Synopsys

Ansys and Synopsys Accelerate RFIC Semiconductor Design with New Reference Flow for Samsung Technology

Retrieved on: 
Wednesday, June 28, 2023
Samsung Electronics, Electronics, ANSYS, Internet of things, EDA, Inductor, EM, Samsung, IP, SOC, RFIC, Transformer, SNPS, Risk, Socs, Sign-on and sign-off, Radio, Transport, RF, Video game, Mobile phone, Ansys, Synopsys, Silicon

PITTSBURGH, June 28, 2023 /PRNewswire/ -- Recognizing the increasing challenges faced by designers of 5G/6G systems-on-chip (SoCs) and autonomous driving systems, Ansys (NASDAQ: ANSS) and Synopsys, Inc. (NASDAQ: SNPS) announced the availability of a new reference flow for radio-frequency integrated circuit (RFIC) design developed with Samsung Foundry for its 14LPU process technology. The reference flow helps ensure that mutual customers can optimize RFIC designs with Ansys' golden signoff electromagnetic analysis together with Synopsys' comprehensive analog/RF and mixed-signal design and verification solution.

Key Points: 
  • (NASDAQ: SNPS) announced the availability of a new reference flow for radio-frequency integrated circuit (RFIC) design developed with Samsung Foundry for its 14LPU process technology.
  • The reference flow helps ensure that mutual customers can optimize RFIC designs with Ansys' golden signoff electromagnetic analysis together with Synopsys' comprehensive analog/RF and mixed-signal design and verification solution.
  • Key components of the reference flow include the Synopsys Custom Design Family , featuring the Synopsys PrimeSim™ continuum of circuit simulation solutions, and electromagnetic signoff analysis provided by Ansys® RaptorX™ Electromagnetic Modeling Family , Ansys® Exalto™ Electromagnetic Extraction and Signoff , and Ansys® VeloceRF™ Inductor and Transformer Design Tools .
  • "Our latest collaboration with Ansys on Synopsys' new RF design reference flow supporting Samsung's advanced 14nm process node provides an open and optimized flow that delivers exceptional quality-of-results for advanced 5G/6G wireless systems."

AMD Introduces World’s Largest FPGA-Based Adaptive SoC for Emulation and Prototyping

Retrieved on: 
Tuesday, June 27, 2023
Application-specific integrated circuit, Embedded, AMD, EDA, ML, SOC, Synopsys, Ecosystem, Silicon, Field-programmable gate array, Video game, Q3, Xilinx, Software, AI, FPGA, ASIC

SANTA CLARA, Calif., June 27, 2023 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced the AMD Versal™ Premium VP1902 adaptive system-on-chip (SoC), the world’s largest1 adaptive SoC. The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Offering 2X2 the capacity over the prior generation, designers can confidently innovate and validate application-specific integrated circuits (ASICs) and SoC designs to help bring next generation technologies to market faster.AI workloads are driving increased complexity in chipmaking, requiring next-generation solutions to develop the chips of tomorrow. FPGA-based emulation and prototyping provides the highest level of performance, allowing faster silicon verification and enabling developers to shift left in the design cycle and begin software development well before silicon tape-out. AMD, through Xilinx, brings over 17 years of leadership and six generations of the industry’s highest capacity emulation devices, which have nearly doubled in capacity each generation3.“Delivering foundational compute technology to enable our customers is a top priority. In emulation and prototyping, that means delivering the highest capacity and performance possible,” said Kirk Saban, corporate vice president, Product, Software, & Solutions Marketing, Adaptive and Embedded Computing Group, AMD. “Chip designers can confidently emulate and prototype next-generation products using our VP1902 adaptive SoC, accelerating tomorrow’s innovations in AI, autonomous vehicles, Industry 5.0 and other emerging technologies.”

Key Points: 
  • ꟷ AMD Versal Premium VP1902 adaptive SoC offers 2X the capacity of previous-generation FPGAs, providing chipmakers with the tools to bring new ASIC and SoC designs to market faster ─
    ꟷ Collaboration with EDA leaders Cadence, Siemens and Synopsys helps ensure chip designers have access to scalable ecosystem of fully-featured solutions ꟷ
    SANTA CLARA, Calif., June 27, 2023 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced the AMD Versal™ Premium VP1902 adaptive system-on-chip (SoC), the world’s largest1 adaptive SoC.
  • The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs.
  • In emulation and prototyping, that means delivering the highest capacity and performance possible,” said Kirk Saban, corporate vice president, Product, Software, & Solutions Marketing, Adaptive and Embedded Computing Group, AMD.
  • The AMD Versal Premium VP1902 adaptive SoC will begin sampling in Q3 to early access customers with production expected in the first half of 2024.

