HPC

OSS Wins U.S. Intelligence AI Project for Liquid Immersion-Cooled Storage Server at the Edge

Retrieved on: 
Tuesday, March 12, 2024
Department of Defence, Intel, SDS, Intelligence, Navy, OSS, NVM Express, HPC, Electronics, Artificial intelligence, Acquisition, AI, Water, Centauri, Solid-state drive, Machine learning, Defense, Video game

Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.

Key Points: 
  • Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.
  • OSS will integrate two 3U-SDS units into a liquid immersion-cooled system which will be a part of a deployable ground station at the edge.
  • The custom storage accelerator system will be ruggedized for the harshest of edge environments.
  • The OSS SDS storage system is also available for commercial and industrial use and can be ordered directly from OSS sales engineers at [email protected] or +1 (877) 438-2724.

Advantest to Exhibit Latest Test Solutions at SEMICON China, March 20-22 in Shanghai

Retrieved on: 
Tuesday, March 12, 2024
IEEE 802.11be, PKG, Socs, ICS, RDK, OTA, Silicon carbide, SOC, LCD, Conference, WiGig, Gallium nitride, Internet of things, WLBI, DRAM, HPC, Integrated circuit, AI, Wi-Fi, IP, CREA, CP, Future, Advantest, CIS, Printed circuit board

TOKYO, March 12, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON China 2024 on March 20-22 at the Shanghai New International Exhibit Center (SNIEC).

Key Points: 
  • TOKYO, March 12, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON China 2024 on March 20-22 at the Shanghai New International Exhibit Center (SNIEC).
  • In a unique application-based exhibit, Advantest will highlight how its test technology enables leading-edge innovations in high-performance computing (HPC), AI, automotive, IoT and 5G.
  • Advantest aims to develop test technology that supports a safe, secure and sustainable society, showcasing its sustainability initiatives at this year's event.
  • Wide-ranging DRAM turn-key test solutions, including wafer-level burn-in, DRAM wafer test, core final test, and at-speed interface test.

Vertiv Unveils End-to-End AI Power and Cooling Solutions to Simplify Data Center Infrastructure Selection and Deployment in North America

Retrieved on: 
Thursday, April 4, 2024
Data Management, Technology, Other Technology, Software, Artificial Intelligence, Hardware, VRT, HPC, AI, UPS, Multimedia, Artificial intelligence, BESS

The new Vertiv™ 360AI solutions are designed to accelerate AI adoption through pre-engineered infrastructure solutions, digitized management, and end-to-end service, resulting in up to 2x faster deployment compared to typical infrastructure installation.

Key Points: 
  • The new Vertiv™ 360AI solutions are designed to accelerate AI adoption through pre-engineered infrastructure solutions, digitized management, and end-to-end service, resulting in up to 2x faster deployment compared to typical infrastructure installation.
  • View the full release here: https://www.businesswire.com/news/home/20240404873987/en/
    The new Vertiv™ 360AI solutions are designed to accelerate AI adoption through pre-engineered infrastructure solutions, digitized management, and end-to-end service, resulting in up to 2x faster deployment compared to typical infrastructure installation.
  • Vertiv 360AI solutions enable customers to realize faster deployment by eliminating design cycles and minimizing the likelihood of issues during installation and commissioning.
  • The Vertiv™ 360AI solutions will be presented during the first scheduled stop of the North America tour of the Vertiv AI Solutions Innovation Roadshow , April 10 in Westerville, Ohio.

Nadav Eiron Joins Crusoe as Senior Vice President of Cloud Engineering

Retrieved on: 
Wednesday, April 3, 2024
Hardware, Data Management, Green Technology, Technology, Carriers and Services, Apps, Applications, Environmental Policy, Environment, Environmental Issues, Environmental Health, Artificial Intelligence, Other Technology, Telecommunications, Software, Networks, Internet, Eiron, Growth, Intelligence, HPC, Artificial intelligence, AI, IBM, Senior, Thought, Architecture, Software engineering, Cloud engineering, Multimedia, Video game

Crusoe Energy Systems LLC (“Crusoe”) announced today that Nadav Eiron has joined the company as a Senior Vice President to lead the Cloud Engineering team in Crusoe’s San Francisco office.

