Synopsys

Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes

Retrieved on: 
Tuesday, October 17, 2023
IP, Silicon, Partnership, CSS, Business, Security, Risk, EDA, Arm, ARM Neoverse, Ecosystem, CMN, Socs, SOC, Asset management, Video game, Cryptocurrency, Synopsys

SUNNYVALE, Calif., Oct. 17, 2023 /PRNewswire/ -- Synopsys today announced it has expanded its collaboration with Arm to provide optimized IP and EDA solutions for the newest Arm® technology, including the Arm Neoverse™ V2 platform and Arm Neoverse Compute Subsystem (CSS). Synopsys has joined Arm Total Design where Synopsys will leverage their deep design expertise, the Synopsys.ai™ full-stack AI-driven EDA suite, and Synopsys Interface, Security, and Silicon Lifecycle Management IP to help mutual customers speed development of their Arm-based CSS solutions. The expanded partnership builds on three decades of collaboration to enable mutual customers to quickly develop specialized silicon at lower cost, with less risk and faster time to market.

Key Points: 
  • Synopsys has joined Arm Total Design where Synopsys will leverage their deep design expertise, the Synopsys.ai™ full-stack AI-driven EDA suite , and Synopsys Interface , Security , and Silicon Lifecycle Management IP to help mutual customers speed development of their Arm-based CSS solutions.
  • In addition to joining Arm Total Design, Synopsys and Arm have renewed their agreement to optimize interoperability, performance, and bandwidth of systems using Arm processors and Synopsys Interface, Security, and Silicon Lifecycle Management IP.
  • Synopsys offers Fusion QuickStart Implementation Kits (QIKs ) for Arm Neoverse V2, Arm Cortex®, Arm Immortalis™ and Arm Mali™ processor families.
  • Synopsys' combined solutions offer customers a streamlined development cycle for Arm Neoverse V2 platform, helping to deliver SoCs and multi-die systems to market faster.

Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures

Retrieved on: 
Tuesday, October 10, 2023
Artificial intelligence, Internet of things, GlobalFoundries, Marketing, PALO, Cryptocurrency, Semiconductor, Synopsys

Investors in the round include GlobalFoundries, Synopsys, New North Ventures and a select group of individuals.

Key Points: 
  • Investors in the round include GlobalFoundries, Synopsys, New North Ventures and a select group of individuals.
  • The proceeds will be strategically utilized to fortify business development, marketing, and further product development.
  • Mike Wishart, CEO and Co-founder of Efabless, said, “We are excited that GlobalFoundries has joined Synopsys and New North Ventures as investors in Efabless.
  • GlobalFoundries brings a long history of success as an industry-leading foundry and an impressive portfolio of essential technologies.

Electronics Asia Conference 2023 to Highlight IoT, AI/ML, Automotive, and Wireless Developments Driving Semiconductor Industry Growth in Asia

Retrieved on: 
Thursday, October 5, 2023
Texas Instruments, Synopsys, STMicroelectronics, SIG, Automation, Internet, Infineon Technologies, Tektronix, Silicon Labs, Exhibition, Molex, EE Times, Electronics, Artificial intelligence, Arm, EAC, Cadence Design Systems, IDC, Internet of things, NXP Semiconductors, Ecosystem, Conference, Applied Materials, Bluetooth Special Interest Group, Chip 1 Exchange, Consumer electronics

With the theme "Strengthening Asia's Semiconductor Manufacturing Ecosystem," EAC 2023 aims to highlight the latest technology trends, innovations, and strategic insights within the electronics and semiconductor industry in Asia.

Key Points: 
  • With the theme "Strengthening Asia's Semiconductor Manufacturing Ecosystem," EAC 2023 aims to highlight the latest technology trends, innovations, and strategic insights within the electronics and semiconductor industry in Asia.
  • The global semiconductor industry reversed its five straight quarters of decline by registering a 3.4% revenue growth in the second quarter of 2023, according to Omdia.
  • These key trends are among the many developments driving Asia's electronics and semiconductor supply chain.
  • The event will feature a virtual fairground, an exhibition hall, and a conference space, similar to a live exhibition and conference.

