Central processing unit

Media Alert: Intel at Open Confidential Computing Conference 2024

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Friday, March 8, 2024
Software, Networks, Hardware, Artificial Intelligence, Data Management, Technology, Semiconductor, Security, Edgeless, Architecture, Growth, MMIO, Microsoft Azure, Coco, SDK, Acceleration, Trust (social science), Central processing unit, Workload, Hope for Justice, VM, SGX, TCB, OC3, CCNP, Memory, GPU, Pasupathy, AMD, BIOS, Microsoft, Ant Group, Partnership, Computer, HPC, Operational technology, Linux kernel interfaces, API, Azure, Safety, Data mapper pattern, CVM, Research, NRAS, Intel, AI, Risk, OS, Rest, Computer security software, Graphics processing unit, TEE, Justice, CPU

Clouds are varied in their infrastructure and multiple confidential computing vendors, each potentially with multiple product generations, offering confidential CPUs, GPUs and other special-purpose processing units.

Key Points: 
  • Clouds are varied in their infrastructure and multiple confidential computing vendors, each potentially with multiple product generations, offering confidential CPUs, GPUs and other special-purpose processing units.
  • Technical readiness and market momentum will converge in 2024 to accelerate growth and adoption of confidential computing.
  • Intel and Nvidia deliver confidential computing technologies that establish independent TEEs on the CPU and GPU, respectively.
  • Intel technology enables the Private Data Exchange to leverage confidential computing, which processes sensitive data out of view from unauthorized software or system administrators.

Keysight and AMD Break Barriers to Redefine Benchmarking for Cloud and Edge Infrastructure Performance

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Tuesday, March 5, 2024
5G, Telecommunications, Software, Networks, Hardware, Technology, Semiconductor, Mobile, Wireless, AMD, Growth, Human, Automation, XR, Corporation, Benchmarking, Central processing unit, CPU, Video game

Given this transformation, comprehensive infrastructure benchmarking is critical to ensure optimal performance across a spectrum of industry use cases.

Key Points: 
  • Given this transformation, comprehensive infrastructure benchmarking is critical to ensure optimal performance across a spectrum of industry use cases.
  • To provide more realistic performance benchmarks, Keysight in collaboration with AMD developed an integrated test case methodology that takes into account the processing power of central processing units (CPUs).
  • The methodology was developed by deploying Keysight’s software tools onto AMD EPYC™ processors to conduct staged test cases with realistic traffic at scale.
  • When used, it highlights the prowess of the AMD ‘Zen 4’ chiplet architecture to meet complex demands in those networks.”

Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications

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Wednesday, February 28, 2024
Semiconductor, Vehicle Technology, Technology, Automotive, Artificial Intelligence, Cloud, CDNS, Halide, MAC, Robotics, Algorithm, Multimedia, Socs, AI, Cadence Design Systems, ADAS, Language, Silicon, TIE, PCL, Vision, NMS, Prevalence, Safety, Point Cloud Library, OpenCL, SDK, Ecosystem, Acceleration, SOC, DSP, DSPS, Graphics processing unit, Central processing unit, Telescopic sight

The new high-performance Cadence® Tensilica® Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area.

Key Points: 
  • The new high-performance Cadence® Tensilica® Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering the best energy efficiency in the smallest area.
  • When paired with the new Cadence Tensilica Vision 4DR Accelerator optimized for 4D imaging radar applications, customers can achieve even greater radar performance and higher energy efficiency.
  • View the full release here: https://www.businesswire.com/news/home/20240228430265/en/
    Cadence expanded its Tensilica IP portfolio with two new Vision DSPs and a radar accelerator to address automotive sensor fusion applications.
  • We continue to use Cadence Tensilica Vision DSPs in our products and welcome the new DSPs that can accommodate both cameras and radar.

Intel Brings AI Everywhere Across Network, Edge, Enterprise

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Monday, February 26, 2024
Data Management, Carriers and Services, Technology, Semiconductor, Telecommunications, Software, Artificial Intelligence, Networks, Mobile, Wireless, 5G, Hardware, NEC, Investment, RAN, L&T Technology Services, EDGE Group, Sierra Forest, Ericsson, Organization, Artificial intelligence, Acceleration, Radio access network, Hewlett Packard Enterprise, Xeon, Central processing unit, Amazon Web Services, MWC, Vodafone, Radio, SK Telecom, HPE, Sapphire Rapids, Ecosystem, Verizon Business, Microsoft, Deutsche Telekom, Environment, SAP, Carbon, KDDI, Network, Automation, Dell Technologies, SOC, Research, PSG, Intel, BT Group, Mavenir, TCO, AI, Intelligence, Wipro, Samsung, Silicon, Glass, AT&T, Red Hat, Ultra, CPU

At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel® Core™ Ultra processors and the AI PC, and more.

