Info

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

Retrieved on: 
Thursday, October 19, 2023
Semiconductor, Hardware, Electronic Design Automation, Technology, Software, Digital, 3D, TSMC, CDNS, PPA, Virtuoso, Studio, Innovation, Life, N3P, DSP, EDA, Partner, Info, OIP, N2, SOC, Cadence Design Systems, IP, Integration, High-pass filter, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has won four Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has won four Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.
  • Cadence was presented with awards for the joint development of the N2 and N3P design infrastructure, 3Dbloxdesign prototyping solution, mmWave design solutions and DSP IP.
  • In addition, Cadence collaborated with TSMC to optimize the Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.
  • DSP IP: Cadence expanded its collaboration with TSMC’s Soft IP9000 team to certify Cadence Tensilica® DSP IP in the TSMC integration flow.

Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

Retrieved on: 
Wednesday, September 27, 2023
Mobile, Wireless, Technology, Semiconductor, 5G, Software, Internet, Hardware, Electronic Design Automation, IOT (Internet of Things), Artificial Intelligence, Area studies, DRC, Cadence Design Systems, CDNS, Internet of things, 3D, SIP, CAD, Language, Info, Integrity, Hyperscale computing, TSMC, AI, Silicon, Integration, Digital, 3D printing, Video game, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.
  • Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time.
  • The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity and performance.
  • In addition, the flows provide inter-chiplet DRC through the Cadence Pegasus™ Verification System, which helps designers create an inter-chiplet CAD layer for DRC automatically.

proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem

Retrieved on: 
Monday, September 25, 2023
Software, Data Analytics, Packaging, Data Management, Professional Services, Technology, Semiconductor, Manufacturing, Business development, Partnership, 3D IC, Electronics, Business, Multimedia, OIP, IP, Cloud computing, Info, HPC, TSMC, Center for Advancing Electronics Dresden, Ecosystem, Silicon

The newest alliance in TSMC’s OIP ecosystem, the 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

Key Points: 
  • The newest alliance in TSMC’s OIP ecosystem, the 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.
  • View the full release here: https://www.businesswire.com/news/home/20230925037205/en/
    proteanTecs joins the TSMC Open Innovation Platform® (OIP) 3DFabric™ Alliance.
  • “proteanTecs is pleased to collaborate within the 3DFabric Alliance to accelerate the adoption of 3D heterogenous systems.
  • proteanTecs is speaking today at the TSMC OIP 3DFabric Alliance Workshop event on the capabilities and benefits of die-to-die interconnect monitoring.

Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP

Retrieved on: 
Monday, July 10, 2023
Technology, Semiconductor, 5G, Telecommunications, Nanotechnology, Software, Networks, Hardware, Data Management, Artificial Intelligence, HBM, LSE, CXL, Computation, PHY, IO, Sips, HBM3, SIP, Chiplet, IP, UCIe, Memory bandwidth, IPS, Info, GM, HPC, Socs, Semi, TSMC, JEDEC, Silicon, Ecosystem, AI, SVP, Integration, Memory, Video game

Alphawave Semi's 3nm chiplet-enabled custom silicon platform is built on flexible and customizable connectivity IP.

Key Points: 
  • Alphawave Semi's 3nm chiplet-enabled custom silicon platform is built on flexible and customizable connectivity IP.
  • The Alphawave Semi HBM3 PHY IP targets leading-edge high-performance memory interfaces up to 8.6Gbps and 16 channels, operating at very low power.
  • It allows cloud service providers to leverage Alphawave Semi’s HBM3 IP subsystems and custom silicon capabilities to accelerate AI workloads in next-generation data center infrastructure.”
    Dr. Debendra Das Sharma, Chairman, UCIe Consortium, said, “We’re excited to see Alphawave Semi tape out a 24Gbps/lane UCIe IP in a 3nm process.
  • “We are excited to announce simultaneous tapeouts of our HBM3 IP and our industry-first 24GT/s UCIe IP for TSMC’s 3nm technology, which are key enablers of our I/O chiplet portfolio,” said Mohit Gupta, SVP and GM, Custom Silicon and IP, Alphawave Semi.

Securities & Exchange Commission Approves the Plan of Distribution for the RBS Securities Fair Fund

Retrieved on: 
Tuesday, July 4, 2023
Judgement, Person, The Final Judgment, Notice, Investment, RBS, Court, WITH, SIGN, Defendant, Plan, Fair Fund, OR, Info, The Commission, Security (finance), Safety, SEE, LLP, NOT, Final, NatWest Markets, Documentation, Fund administration, Complaint, FORM, Fund, Last Judgment, MUST, Life insurance, Cryptocurrency, United States Postal Service

The purpose of this Notice is to inform you that you may be entitled to share in the proceeds of the Fair Fund described herein.

Key Points: 
  • The purpose of this Notice is to inform you that you may be entitled to share in the proceeds of the Fair Fund described herein.
  • To be potentially eligible to share in the Fair Fund, you must file a Proof of Claim Form in accordance with the steps set forth in this Notice and in the Distribution Plan (the "Plan") approved by the Securities and Exchange Commission ("SEC" or the "Commission").
  • On November 7, 2013, the SEC brought suit against Defendant RBS Securities Inc. ("RBS" or "Defendant"), formerly known as Greenwich Capital Markets, Inc.
  • You may obtain additional information or request copies of forms and notices by calling the RBS Securities Inc. Fair Fund's toll-free hotline at (877) 940-1507 in the United States, or by email at [email protected] .

SIMBYM Introduces “Vorque®”, an innovative and disruptive “AppGPT No-Code” Platform for Efficient Business Operations, Work Management and Collaboration

Retrieved on: 
Tuesday, June 20, 2023
Internet, Data Management, Apps, Applications, Technology, Software, Workflow, Organization, Info, Cryptocurrency, Sales

USA SIMBYM Inc, a leading innovator in technology software solutions, is proud to announce the preview release of its groundbreaking SIMBYM Vorque Management Module.