Ivanti Reinforces Commitment to Cybersecurity and Customers with New Product and Engineering Leadership Hires

Retrieved on: 
Thursday, October 5, 2023
Software, Technology, Security, Cloud, Cortex, Sun Microsystems, Synopsys, Bharatiya Vidya Bhavan, MBA, NGFW, Engineering, Cybereason, Cisco, Good Technology, Artificial Intelligence for IT Operations, MS, Moses Austin, Indian Institutes of Technology, AI, Srinivas, Product management, Software as a service, Palo Alto Networks, Yahoo!, University, Bangalore University, Partnership, BS, EXM, University of California, Davis, Enterprise, Growth, Samsung Knox, Teja, Zynga, Google Cloud Platform, AR, Internet of things, Computer science, Birla Institute of Technology and Science, Pilani, Acceleration, Hacker, Business development, BHU, Management, Marketing, Science, Ivanti

Ivanti , the tech company that elevates and secures Everywhere Work, today announced four new leadership appointments in its product and engineering organization.

Key Points: 
  • Ivanti , the tech company that elevates and secures Everywhere Work, today announced four new leadership appointments in its product and engineering organization.
  • These appointments signal Ivanti’s commitment to cybersecurity and its determination to accelerate growth while advancing its SaaS product strategy and development.
  • I am thrilled to add these proven leaders to our already world-class team because they each perfectly align with our strategic goals and commitment to innovation,” said Srinivas Mukkamala, Chief Product Officer at Ivanti.
  • Prior to Ivanti, Teja served as an engineering leader for tech giants including Meta’s WhatsApp team, Zynga and Yahoo.

New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues

Retrieved on: 
Tuesday, October 10, 2023
Consultant, Business Integration Group, Inc., Security, DAST, AI, Organization, IAST, Synopsys, SCA, SAST, SDLC, Ciso, SNPS, Medical device, Risk management, DevOps

SUNNYVALE, Calif., Oct. 10, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the publication of its "Global State of DevSecOps 2023" report examining the strategies, tools, and practices impacting software security. The new report from the Synopsys Cybersecurity Research Center is based on a survey conducted by Censuswide polling more than 1,000 IT professionals across the world – including developers, application security professionals, DevOps engineers and CISOs, as well as experts in technology, cybersecurity, and software development.

Key Points: 
  • Over 80% of survey respondents indicated that a critical security issue in deployed software impacted their DevOps delivery schedule in the last year.
  • Key findings from the report include:
    - Most security professionals are already using AI –and even more are wary of its risks.
  • A majority (52%) of survey respondents noted that they are actively using AI to enhance their organization's software security measures.
  • Twenty-eight percent of respondents said their organizations take as long as three weeks to patch critical security risks/vulnerabilities in deployed applications.

Advantest to Showcase Latest Semiconductor Test Solutions at the International Test Conference in Anaheim, California

Retrieved on: 
Monday, October 2, 2023
LBIST, SLT, MBIST, Advantest, IO, ATE, ATS, DUT, ARTS, ICS, UCIe, DUT board, Test, ACS, SLM, Socs, SCAN, Diagnosis, ITC, Ecosystem, Conference, VI, TSE, Printed circuit board, Synopsys

TOKYO, Oct. 02, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions for advanced ICs at the 2023 International Test Conference (ITC) on Oct. 8-13 at the Disneyland Convention Center in Anaheim, California.

Key Points: 
  • TOKYO, Oct. 02, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions for advanced ICs at the 2023 International Test Conference (ITC) on Oct. 8-13 at the Disneyland Convention Center in Anaheim, California.
  • International Test Conference is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement.
  • Advantest's product showcase in booth #217 will highlight the company’s broad portfolio, including ATE, device interface, System Level Test (SLT) and analytics solutions that add customer value to the evolving semiconductor value chain.
  • The seamless portability of the structural test patterns developed for ATE platform ( Advantest V93000 ) on to ATS 7038 will be featured as well.