Global Engineering Software Industry Research 2023-2028 Featuring Dassault Systemes, AutoDesk, Cadence Design Systems, ANSYS, Synopsys, Bentley Systems, Aspen Technology, Siemens

Retrieved on: 
Friday, June 16, 2023
Cloud, Urbanization, 3D printing, Research report, Construction, Cadence Design Systems, Aspen Technology, MicroStation, Statistics, AutoCAD, Small and medium-sized enterprises, Automotive industry, USD, Consultant, SWOT, Ansys, Nature, Engineering, Siemens, Porter's five forces analysis, Dassault Systèmes, Material, Growth, Healthcare industry, Transport, Synopsys, Bentley Systems, Population growth, Medical device, Agriculture, Video game, Risk management, Retail, Autodesk

The global construction industry is a major user of engineering software solutions.

Key Points: 
  • The global construction industry is a major user of engineering software solutions.
  • As the construction industry continues to grow, the demand for engineering software solutions that can help streamline the design and construction process is expected to increase.
  • This study also provides a competitive landscape of the industry and profiles some of the leading players in the Global Engineering Software industry including Dassault Systemes, AutoDesk Inc., Cadence Design Systems, ANSYS Inc., Synopsys Inc., Bentley Systems Inc., Aspen Technology Inc., Siemens AG and others.
  • The report analyses the Engineering Software Market by End User Industry (Automotive and Transportation Industry, Aerospace and Defense Industry, Healthcare Industry, Other Industries).

Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes

Retrieved on: 
Wednesday, June 14, 2023
MIPI, Partnership, DFMEA, Samsung Electronics, DDR, Interface, EDA, PCI Express, SF5, SF4, USB, SF3, IP, SOC, UCIe, Synopsys, SNPS, Silicon, Radar, LPDDR, Risk, HPC, Socs, AEC, ADAS, Mobile phone, Samsung

MOUNTAIN VIEW, Calif., June 13, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs. This agreement expands Synopsys' collaboration with Samsung to enhance the Synopsys IP offering for Samsung's advanced 8LPU, SF5, SF4 and SF3 processes and includes Foundation IP, USB, PCI Express, 112G Ethernet, UCIe, LPDDR, DDR, MIPI and more. In addition, Synopsys will optimize IP for Samsung's SF5A and SF4A automotive process nodes to meet stringent Grade 1 or Grade 2 temperature and AEC-Q100 reliability requirements, enabling automotive chip designers to reduce their design effort and accelerate AEC-Q100 qualification. The auto-grade IP for ADAS SoCs will include design failure mode and effect analysis (DFMEA) reports that can save months of development effort for automotive SoC applications.

Key Points: 
  • (Nasdaq: SNPS ) today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs.
  • This agreement expands Synopsys' collaboration with Samsung to enhance the Synopsys IP offering for Samsung's advanced 8LPU, SF5, SF4 and SF3 processes and includes Foundation IP, USB, PCI Express, 112G Ethernet, UCIe, LPDDR, DDR, MIPI and more.
  • The auto-grade IP for ADAS SoCs will include design failure mode and effect analysis (DFMEA) reports that can save months of development effort for automotive SoC applications.
  • "Samsung's longstanding collaboration with Synopsys, as our primary IP partner, has benefited our mutual customers by providing access to high-quality IP through each generation of Samsung's technology advancements," said Jongshin Shin, corporate executive vice president of Foundry IP Development at Samsung Electronics.

Synopsys Recognized as a Leader in Software Composition Analysis by Independent Research Firm

Retrieved on: 
Tuesday, June 13, 2023
Private sector, Black Duck, Policy, SBOM, Software Composition Analysis, Synopsys, SCA, Organization, SNPS, Business Integration Group, Inc., Risk, IDE, Forrester, Software, Risk management

MOUNTAIN VIEW, Calif., June 13, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced it has been recognized as a leader in The Forrester Wave™: Software Composition Analysis, Q2 2023. The report identifies the 12 most significant vendors in the software composition analysis (SCA) market and evaluates them against 32 criteria grouped into three high-level categories: current offering, strategy, and market presence. Synopsys' Black Duck® SCA solution received among the highest scores in the market presence category and ranked second in the current offering category.

