Parasitic extraction

Wafer Cleaning Equipment Market worth $16.5 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Friday, September 1, 2023
Chemical control, Prevalence, CIS, Internet, Chemical substance, Infineon Technologies, Memory, Region, Component, Electronics, 3D, Methodology, Tokyo Electron, LED, MEMS, Growth, Transceiver, Orchid Chemicals & Pharmaceuticals, Interposer, Research fellow, Health, Data, Gas Control Equipment Ltd, Automation, Tablet, Silicon, System, FD-SOI, Oxygen, Light-emitting diode, Internet of things, AG, Oil, ICS, Miniaturization, Cox, PVA, Applied Materials, RF, Borosilicate glass, Telescopic sight, Parasitic extraction, Telecommunications, Logic, Waveguide, Ammonia, Geography, Power

300 mm wafer size segment is expected to have the highest shipment in wafer market during the forecast period.

Key Points: 
  • 300 mm wafer size segment is expected to have the highest shipment in wafer market during the forecast period.
  • MEMS application is expected grow at the highest CAGR of the wafer cleaning equipment market during the forecast period.
  • Asia Pacific holds the largest market share of the wafer cleaning equipment market in 2022.
  • This confluence of factors is anticipated to drive considerable growth in the wafer cleaning equipment market within the Asia Pacific region in the foreseeable future.

Wafer Cleaning Equipment Market worth $16.5 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Friday, September 1, 2023
Chemical control, Prevalence, CIS, Internet, Chemical substance, Infineon Technologies, Memory, Region, Component, Electronics, 3D, Methodology, Tokyo Electron, LED, MEMS, Growth, Transceiver, Orchid Chemicals & Pharmaceuticals, Interposer, Research fellow, Health, Data, Gas Control Equipment Ltd, Automation, Tablet, Silicon, System, FD-SOI, Oxygen, Light-emitting diode, Internet of things, AG, Oil, ICS, Miniaturization, Cox, PVA, Applied Materials, RF, Borosilicate glass, Telescopic sight, Parasitic extraction, Telecommunications, Logic, Waveguide, Ammonia, Geography, Power

300 mm wafer size segment is expected to have the highest shipment in wafer market during the forecast period.

Key Points: 
  • 300 mm wafer size segment is expected to have the highest shipment in wafer market during the forecast period.
  • MEMS application is expected grow at the highest CAGR of the wafer cleaning equipment market during the forecast period.
  • Asia Pacific holds the largest market share of the wafer cleaning equipment market in 2022.
  • This confluence of factors is anticipated to drive considerable growth in the wafer cleaning equipment market within the Asia Pacific region in the foreseeable future.

Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation

Retrieved on: 
Tuesday, April 25, 2023
Electronic Design Automation, Semiconductor, Technology, Mobile, Wireless, Software, 5G, Hardware, EMX, Custom, High-pass filter, DRC, Cadence Design Systems, CDNS, Health, Virtuoso, EM, N16, SOC, RFIC, Radar, Kunyu Wanguo Quantu, TSMC, Parasitic extraction, RF, Automation, Video game, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with TSMC to optimize the Cadence® Virtuoso® platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with TSMC to optimize the Cadence® Virtuoso® platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.
  • The Cadence RFIC solution that supports TSMC’s N16 process technology features automation capabilities to help customers spend less time integrating critical RF functionality into their designs.
  • The TSMC N16 79GHz mmWave design reference flow incorporates an efficient methodology that lets engineers achieve their performance, power efficiency and reliability design goals.
  • Additionally, the TSMC N16 79GHz mmWave design reference flow supports high-capacity electromagnetic (EM) model generation, leveraging the Cadence EMX® Planar 3D Solver, which is essential for RF circuits.

Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow

Retrieved on: 
Wednesday, October 26, 2022
Technology, Hardware, Semiconductor, EMX, Health, Custom, Schematic editor, Fortune, EM, Efficiency, RFIC, PDK, Hyperscale computing, N16, Intelligent system, Â, Nasdaq, Technology, Virtuoso, Solution, RF, SOC, Parasitic extraction, IP, CDNS, Simulation, RCX, TSMC, Cadence Design Systems, Video game console, 3D printing, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Cadence RFIC solutions support TSMCs N16RF Design Reference Flow and process design kit (PDK) to help accelerate the next generation of mobile, 5G and automotive applications.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Cadence RFIC solutions support TSMCs N16RF Design Reference Flow and process design kit (PDK) to help accelerate the next generation of mobile, 5G and automotive applications.
  • The continued collaboration between Cadence and TSMC allows mutual customers to design with Cadence solutions for TSMCs N16RF mmWave semiconductor technology.
  • The Cadence RFIC solutions support the Cadence Intelligent System Design strategy, enabling system-on-chip (SoC) design excellence.
  • The complete RF Design Reference Flow includes passive device modeling, block-level optimization, sensitive layout routing nets EM parasitics signoff, EM-IR analysis with custom passives, and self-heating.

Kinetic Technologies Adopts Diakopto's ParagonX™ Platform for High-Performance Power Management and Video/Audio Interface ICs

Retrieved on: 
Tuesday, January 25, 2022
RFIC, DisplayPort, CTO, IOT, SAN, R, PHY, Memory, CAD, EDA, CA, Semiconductor industry in Taiwan, CEO, Parasitic extraction, IC, Solution, View, ICS, Silicon, HDMI, PPA, Efficiency, Multimedia, SerDes, Family, USB, Kinetic, Printed circuit board, Video game console, Diakopto

Parasitics are unintended elements that degrade IC performance, precision, power efficiency, robustness, and reliability.

Key Points: 
  • Parasitics are unintended elements that degrade IC performance, precision, power efficiency, robustness, and reliability.
  • The power-performance-area (PPA) metric and time-to-market of modern ICs are now dominated by on-chip interconnects and layout parasitics.
  • "We are pleased to welcome Kinetic Technologies to our family of ParagonX users, and excited to see them using ParagonX for their cutting-edge power management and video/audio interface ICs," remarked Maxim Ershov, CEO and CTO of Diakopto.
  • Kinetic Technologies is a privately held company with R&D centers in Silicon Valley and Asia, along with operations and logistics based in Asia.

Diakopto Named One of 10 Most Disruptive Companies in The Semiconductor Industry 2021

Retrieved on: 
Thursday, December 2, 2021
OEM, Pains, CEO, EDA, Industry, Time, Memory, ICS, IOT, Silicon, SAN, Solution, CAD, IC, PHY, RFIC, Parasitic extraction, SerDes, Applied Materials, NVIDIA, CA, Video game console, Aquaculture

SAN JOSE, Calif., Dec. 2, 2021 /PRNewswire/ -- Diakopto announced today that the company was selected to the prestigious 10 Most Disruptive Companies in the Semiconductor Industry list for 2021.

Key Points: 
  • SAN JOSE, Calif., Dec. 2, 2021 /PRNewswire/ -- Diakopto announced today that the company was selected to the prestigious 10 Most Disruptive Companies in the Semiconductor Industry list for 2021.
  • Insights Success, a leading global business magazine, is recognizing ten industry leaders that are having a profound impact on the semiconductor industry.
  • Read more about the 10 Most Disruptive Companies in the Semiconductor Industry .
  • Diakopto and ParagonX are trademarks owned by Diakopto, Inc.
    All other trademarks are owned by their respective companies.

Ferric Adopts Diakopto's ParagonX™ Platform for Single-Chip Power Converters with On-Chip Thin-Film Inductors

Retrieved on: 
Tuesday, October 12, 2021
Efficiency, Telemetry, IC, Memory, SAN, RFIC, Engineering, Cloud computing, CAD, SerDes, Iron(III), CA, CMOS, CEO, PPA, IOT, Parasitic extraction, CTO, Partnership, PHY, Technology, Silicon, TSMC, FET amplifier, Video game console, Renewable energy, Printed circuit board

By integrating power management, power train (including power FETs, inductors and capacitors), feedback control, telemetry and interface circuitry, Ferric's products deliver superior efficiency, output ripple, load and line regulation.

