High Density Packaging User Group Announces Advanced Micro Devices (AMD) Membership
AUSTIN, Texas, Aug. 29, 2022 /PRNewswire-PRWeb/ -- High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD) has become a member.
- High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD) has become a member.
- AUSTIN, Texas, Aug. 29, 2022 /PRNewswire-PRWeb/ -- High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD) has become a member.
- "I am pleased to welcome AMD to HDP, joining the outstanding companies working on HDP User Group projects.
- Madan Jagernauth, High Density Packaging User Group, 1 561-501-1567, [email protected]