Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022
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Monday, September 19, 2022
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Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022 in Basel, Switzerland ( https://www.ecocexhibition.com/ ).
Key Points:
- Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2022 in Basel, Switzerland ( https://www.ecocexhibition.com/ ).
- Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, Smart NICs, hardware accelerators, and high-performance shared memory.
- Ever growing Artificial Intelligence (AI)/Machine Learning (ML) and High-Performance Computing (HPC) workloads are driving the need for interconnects with ultra-high bandwidth density, ultra-low power consumption, and low latency.
- We have already demonstrated LightBundleTM links running at less than 1pJ/bit, says Bardia Pezeshki, founder and CEO of Avicena, Here at ECOC 2022 we are demonstrating individual microLED links running at 14Gbps.