Key Points: 
  • Crusoe Energy Systems LLC (“Crusoe”) announced today that Nadav Eiron has joined the company as a Senior Vice President to lead the Cloud Engineering team in Crusoe’s San Francisco office.
  • Eiron will lead Crusoe’s efforts to scale its Cloud platform, purpose-built for artificial intelligence and high-performance computing workloads.
  • With decades of experience at Google and IBM, Eiron will keep Crusoe at the forefront of architecture and usability innovation across cloud infrastructure, artificial intelligence, and team leadership.
  • As Crusoe’s Senior Vice President for Software Engineering, Eiron will have broad impact over Crusoe Cloud’s architecture, design, software and infrastructure engineering and installation as the platform continues to scale.

Global Hybrid Memory Cube and High-Bandwidth Memory Industry Research 2023-2033: Increasing Focus on Energy-Efficient Technology Solutions and Growing Applications of Edge-Based Technologies - ResearchAndMarkets.com

Retrieved on: 
Monday, April 1, 2024
Telecommunications, Software, Networks, Artificial Intelligence, Data Management, Technology, IOT (Internet of Things), Security, Micrometre, HBM, Data wrangling, GPU, Memory, Name, Internet of things, HPC, Artificial intelligence, AI, Graphics processing unit, HMC, AMD, Region, Machine learning, Hybrid Memory Cube, NVIDIA, Video game

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.

Key Points: 
  • Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.
  • Hybrid memory cubes and high-bandwidth memory offer significant memory bandwidth improvements, particularly beneficial for GPUs in graphics rendering and parallel computing.
  • What are the major patents filed by the companies active in the global hybrid memory cube and high-bandwidth memory market?
  • What is the future outlook for the hybrid memory cube and high-bandwidth memory market in terms of growth potential and technological advancements?

Hunter Point Capital Raises Record $3.3 Billion for Debut GP Stakes Fund

Retrieved on: 
Friday, March 29, 2024
Asset Management, Professional Services, Finance, Coller Capital, Partner, GP, Growth, Entrepreneurship, MidOcean Partners, Partnership, HPC, Insurance, LP record

Hunter Point Capital (“HPC”), an independent investment firm providing capital solutions and strategic support to alternative asset managers, today announced the close of its inaugural GP Stakes fund (“HPC Fund I”) with $3.3 billion in permanent capital commitments, exceeding its initial $2.5 billion target.

Key Points: 
  • Hunter Point Capital (“HPC”), an independent investment firm providing capital solutions and strategic support to alternative asset managers, today announced the close of its inaugural GP Stakes fund (“HPC Fund I”) with $3.3 billion in permanent capital commitments, exceeding its initial $2.5 billion target.
  • HPC Fund I is the largest-ever debut GP Stakes fund dedicated to private market strategies.
  • Through HPC Fund I, the firm acquires stakes in alternative investment managers and provides them with strategic and tactical support in key areas such as capital formation, business development, group purchasing, and talent enhancement.
  • Commitments to HPC Fund I were secured from a broad base of both institutional and high-net-worth investors.

Longtime Security Industry Leader Art Coviello Joins Netography Board of Directors

Retrieved on: 
Wednesday, March 27, 2024
Technology, Networks, Data Management, Security, RSA, Conference, HPC, Security Division (Wehrmacht), Coviello, Acquisition, Art, AI, Architecture, RSA Security, LLM, EMC, RSA Conference, Movement, NDP, Management

Netography® , the security company for the Atomized Network, today announced that Art Coviello joined the company as its newest Board Member.

Key Points: 
  • Netography® , the security company for the Atomized Network, today announced that Art Coviello joined the company as its newest Board Member.
  • Coviello brings over 25 years of cybersecurity operational experience to the Netography Board and will provide guidance on the organization’s strategic growth and leadership as it addresses today’s network security challenges.
  • Coviello served as President and CEO of RSA Security and, following its acquisition by EMC, he served as Executive Chairman of the company's Security Division.
  • The industry need that Netography solves made my decision to join the Board and support this company an easy one.”
    Since RSA, Coviello has continued his career in the technology industry as an active investor and advisor.