Synopsys Appoints Ann Minooka as Chief Marketing Officer

Retrieved on: 
Thursday, September 28, 2023
Synaptics, Heart, Marketing, AMD, Ampere Computing, Ghazi, LSI Corporation, CMO, Boston University, IP, SNPS, Logic, Ampere, LSI, Cypress Semiconductor, Artificial intelligence, Growth, Silicon, Computer science, Xilinx, Synopsys, Broadcom Inc., Infineon Technologies

SUNNYVALE, Calif., Sept. 28, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS ) today announced the appointment of Ann Minooka as the company's Chief Marketing Officer, reporting to Sassine Ghazi, president and COO of Synopsys.

Key Points: 
  • SUNNYVALE, Calif., Sept. 28, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS ) today announced the appointment of Ann Minooka as the company's Chief Marketing Officer, reporting to Sassine Ghazi, president and COO of Synopsys.
  • Minooka joins the company with more than two decades of marketing leadership experience in the semiconductor industry and is responsible for leading Synopsys' global brand strategy, communications, and marketing initiatives.
  • "Ann brings deep semiconductor industry experience and a strong track record of strengthening technology brands, revolutionizing digital marketing through data-driven insights and cultivating effective collaborations that drive impactful results," said Ghazi.
  • "Ann joins Synopsys at a time of unprecedented opportunity.

TSMC Announces Breakthrough Set to Redefine the Future of 3D IC

Retrieved on: 
Wednesday, September 27, 2023
Apps, Applications, Technology, Mobile, Wireless, Packaging, Semiconductor, Engineering, Manufacturing, Electronic Design Automation, Artificial Intelligence, DFM, Ansys, SK, Introduction, DRAM, 3D IC, AMD, EDA, ATE, 3D, HBM3, UMTC, Micrometre, OIP, Language, Committee, DFT, European Technology Platform on Smart Systems Integration, SRAM, HPC, Architecture, Growth, Silicon, Ecosystem, AI, TSM, Substrate, Memory, NYSE, TSE, Video game, Synopsys, TSMC

The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.

Key Points: 
  • The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.
  • TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.
  • With contribution from the largest ecosystem of companies, 3Dblox has emerged as a critical design enabler of future 3D IC advancement.
  • 3Dblox 2.0 has won support from key EDA partners to develop design solutions that fully support all TSMC 3DFabric offerings.

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process

Retrieved on: 
Wednesday, September 27, 2023
Electronic Design Automation, Semiconductor, IOT (Internet of Things), Technology, Networks, Hardware, Partnership, CUI, LC, EM, Fort Dix, Goldengate, RFIC, SNPS, Risk, Sign-on and sign-off, Fin field-effect transistor, TSMC, Physics, Environment, NYSE, PathWave Design, Video game, Electronics, Ansys, Synopsys, RF

Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
  • The reference flow is based on the Synopsys Custom Design Family, which provides a complete RF design solution for customers seeking an open RF design environment with higher predictive accuracy and productivity.
  • Design complexity of RF integrated circuits used for wireless data transmission such as transceivers and RF front-end components continues to grow.
  • PathWave RFIC design (GoldenGate) supports harmonic balance simulation in early chip design and verification process.

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Retrieved on: 
Wednesday, September 27, 2023
PHY, HBM3, IP, UCIe, SNPS, Compiler, TSMC, Architecture, Silicon, Extrusion, Semiconductor, Printed circuit board, Ansys, Synopsys

SUNNYVALE, Calif., Sept. 27, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC's 3DFabric™ technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. In addition, Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express (UCIe) IP on TSMC's leading N3E process for seamless die-to-die connectivity.

Key Points: 
  • Synopsys UCIe PHY IP, which achieved first-pass silicon success on TSMC N3E process, provides low-latency, low-power, and high-bandwidth die-to-die connectivity.
  • The combination of UCIe PHY IP and 3DIC Compiler optimizes multi-die system design for higher quality-of-results with minimal integration risk.
  • The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance.
  • Synopsys UCIe PHY IP on the TSMC N3E process and 3DIC Compiler are available now.