Key Points: 
  • By integrating power management, power train (including power FETs, inductors and capacitors), feedback control, telemetry and interface circuitry, Ferric's products deliver superior efficiency, output ripple, load and line regulation.
  • Produced in partnership with TSMC, Ferric's proprietary technology addresses a broad spectrum of applications, including mobile and cloud computing.
  • "Ferric is focused on cutting-edge technology that saves power, space and cost," commented David Jew, vice president of engineering at Ferric.
  • "We are pleased that our platform has been embraced by Ferric for the development of their groundbreaking technology."

Media Alert: Atomera Presenting at the International Conference on Simulation of Semiconductor Processes and Devices 2021 (SISPAD)

Retrieved on: 
Thursday, September 23, 2021
Semiconductor, Hardware, Electronic Design Automation, Other Technology, Technology, Conference, OI, MST, Device, CDT, Parasitic extraction, International Conference on Radiation Effects in Insulators, Boron, Atomera, P, 3D, Printed circuit board

The Conference begins at 9:30 a.m. CDT

Key Points: 
  • The Conference begins at 9:30 a.m. CDT
    Atomera Incorporated will present at the 2021 annual International Conference on Simulation of Semiconductor Processes and Devices.
  • The presentation focuses on a novel technique for improving partially depleted RFSOI MOSFETs.
  • To facilitate the detailed simulation of these, devices a novel quasi-3D process model has been developed and tested against a full 3D simulation.
  • To learn more about the session presented by Daniel Connelly at SISPAD 2021, visit the conference program at https://sispad2021.org/technical-program/#S10 .

eTopus Selects Diakopto's ParagonX™ Platform for Ultra-High Speed SerDes IP

Retrieved on: 
Tuesday, August 24, 2021
CTO, CAD, Adoption, Parasitic extraction, ADC, EDA, Efficiency, View, CA, AI, Multimedia, Silicon, DSP, Solution, VC, SAN, CEO, PPA, SerDes, China, Technology, Printed circuit board, 3D printing

"ParagonX stands alone in superior ease-of-use, analysis speed and in conveying insights that drive design improvements"

Key Points: 
  • "ParagonX stands alone in superior ease-of-use, analysis speed and in conveying insights that drive design improvements"
    eTopus designs ultra-high speed mixed-signal semiconductor solutions for high-performance computing and data center applications.
  • Their ultra-high speed SerDes IP has been adopted by global Tier-1 players and is used in networking, storage, 5G, and AI applications.
  • "We have adopted ParagonX to speed up the development and tapeouts for multiple generations of our SerDes technology," said Harry Chan, CEO of eTopus.
  • This has helped us develop higher quality and lower power SerDes IP at a much faster rate."

Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud

Retrieved on: 
Monday, June 15, 2020
Digital technology, Cloud computing, Computing, Cloud infrastructure, Electronic design automation, Formal methods, Signoff, Static timing analysis, Synopsys, Parasitic extraction, Microsoft Azure

Significant throughput gains with PrimeTime timing signoff and StarRC extraction for multi-scenario, distributed processing runs

Key Points: 
  • Significant throughput gains with PrimeTime timing signoff and StarRC extraction for multi-scenario, distributed processing runs
    Synopsys, Inc. (Nasdaq:SNPS) today announced its collaboration with TSMC and Microsoft has delivered a ground-breaking, highly scalable timing signoff flow for use in the cloud.
  • The flow dramatically improves throughput using Synopsys PrimeTime static timing analysis and StarRC parasitic extraction on the Microsoft Azure platform.
  • TSMC is the first foundry to collaborate with design ecosystem partners and cloud providers to enable design in the cloud.
  • On a multi-million gate design using the TSMC N5 process, PrimeTime static timing analysis and StarRC extraction, timing signoff was performed on Microsoft Azure's latest Edsv4-series compute instances.