SMART Modular Technologies Introduces Zefr ZDIMM Memory Modules with Ultra-High Reliability for Demanding Compute Applications

Retrieved on: 
Tuesday, March 26, 2024
Apps, Applications, Technology, Semiconductor, Security, Other Technology, Software, Internet, Hardware, Electronic Design Automation, Data Management, SGH, DRAM, DDR4, HPC, DDR5, Multimedia, SMART

SMART Modular Technologies, Inc. (“SMART”) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules.

Key Points: 
  • SMART Modular Technologies, Inc. (“SMART”) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules.
  • View the full release here: https://www.businesswire.com/news/home/20240326690949/en/
    SMART Modular’s Zefr ZDIMM ultra-high reliability memory modules are ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms and other environments that run large memory applications.
  • ZDIMM modules undergo a screening process that replicates real-world conditions which ensures the robustness and resilience of ZDIMM modules in the most demanding computing scenarios.
  • Zefr, ZDIMM, the stylized “S” and “SMART” as well as “SMART Modular Technologies” are trademarks or registered trademarks of SMART Modular Technologies, Inc. All other trademarks and registered trademarks are the properties of their respective owners.

Tachyum Solidifies Reliability, Availability and Serviceability of Prodigy Universal Processor

Retrieved on: 
Tuesday, March 26, 2024
Data Management, Semiconductor, Technology, Networks, Artificial Intelligence, Internet, Hardware, Prodigy, GTC, PSU, CAPEX, OPEX, Device, GPU, Learning, Memory, Risk, RAS, HPC, AI, Linux, Stock, Nvidia, Parity, Universal, NIC, EF, Economics, Availability, Silicon, Video game

Additional RAS features built into Prodigy include:

Key Points: 
  • Additional RAS features built into Prodigy include:
    Tachyum has incorporated redundant power supply unit (PSU) fans, network interface card (NIC) and efficient maintenance into its Prodigy evaluation platform.
  • When launched, Tachyum will offer data center family SKUs with a 5-year warranty/support period and 10-year warranty/support periods for enterprise/telco family SKUs.
  • The Tachyum RAS paper complements an earlier Tachyum white paper which showcased a large Prodigy lead customer data center designed to run 8,000 EF of AI performance where RAS will be a critical component.
  • Those interested in learning more about Tachyum’s RAS strategy and how it extends reliability, availability and serviceability in the data center can download the full white paper at https://www.tachyum.com/resources/whitepapers/2024/03/26/tachyum-prodigy... .

Spirent Showcases Advanced Ethernet Validation Solutions at OFC 2024

Retrieved on: 
Tuesday, March 26, 2024
Technology, Mobile, Wireless, Engineering, Manufacturing, 5G, Other Technology, Telecommunications, Software, Networks, Internet, Hardware, Semiconductor, Data Management, Security, AOI, OSFP, Appliance, Khosla, Artificial intelligence, Spirent, CIG, IEEE, QSFP-DD, Product management, Optoelectronics, Ethernet Alliance, 100 Gigabit Ethernet, Partnership, SVP, SPT, Communication, Amphenol, TE Connectivity, M1, LPO, Research, AI, Architecture, Exhibition, AMD, B3, GM, Conference, Environment, LRO, HPC, Ecosystem, Medical device

The latest of its test platforms for validating the reliability, high performance, and interoperability of Ethernet technologies, the B3 Appliance will debut at the 2024 OFC Conference and Exhibition in San Diego, March 26-28 in booth #1515.

Key Points: 
  • The latest of its test platforms for validating the reliability, high performance, and interoperability of Ethernet technologies, the B3 Appliance will debut at the 2024 OFC Conference and Exhibition in San Diego, March 26-28 in booth #1515.
  • As a vendor-neutral test system, the Spirent B3 800G Appliance will help accelerate 800G deployments to enable the networking industry to power new applications running AI/ML.
  • “High density 800G test solutions are critical for validating the performance of 800G modules,” said Gerry Wong, CEO at CIG.
  • In today’s environment, where time-to-market of next-gen solutions is condensed, test and assurance solutions capable of evaluating beta technologies are invaluable.