Key Points: 
  • At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel® Core™ Ultra processors and the AI PC, and more.
  • Across today’s announcements, Intel is focused on empowering the industry to further modernize and monetize 5G, edge and enterprise infrastructures and investments, and to take advantage of bringing AI Everywhere.
  • Intel is working with AT&T, Deutsche Telekom, SK Telecom and Vodafone to showcase the benefits AI can bring to the RAN.
  • On day two of MWC 2024, Intel and Microsoft will host an AI PC industry reception at the Intel booth.

Lenovo’s Cutting-Edge ThinkPad and ThinkBook Laptops Pave the Way for AI PC Innovation at MWC

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Sunday, February 25, 2024
Data Management, Consumer Electronics, Online Retail, Technology, Specialty, Retail, Software, Artificial Intelligence, Networks, Mobile, Wireless, Hardware, Carbon, SMB, Motorola, ThinkVision, Smart Power, WWAN, Sale, Acceleration, PET, Microsoft Store, Central processing unit, Social media, Hotspot, ThinkPad X1 series, Google Play, USB, Repairability, Health, Electronics, Touchpad, CRU, Post, RFI, AMD, Ecosystem, Somatosensory system, Portrait, Windows 11, Longevity, ThinkPad, Law enforcement, Environment, Pressure, SSD, Pointing stick, T16, Multimedia, FN, ThinkPad T series, VAT, Electronic waste, CTRL, Intel Core, First officer (aviation), Life, System, Safety, Smartphone, DIMM, Creativity, Recycling, IPS, Artificial intelligence, Insurance, Theft, SRGB, Internet, Intel, AI, Digital, Data management, WUXGA, ThinkBook, Backpack, Plastic, Privacy, Travel, Video game

These include brand new ThinkPad and ThinkBook business laptops – unveiling AI features that enhance productivity, creativity, and efficiency – with performance enhancements and multi-mode versatility.

Key Points: 
  • These include brand new ThinkPad and ThinkBook business laptops – unveiling AI features that enhance productivity, creativity, and efficiency – with performance enhancements and multi-mode versatility.
  • Introducing the latest generation of business laptops from Lenovo - the ThinkPad T14 i Gen 5, ThinkPad T14s Gen 5, ThinkPad T16 Gen 3, ThinkPad X12 Detachable Gen 2 and ThinkBook 14 2-in-1 Gen 4.
  • The AI PC revolution is here, and Lenovo is dedicated to transforming its PCs and smart devices to deliver personalized AI solutions.
  • “Our new ThinkPad and ThinkBook business laptops are not just powerful and versatile but also showcase AI features that enhance productivity, creativity, and efficiency.

Intel Unleashes 2.7x Performance per Rack Improvement for 5G Core

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Monday, February 26, 2024
Software, Mobile, Wireless, Networks, Internet, Hardware, Data Management, Apps, Applications, Technology, Artificial Intelligence, Semiconductor, 5G, Other Technology, Telecommunications, Intel, TCO, IPM, Central processing unit, Sierra Forest, Xeon, Face, Computer data storage

“Communication service providers require greater infrastructure efficiency as 5G core networks continue to build out.

Key Points: 
  • “Communication service providers require greater infrastructure efficiency as 5G core networks continue to build out.
  • With the majority of 5G core networks deployed on Intel Xeon processors today, Intel is uniquely positioned to address these efficiency challenges.
  • Intel Xeon next-gen processors, code-named Sierra Forest, launching later this year will offer up to 288 cores and help operators recognize a 2.7x performance per rack1 improvement – an industry leading performance per rack for 5G Core workloads2.
  • Intel is collaborating closely with operators and 5G core software suppliers to deploy the new processors and Intel Infrastructure Power Manager software.

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

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Thursday, February 22, 2024
Robotics, Semiconductor, IOT (Internet of Things), Technology, Artificial Intelligence, Internet, Hardware, International, Architecture, Multimedia, ISSCC, AI, IPS, Renesas Electronics, SLAM, DRP, Conference, CNN, Automation, Environment, Central processing unit, Software, CPU, Video game

The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.