Key Points: 
  • MOUNTAIN VIEW, Calif., June 13, 2023 /PRNewswire/ -- Synopsys , Inc. (Nasdaq: SNPS ) today announced it has been recognized as a leader in The Forrester Wave™: Software Composition Analysis, Q2 2023 .
  • Application security and application development leaders rely on software composition analysis tools to deliver visibility into the security and license risk of open source and third-party libraries.
  • "We're honored to be recognized by Forrester as a leader in this evaluation," said Jason Schmitt, general manager of the Synopsys Software Integrity Group.
  • "Identifying and managing risk in open-source software components and the broader software supply chain is a critical part of building trust in your software.

InspireSemi Announces Executive Leadership Promotions

Retrieved on: 
Tuesday, June 6, 2023
Business development, Mike Fedorko, Hilltop Holdings Inc., Society, Plan, Synopsys, Cadence Design Systems, Marketing, Becoming Steve Jobs, Consultant, Texas Instruments, Option, Offering, Oak Technology, HPC, CFO, Growth, Amendment, Management, Security (finance), Life insurance, Operation, Qualcomm

VANCOUVER, British Columbia and AUSTIN, Texas, June 06, 2023 (GLOBE NEWSWIRE) -- Inspire Semiconductor Holdings Inc. (TSXV: INSP) (“InspireSemi” or the “Company”), a chip design company that has built a technology foundation to deliver revolutionary accelerated computing performance, today announced the promotions of Doug Norton, formerly Vice President of Business Development, to Chief Marketing Officer, and Thomas Fedorko, formerly Vice President of Operations, to Chief Operating Officer.

Key Points: 
  • “Given the strong response we have received for our compelling High-Performance Computing (HPC)/AI accelerator platform, we are pleased to announce these key promotions," said Ron Van Dell, CEO of InspireSemi.
  • “InspireSemi has consistently engaged seasoned executives who are leaders in their respective areas and can scale with the Company.
  • These appointments now complete our leadership team along with Alex Gray, Founder, President and CTO, and John B. Kennedy, our CFO.
  • Prior to InspireSemi, Norton held various senior leadership positions at Cadence Design Systems, CoWare, Newisys, Virtual Instruments, and Nimbix.

Teledyne LeCroy Announces Summit™ M616, the Industry’s First Protocol Analyzer/Exerciser for PCI Express® 6.0  

Retrieved on: 
Thursday, June 8, 2023
Data Management, IOT (Internet of Things), Technology, Software, Networks, Artificial Intelligence, Internet, Protocol analyzer, Internet of things, PCI Express, Teledyne Technologies, Record, Transfer (computing), TDY, Synopsys, Device, Machine learning, Artificial intelligence, PCI-SIG, NYSE, CATC, Medical device, Mobile phone, LeCroy Corporation

The Summit M616 exerciser/analyzer helps developers deliver on the promise of PCIe 6.0 by enabling several key benefits including:

Key Points: 
  • The Summit M616 exerciser/analyzer helps developers deliver on the promise of PCIe 6.0 by enabling several key benefits including:
    Reliability at twice the speed.
  • The analyzer functionality supports the same line rates with lane widths, and features Teledyne LeCroy’s industry standard CATC Trace™.
  • The Summit M616 integrates the analyzer and exerciser into a unified single application that incorporates traffic generation and protocol analysis.
  • For more information on The Summit M616 PCIe 6.0 Protocol Exerciser/Analyzer please contact Teledyne LeCroy at +1 (800) 909-7211 or visit our PCI Express landing page.

Industry First PCI Express® 6.0 Protocol Analyzer Enables Development of Next Generation High Performance PCIe Devices

Retrieved on: 
Thursday, June 8, 2023
Enterprise, CATC, Protocol analyzer, Internet of things, PCI Express, Teledyne Technologies, Record, Transfer (computing), IP, Intel, PCI, LeCroy Corporation, Network interface controller, OCP, Device, EDSFF, CEM, Architecture, Growth, Ecosystem, AI, NIC, Maine Learning Technology Initiative, Interposer, Software, Synopsys

MILPITAS, Calif., June 8, 2023 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of the Summit M616 PCI Express (PCIe®) Protocol Analyzer/Exerciser for testing designs and products incorporating PCIe 6.0 traffic. The Summit M616 Exerciser functionality addresses the needs of PCIe developers by providing high performance 64 GT/s traffic generation on devices with link widths up to 16 lanes. The analyzer functionality supports the same line rates and lane widths, and features Teledyne LeCroy's industry standard CATC Trace™. The Summit M616 traffic generation capability can also be used to develop standardized compliance test suites. Teledyne LeCroy will demonstrate its PCIe 6.0 Protocol Analyzer at the PCI-SIG DevCon on June 13-14, 2023. The demonstration will capture and display 64 GT/s protocol traffic between the Synopsys Host and Device IP for PCIe 6.0 using the Synopsys HAPS® prototyping system.