Key Points: 
  • USA SIMBYM Inc, a leading innovator in technology software solutions, is proud to announce the preview release of its groundbreaking SIMBYM Vorque Management Module.
  • SIMBYM Vorque® empowers organizations of all sizes and all verticals, including green fields, by building and streamlining their workflow and application processes without the need for traditional coding.
  • People can focus on their business processes and our platform will enable them to use the application in minutes.
  • “We are thrilled to introduce SIMBYM Vorque®, our no limits, No-Code platform,” said Mala Raj, Co-Founder & President at SIMBYM.

Skyhigh Security Strengthens Presence in EMEA: Appoints Christopher Brennan to Lead EMEA Sales Organization

Retrieved on: 
Wednesday, May 10, 2023
Data Management, Security, Technology, Software, Networks, Internet, Richard Sale (director), Cranfield School of Management, University, Conrad J. Wethmar, RSA Security, Bachelor of Commerce, Info, DACH, OSB, MBA, Research, Bachelor of Arts, Organization, RSA, SSE, ESCP Business School, Knowledge, Growth, University College Cork, Kaspersky Lab, Checkmarx, Commerce, Tourism, Management, Central Europe

Skyhigh Security today announced the appointment of Christopher Brennan as Vice President of EMEA Sales, Claire Hatcher as Regional Director of the UK and Thomas Wethmar as Regional Director of Germany, Switzerland and Austria (DACH).

Key Points: 
  • Skyhigh Security today announced the appointment of Christopher Brennan as Vice President of EMEA Sales, Claire Hatcher as Regional Director of the UK and Thomas Wethmar as Regional Director of Germany, Switzerland and Austria (DACH).
  • Prior to Dragos, Brennan was Director of Sales at Checkmarx Security and has held several other sales and channel positions at leading cyber security companies in EMEA, along with board positions at Info AG and OSB GmbH.
  • She joins Skyhigh Security from Lookout, where she was the Regional Sales Director for Europe North.
  • Prior to that, he was the Sales Director, Germany, at Exclusive Networks and has also other sales and channel positions in the DACH cybersecurity market.

Lirunex's whirlwind 2023: Setting foot across APAC and EMEA

Retrieved on: 
Monday, May 8, 2023
InterContinental Hanoi Landmark 72, Info, Stock trader, Barbara Trader Faires, Convention center, S7, Knowledge, Growth, Clean Energy Expo Asia, Cryptocurrency, Retail

KUALA LUMPUR, Malaysia, May 8, 2023 /PRNewswire/ -- Award-winning trading platform Lirunex is excited to announce its participation in four upcoming regional exhibitions in Dubai, the Philippines, Thailand, and Vietnam as part of Lirunex's efforts to showcase its dedication to enhancing the trading community's knowledge of financial markets and expanding its horizons.

Key Points: 
  • This also demonstrates our commitment to the trading community," stated Jack Foong, CEO of Lirunex.
  • Moreover, Lirunex also indicates its willingness to comply with all applicable laws within each region it operates in.
  • To further increase customer retention and loyalty, we are continuously introducing new features that enhance the overall trading experience.
  • Consequently, we anticipate a 39% increase in trading volume in 2023", commented by Jack Foong, CEO of Lirunex.

Lirunex's whirlwind 2023: Setting foot across APAC and EMEA

Retrieved on: 
Monday, May 8, 2023
InterContinental Hanoi Landmark 72, Info, Stock trader, Barbara Trader Faires, Convention center, S7, Knowledge, Growth, Clean Energy Expo Asia, Cryptocurrency, Retail

KUALA LUMPUR, Malaysia, May 8, 2023 /PRNewswire/ -- Award-winning trading platform Lirunex is excited to announce its participation in four upcoming regional exhibitions in Dubai, the Philippines, Thailand, and Vietnam as part of Lirunex's efforts to showcase its dedication to enhancing the trading community's knowledge of financial markets and expanding its horizons.

Key Points: 
  • This also demonstrates our commitment to the trading community," stated Jack Foong, CEO of Lirunex.
  • Moreover, Lirunex also indicates its willingness to comply with all applicable laws within each region it operates in.
  • To further increase customer retention and loyalty, we are continuously introducing new features that enhance the overall trading experience.
  • Consequently, we anticipate a 39% increase in trading volume in 2023", commented by Jack Foong, CEO of Lirunex.

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard

Retrieved on: 
Wednesday, April 26, 2023
Software, Technology, Electronic Design Automation, Data Management, Online, PDN, Cadence Design Systems, LVS, CDNS, Face, Internet of things, 3D, SOC, App Store (iOS/iPadOS), Info, Integrity, HPC, 3D-IC, Hyperscale computing, TSMC, AI, Digital, Integration, 3D printing, Video game, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced new design flows based on the Cadence® Integrity™ 3D-IC platform to support the TSMC 3Dblox™ standard for 3D front-end design partitioning in complex systems.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced new design flows based on the Cadence® Integrity™ 3D-IC platform to support the TSMC 3Dblox™ standard for 3D front-end design partitioning in complex systems.
  • The Cadence Integrity 3D-IC platform combines system planning, packaging, and system-level analysis and is a complete solution certified for use with the TSMC 3DFabric and the 3Dblox 1.5 specification.
  • The flows based on this platform incorporate several new features like 3D routability-driven bump assignment and hierarchical bump resource planning.
  • The Cadence reference flows and tutorials are available on TSMC Online now, and more information on the Integrity 3D-IC platform can be found at www.cadence.com/go/integrity3dblox .