Key Points: 
  • The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.
  • View the full release here: https://www.businesswire.com/news/home/20240222749810/en/
    Dynamically Reconfigurable Processor AI technology from Renesas enables higher speeds and lower power consumption in microprocessor units (MPUs) that realize advanced vision AI.
  • The technologies developed by Renesas are as follows:
    As a typical technology for improving AI processing efficiency, pruning is available to omit calculations that do not significantly affect recognition accuracy.
  • That is why Renesas introduced a dynamically reconfigurable processor (DRP), which handles complex processing, in addition to the CPU and AI accelerator (DRP-AI).

Efficient Computer Emerges from Stealth to Introduce World's Most Energy-Efficient General-Purpose Computer Chip

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Thursday, March 7, 2024
Eclipse, Life, Organization, Intelligence, Freedom, Architecture, Software, Internet, Central processing unit, Communication, Video game

PITTSBURGH, March 7, 2024 /PRNewswire/ -- Efficient Computer emerged from stealth today, introducing a new computer processor that is up to 100x more energy efficient than leading general-purpose CPUs on the market today. With a $16 million seed funding round led by Eclipse, Efficient has created a transformative computer architecture and software stack that delivers unprecedented levels of energy efficiency. The introduction of Efficient's processor marks the beginning of a new era of general-purpose edge computing that frees a wide range of applications from restrictive energy limitations. The technology enables a quantum leap in device capabilities and battery lifetime, unleashing a wave of innovations in devices and applications across the Internet of Things, wearable and implantable health devices, space systems, and security and defense. 

Key Points: 
  • PITTSBURGH, March 7, 2024 /PRNewswire/ -- Efficient Computer emerged from stealth today, introducing a new computer processor that is up to 100x more energy efficient than leading general-purpose CPUs on the market today.
  • With a $16 million seed funding round led by Eclipse , Efficient has created a transformative computer architecture and software stack that delivers unprecedented levels of energy efficiency.
  • Devices in these domains are increasingly doing more processing locally, creating a demand for more efficient on-device computing solutions.
  • Shifting computation on-device can save large amounts of energy by avoiding expensive off-device communication to the cloud.

Taalas emerges from stealth with $50 million in funding and a groundbreaking silicon AI technology

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Tuesday, March 5, 2024
Engineering, Transformers, Multimedia, National Semiconductor, AI, Moe's, Silicon, Intelligence, Computer, Growth, SQL, Sequoia, GPU, AMD, Organization, Artificial intelligence, Graphics processing unit, Central processing unit, NVIDIA, Video game

TORONTO, March 5, 2024 /PRNewswire/ - Taalas Inc., an innovator in AI and silicon, is pleased to announce today that it has exited stealth mode and raised $50 million dollars over two rounds of funding led by Pierre Lamond and Quiet Capital.

Key Points: 
  • TORONTO, March 5, 2024 /PRNewswire/ - Taalas Inc., an innovator in AI and silicon, is pleased to announce today that it has exited stealth mode and raised $50 million dollars over two rounds of funding led by Pierre Lamond and Quiet Capital.
  • Over the last year, AI has undergone a large scale productization and has already begun reshaping the world.
  • Concurrently, deep learning models have become the world's most demanding computational workload, unsustainably capital intensive, power hungry, and GPU constrained.
  • Implementing deep learning models in silicon is the straightest path to sustainable AI," said Ljubisa Bajic, Taalas' CEO.

ScaleFlux Leads the Charge in Sustainable IT Solutions Amidst AI Data Boom

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Tuesday, March 5, 2024
Acquisition, SSD, Carbon footprint, Artificial intelligence, AI, Growth, ESG, Gartner, Carbon, Head, Electricity, Machine learning, Solid-state drive, Central processing unit, CSD, Renewable energy

MILPITAS, Calif., March 5, 2024 /PRNewswire-PRWeb/ -- In a world increasingly driven by artificial intelligence (AI) and data analytics, the IT sector faces significant environmental and financial sustainability challenges. Enterprises and data centers are grappling with the soaring computational needs and power required to handle AI and other data engineering demands. ScaleFlux, a pioneering IT company, is addressing these challenges head-on with its innovative Solid-State Drive (SSD), the CSD 3000, which integrates storage with computational capabilities to significantly lower energy use and operational costs while supporting high-performance data processing.

Key Points: 
  • Enterprises and data centers are grappling with the soaring computational needs and power required to handle AI and other data engineering demands.
  • As AI projects demand high-performance, efficient, and reliable data storage, the need for solutions that can manage large and complex data sets efficiently becomes increasingly apparent.
  • ScaleFlux is not merely responding to the current demand for more sustainable data processing technologies; it is actively shaping the future of the IT industry.
  • For more detailed information on how the CSD 3000 can transform your data center's efficiency and sustainability, visit ScaleFlux .