDIA AI Enterprise software to help run edge AI workloads."
  • These GPUs give the Supermicro Hyper-E sufficient computing power to process AI workloads at edge environments where data is collected, analyzed, and stored.

Artificial Intelligence (AI) Supercomputer Market Research Report 2023: Focus on Processors/Compute, Storage, Memory, Interconnects - Global Forecast to 2028

Retrieved on: 
Monday, February 19, 2024
Cloud, Anomaly, Acquisition, IBM, Algorithm, AMD, Nvidia, USD, AI, Investment, Samsung Electronics, Growth, Contribution, High, Government, Pulse, Commercial, Intel, Private sector, Component, Data analysis, Graphics processing unit, Machine learning, Memory, Artificial intelligence, Central processing unit, Market development, Medical device

DUBLIN, Feb. 19, 2024 /PRNewswire/ -- The "Artificial Intelligence (AI) Supercomputer Market by Components (Processors/Compute, Storage, Memory, Interconnects), Deployment (Cloud, On-Premises), Application (Government, Academia and Research, Commercial) and Geography - Global Forecast to 2028" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Feb. 19, 2024 /PRNewswire/ -- The "Artificial Intelligence (AI) Supercomputer Market by Components (Processors/Compute, Storage, Memory, Interconnects), Deployment (Cloud, On-Premises), Application (Government, Academia and Research, Commercial) and Geography - Global Forecast to 2028" report has been added to ResearchAndMarkets.com's offering.
  • Market for commercial application in the AI supercomputer market to witness the fastest growth during the forecast period.
  • Market Development: Comprehensive information about lucrative markets; the report analyses the AI supercomputer market across various regions.
  • Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the AI supercomputer market.

$148 Billion Chiplet Market by Processor, Packaging Technology - Global Forecast to 2028

Retrieved on: 
Monday, February 19, 2024
HPC, AMD, Nvidia, USD, Chiplet, Artificial intelligence, Research, Investment, APU, WLCSP, IBM, Internet of things, CPU, Growth, Electronics, Big data, Intel, GPU, Field-programmable gate array, Ecosystem, Intellectual property, SIP, Gate array, Central processing unit, Apple Inc., Research report, College of Engineering (KNUST), FPGA, Graphics processing unit, Medical device

This research report categorizes the chiplet market on the basis of processor, packaging technology, end-use application, and region.

Key Points: 
  • This research report categorizes the chiplet market on the basis of processor, packaging technology, end-use application, and region.
  • The report describes the major drivers, restraints, challenges, and opportunities pertaining to the chiplet market and forecasts the same till 2028.
  • Asia Pacific is expected to hold a major market share for chiplet market during the forecast period.
  • Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the chiplet market