Semiconductor industry

India Semiconductor Market Outlook Report 2022-2027: Increasing Demand by End-user Industries and Increasing Adoption for Smart Devices Driving Industry Growth - ResearchAndMarkets.com

Retrieved on: 
Wednesday, January 18, 2023

India Semiconductor Market Outlook to 2027 provides a comprehensive analysis of the semiconductor industry by analyzing historical statistics and corresponding developments in the semiconductor market.

Key Points: 
  • India Semiconductor Market Outlook to 2027 provides a comprehensive analysis of the semiconductor industry by analyzing historical statistics and corresponding developments in the semiconductor market.
  • The report also focuses on the Semiconductor Manufacturing Market Segmentation by type of semiconductors, type of design, region, type of application, type of distribution channel and type of distributors.
  • India Semiconductor Manufacturing Industry report concludes with projections for the future of the industry including forecasted market size by 2027, and analysts' take on the future highlighting the major opportunities.
  • With internet penetration expected to reach 900 million users in the next few years from 622 million users in 2020, there will be an increasing adoption of smart devices, hence, contributing to the semiconductor market growth.

Global Thin Wafer Processing and Dicing Equipment Market Report 2022 to 2027 - Players Include ASM Pacific Technology, DISCO, Lam Research and Panasonic System Solutions - ResearchAndMarkets.com

Retrieved on: 
Monday, December 12, 2022

Market dynamics are forces that impact the prices and behaviors of the Global Thin Wafer Processing and Dicing Equipment Market stakeholders.

Key Points: 
  • Market dynamics are forces that impact the prices and behaviors of the Global Thin Wafer Processing and Dicing Equipment Market stakeholders.
  • The report presents a detailed Ansoff matrix analysis for the Global Thin Wafer Processing and Dicing Equipment Market.
  • The report offers a comprehensive evaluation of the Global Thin Wafer Processing and Dicing Equipment Market.
  • The Global Thin Wafer Processing and Dicing Equipment Market is segmented based on Equipment, Wafer Thickness, Wafer Size, Dicing Technology, Application and Geography.

Analog Devices Announces World’s First Long-Reach, Single-pair Power over Ethernet (SPoE) Solutions for Smart Building and Factory Automation

Retrieved on: 
Wednesday, November 16, 2022

Analog Devices, Inc. (Nasdaq: ADI) today announced the worlds first Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) solutions to help customers drive greater levels of intelligence into smart buildings, factory automation, and other applications at the edge of traditional networks.

Key Points: 
  • Analog Devices, Inc. (Nasdaq: ADI) today announced the worlds first Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) solutions to help customers drive greater levels of intelligence into smart buildings, factory automation, and other applications at the edge of traditional networks.
  • The new offerings facilitate powered, last-mile connectivity for factory and building automation through real-time power management, telemetry, extremely low standby power consumption, and ease of installation.
  • View the full release here: https://www.businesswire.com/news/home/20221116005175/en/
    Analog Devices announces worlds first long-reach, Single-pair Power over Ethernet (SPoE) solutions for smart building and factory automation.
  • Analog Devices new SPoE solutions, LTC4296-1 and LTC9111 , address the challenges of providing power and data to devices, even in remote, difficult to access endpoint locations.

Promex Expands Die Bonding Capacity, Adds New Capabilities

Retrieved on: 
Tuesday, October 4, 2022

SANTA CLARA, Calif., Oct. 04, 2022 (GLOBE NEWSWIRE) -- Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services. The company has installed a new 2200 evo plus die bonder from BE Semiconductor Industries (Besi) on its production line, adding significant capacity, as well as enhanced accuracy, productivity and flexibility for customer projects targeting a range of key end markets, including medical, biotech and automotive.

Key Points: 
  • The state-of-the-art 2200 evo plus joins Promexs existing lineup of die bonders, including three additional Besi systems.
  • The robustness and life expectancy of Besi tools, together with new capabilities integrated into the now fourth generation of the 2200 evo plus, contributed to its selection.
  • With the addition of the 2200 evo plus system, we see great opportunity to secure a broader range of advanced die bonding projects from both new and existing customers.
  • Founded in 1975, Silicon Valley-based Promex provides design-for-manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production.

SRAX to Host the Sequire Semiconductor Conference on September 15th With Influential Companies, Expert Keynotes, and Investor 1:1s

Retrieved on: 
Tuesday, September 6, 2022

SRAX and Sequire are bringing together experts in manufacturing, engineering, as well as equipment and materials supply to learn more about this booming industry.

Key Points: 
  • SRAX and Sequire are bringing together experts in manufacturing, engineering, as well as equipment and materials supply to learn more about this booming industry.
  • The passing of the CHIPS and Science Act means that the Semiconductor Industry is top of mind for investment.
  • Notable participating companies include event sponsor SmartKem, Inc. (SMTK), Transphorm Technology Inc. (TGAN), Aeluma, Inc. (Private), Guerrilla RF (GUER), and Odyssey Semiconductor, Inc. (ODII).
  • This years semiconductor conference is sponsored by SmartKem, Inc., Guerrilla RF Inc., and Meta Materials Inc., and Transphorm Technology Inc. (TGAN).

