CEKD Berhad Signs IPO Underwriting Agreement with M&A Securities
KUALA LUMPUR, Aug 2, 2021 - (ACN Newswire) - CEKD Berhad ("CEKD" or the "Company"), a die-cutting solutions provider as well as manufacturer of die-cutting moulds and trader of related consumables, tools and accessories, has on even date signed an underwriting agreement with M&A Securities Sdn Bhd ("M&A Securities").
- KUALA LUMPUR, Aug 2, 2021 - (ACN Newswire) - CEKD Berhad ("CEKD" or the "Company"), a die-cutting solutions provider as well as manufacturer of die-cutting moulds and trader of related consumables, tools and accessories, has on even date signed an underwriting agreement with M&A Securities Sdn Bhd ("M&A Securities").
- This underwriting agreement is a precursor to the upcoming initial public offering ("IPO") of the Company on the ACE Market of Bursa Malaysia Securities Berhad ("Bursa Securities") that will take place in September 2021.
- Under the agreement, M&A Securities will underwrite 19.46 million of the total proposed issue of shares allocated to the Malaysian public or through pink forms.
- Managing Director of CEKD Berhad, Ms. Yap Kai Ning said, "The signing of the underwriting agreement brings us closer towards our goal of taking CEKD public through an IPO.