Key Points: 
  • The Summit M616 Exerciser functionality addresses the needs of PCIe developers by providing high performance 64 GT/s traffic generation on devices with link widths up to 16 lanes.
  • Teledyne LeCroy will demonstrate its PCIe 6.0 Protocol Analyzer at the PCI-SIG DevCon on June 13-14, 2023.
  • The combination of protocol exerciser and protocol analyzer provides engineers with a powerful platform to develop and troubleshoot the next generation of high performance PCIe Devices.
  • For more information on The Summit M616 PCIe 6.0 Protocol Exerciser/Analyzer and PCIe Gen6 Interposers please contact Teledyne LeCroy at +1 (800) 909-7211 or visit our PCI Express landing page.

Nanotechnology products market size to grow by USD 106.2 billion from 2022 to 2027 at a CAGR of 14.92%; Growing semiconductor components miniaturization to drive market growth - Technavio

Retrieved on: 
Tuesday, May 30, 2023
Nanoparticle, DuPont, EVS, Soil, Thermo Fisher Scientific, Patient, Risk, SE, Synopsys, Nanotechnology, Television, Geography, Electronics, Research, USD, Drought, ATM, BASF, Growth, System, World Bank Group, Dow Chemical Co. v. United States, Safety, Bruker, Pressure, Health, Cancer, Polymer, MEA, Absorption, Carbon, Tablet, Food packaging, Flood, Traction, Food, Nutrient, Food quality, Plant, 3M, Applied Materials, Miniaturization, BASF SE, Renewable energy, Video game, Agriculture, Pet industry, COVID-19

Vendor Landscape - The nanotechnology products market is fragmented, with the presence of several global as well as regional vendors.

Key Points: 
  • Vendor Landscape - The nanotechnology products market is fragmented, with the presence of several global as well as regional vendors.
  • By geography, the global nanotechnology products market is segmented into North America, Europe, APAC, Middle East and Africa, and South America.
  • The report provides actionable insights and estimates the contribution of all regions to the growth of the nanotechnology products market.
  • The increasing adoption of novel nanotechnology tools to boost agricultural productivity is notably driving the food nanotechnology market growth.

Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes

Retrieved on: 
Monday, May 29, 2023
Cortex, CXL, Magic, QIK, Arm, EDA, PCI Express, SOC, IP, IME, UCIe, DDR5, Security, PCI, SNPS, Silicon, Computing, Integrity, GM, Risk, Socs, Architecture, IDE, Health, PPA, PVT, AMBA, Video game, Synopsys, Computex

MOUNTAIN VIEW, Calif., May 28, 2023 /PRNewswire/ -- Tackling extremely complex mobile chip designs on advanced nodes down to 2nm, Synopsys, Inc. (Nasdaq: SNPS) has strengthened its AI-enhanced design collaboration with Arm as the company announces Arm® Total Compute Solutions 2023 (TCS23) platform today at Computex. Comprehensive EDA and IP solutions optimized for the highest levels of performance and power for Arm's latest compute platform includes the Synopsys.ai full-stack AI-driven EDA suite, Synopsys Interface and Security IP and Synopsys Silicon Lifecycle Management PVT IP. These advancements build on decades of collaboration between the two companies to accelerate customers' delivery of high-performance, efficient Arm-based SoCs for high-end smartphones and virtual/augmented-reality applications.

Key Points: 
  • (Nasdaq: SNPS ) has strengthened its AI-enhanced design collaboration with Arm as the company announces Arm® Total Compute Solutions 2023 (TCS23) platform today at Computex.
  • "The opportunity to unlock new magic on advanced mobile devices while constantly pushing performance and power-efficiency means design challenges become exponentially harder," said Shankar Krishnamoorthy, GM of Synopsys EDA Group.
  • Early adopters of TCS23 are using Synopsys virtual prototypes with Arm Fast Models, Synopsys hardware-assisted verification and verification IP for the latest Arm® AMBA interconnect to deliver SoCs to market faster.
  • Synopsys IP for PCI Express 6.0 with IDE, CXL 3.0 with IDE, DDR5 with IME and UCIe are available now.