Global Intelligent Power Module Market Report 2022-2027: Growing Adoption of GaN and SiC Materials in Automobile and Power Semiconductor Applications Fueling Expansion - ResearchAndMarkets.com

Retrieved on: 
Monday, July 25, 2022

The "Global Intelligent Power Module Market by Voltage Rating (Up to 600 V, 601-1,200 V, Above 1,200 V), Current Rating, Circuit Configuration (6-Pack, 7-Pack), Power Devices (IGBT, MOSFET), Vertical, and Region (North America, Europe, APAC, RoW) - Forecast to 2027" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Intelligent Power Module Market by Voltage Rating (Up to 600 V, 601-1,200 V, Above 1,200 V), Current Rating, Circuit Configuration (6-Pack, 7-Pack), Power Devices (IGBT, MOSFET), Vertical, and Region (North America, Europe, APAC, RoW) - Forecast to 2027" report has been added to ResearchAndMarkets.com's offering.
  • The global intelligent power module market is anticipated to grow from USD 1.8 billion in 2022 to USD 3 billion by 2027, at a CAGR of 10.7% from 2022 to 2027.
  • Rising requirements for power generation through renewable sources, focus of OEMs on providing novel and efficient energy and power monitoring modules as well as surging demand for IPMs in industrial, automotive and consumer electronics vertical are some of the major factors propelling the growth of intelligent power module market.

Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers

Retrieved on: 
Monday, March 28, 2022

(SDK) (TOKYO: 4004) has launched mass production of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which are used as materials for SiC epitaxial wafers*1 to be processed and installed into SiC-based power semiconductors (SiC power semiconductors).

Key Points: 
  • (SDK) (TOKYO: 4004) has launched mass production of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which are used as materials for SiC epitaxial wafers*1 to be processed and installed into SiC-based power semiconductors (SiC power semiconductors).
  • As an independent supplier of SiC epitaxial wafers, SDK has the global-top share in the market, and has been providing power-device manufacturers with Best in Class SiC epitaxial wafers.
  • SDK has been considering in-house production of SiC wafers, which are used as main material for SiC epitaxial wafers, aiming to improve quality of our SiC epitaxial wafers and establish a stable supply system for them.
  • This time, SDK decided to launch in-house mass production of 6-inch SiC wafers because plural customers have adopted SDK's SiC epitaxial wafers made from our in-house produced 6-inch SiC wafers.

Micross is Now the Provider of ISOCOM Ltd. Products in the USA & India

Retrieved on: 
Wednesday, February 23, 2022

Thomas Bayat, CEO and Managing Director ISOCOM Limited, reported, "We are delighted to have appointed Micross Components as our distributor in the United States of America and India.

Key Points: 
  • Thomas Bayat, CEO and Managing Director ISOCOM Limited, reported, "We are delighted to have appointed Micross Components as our distributor in the United States of America and India.
  • Our alignment with ISOCOM Limited will prove invaluable as we look to solve our customers' Optoelectronic and Power components needs.
  • We are excited to bring ISOCOM's progressive product lines and technology to the markets in the USA and India."
  • For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets.

RF Semiconductor Market Records 7.44% Y-O-Y Growth Rate in 2021 | Broadcom Inc. and Cree Inc. Among Key Vendors| Technavio

Retrieved on: 
Friday, January 7, 2022

The RF semiconductor market is fragmented, and the vendors are deploying various organic and inorganic growth strategies to compete in the market.

Key Points: 
  • The RF semiconductor market is fragmented, and the vendors are deploying various organic and inorganic growth strategies to compete in the market.
  • Download FreeSample Report
    The RF semiconductor market share growth in APAC will be significant during the forecast period.
  • The growing demand for RF devices from automotive applications will drive the RF semiconductor market growth in APAC during the forecast period.
  • Increasing demand for RF devices for smartphones:
    The increasing penetration of smartphones is driving the demand for RF semiconductor devices.

Flip Electronics Announces Dennis Segers, Industry Veteran, as Board Member

Retrieved on: 
Thursday, July 22, 2021

Dennis also served as an executive of the company from 1993 to 2001.

Key Points: 
  • Dennis also served as an executive of the company from 1993 to 2001.
  • Dennis has 40 years of experience in the semiconductor industry and has served as a board member and advisor to several venture capital-backed startups, as well as private and public companies.
  • In addition to Xilinx, Dennis also serves as an independent director for Parade Technologies, Ltd., a leading provider of display timing and control technologies for the consumer electronics industry.
  • Jason Murphy, CEO of Flip, remarked, "Dennis' vast experience and background in the semiconductor component industry will be instrumental to Flip as our business continues its aggressive growth strategy, particularly his understanding of product obsolescence issues facing OCMs.