Renesas Electronics

CG Power and Industrial Solutions Limited, Renesas, and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

Retrieved on: 
Friday, March 1, 2024
Technology, Semiconductor, Engineering, Manufacturing, Software, Networks, Internet, Hardware, IOT (Internet of Things), JVA, INR, Joint venture, Renesas Electronics, FC, Growth, Executive Committee, QFP, QFN, Union Council of Ministers, Murugappa Group, JV, Ecosystem, Public, Partnership

The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India.

Key Points: 
  • The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India.
  • Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise.
  • The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively.
  • Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us.

TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February, Poised to Shape Japan’s Semiconductor Landscape Over the Next Decade, Says TrendForce

Retrieved on: 
Friday, February 23, 2024
Environment, Apps, Applications, Technology, Semiconductor, Professional Services, Sustainability, Software, Audio, Video, Green Technology, Data Analytics, Sony, SUMCO, Tohoku University, TEL, Table, Government, SCREEN, Renesas Electronics, Lead, Water resources, TSMC, Ecosystem, JSR, Mitsubishi Electric, 3DIC, ROHM

This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%.

Key Points: 
  • This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%.
  • The much-anticipated opening of TSMC’s Kumamoto Plant (JASM) in Japan on the 24th marks TSMC’s debut factory in Japan (Fab-23), signaling a bold step into the future.
  • TrendForce envisions Japan developing three semiconductor powerhouses in Kyushu, Tohoku, and Hokkaido, with Kyushu taking the lead, especially as the home of TSMC’s Kumamoto plant.
  • With concerted efforts from industry, government, and academia, Japan is on the brink of creating a comprehensive semiconductor manufacturing ecosystem.

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

Retrieved on: 
Thursday, February 22, 2024
Robotics, Semiconductor, IOT (Internet of Things), Technology, Artificial Intelligence, Internet, Hardware, International, Architecture, Multimedia, ISSCC, AI, IPS, Renesas Electronics, SLAM, DRP, Conference, CNN, Automation, Environment, Central processing unit, Software, CPU, Video game

The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.

Key Points: 
  • The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.
  • View the full release here: https://www.businesswire.com/news/home/20240222749810/en/
    Dynamically Reconfigurable Processor AI technology from Renesas enables higher speeds and lower power consumption in microprocessor units (MPUs) that realize advanced vision AI.
  • The technologies developed by Renesas are as follows:
    As a typical technology for improving AI processing efficiency, pruning is available to omit calculations that do not significantly affect recognition accuracy.
  • That is why Renesas introduced a dynamically reconfigurable processor (DRP), which handles complex processing, in addition to the CPU and AI accelerator (DRP-AI).

Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs

Retrieved on: 
Wednesday, February 21, 2024
Electronic Design Automation, Semiconductor, Data Management, Technology, Nanotechnology, Hardware, Bias, OTP, International, MB, Cascode, IO, STT-MRAM, ISSCC, AI, Multimedia, Megabit, Temperature, Renesas Electronics, Internet of things, VLSI, Conference, Memory, MCU, EFuse, Hertz, CPU, Computer data storage

It achieves a random read access frequency of over 200 MHz and a write throughput of 10.4-megabytes-per-second (MB/s).

Key Points: 
  • It achieves a random read access frequency of over 200 MHz and a write throughput of 10.4-megabytes-per-second (MB/s).
  • View the full release here: https://www.businesswire.com/news/home/20240221234586/en/
    Renesas test chip with breakthrough fast write and fast read technology.
  • As IoT and AI technologies continue to advance, MCUs used in endpoint devices are expected to deliver higher performance than ever.
  • To address these challenges, Renesas has developed the following new circuit technologies to achieve faster read and write operations in MRAM.

Transphorm Announces Fiscal 2024 Third Quarter Results and Provides Business Update

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Tuesday, February 20, 2024
Technology, Hardware, Semiconductor, EVS, Engineering, EV, PD, AI, Renesas Electronics, Calendar, Exercise, Entrepreneurship, SMD, JEDEC, Silicon carbide, Electronics, Security (finance), Gallium nitride, Video game

Transphorm, Inc. (NASDAQ: TGAN)—a global leader in GaN, the future of next generation power systems, announced today its financial results for the third quarter of its fiscal year ending March 31, 2024 (“Q3 Fiscal 2024”).

Key Points: 
  • Transphorm, Inc. (NASDAQ: TGAN)—a global leader in GaN, the future of next generation power systems, announced today its financial results for the third quarter of its fiscal year ending March 31, 2024 (“Q3 Fiscal 2024”).
  • Reported total revenue of $4.7 million for Q3 Fiscal 2024, an increase of 4.0% over the same quarter last year and a decrease of 6.8% from the prior quarter.
  • Government revenue was $1.5 million in the quarter, an increase of 180% from the same quarter last year and flat with the prior quarter.
  • Operating expenses on a non-GAAP basis were $7.3 million in Q3 Fiscal 2024, compared to $6.4 million in the prior quarter and $6.0 million in Q3 Fiscal 2023.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024
Mercury Systems, SRAM, Microchip Technology, FD-SOI, Renesas Electronics, PCB Piezotronics, Integrated circuit, Organization, BFSI, Transport, FPGA, Analog Devices, Architecture, Configuration, Hardware, Memory, USB flash drive, Electronics, Defense, GSI, AMD, DSP, RF, ROW, SSD, Telecommunications, Teledyne Technologies, Infineon Technologies, External, Radiation, MCU, SOI, Texas Instruments, Operating system, Honeywell, Middleware, Silicon, BAE Systems, GCC, Deployment, ASIC, STMicroelectronics, Data center, COVID-19, MPU, Internal, Consumer electronics

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024
Mercury Systems, SRAM, Microchip Technology, FD-SOI, Renesas Electronics, PCB Piezotronics, Integrated circuit, Organization, BFSI, Transport, FPGA, Analog Devices, Architecture, Configuration, Hardware, Memory, USB flash drive, Electronics, Defense, GSI, AMD, DSP, RF, ROW, SSD, Telecommunications, Teledyne Technologies, Infineon Technologies, External, Radiation, MCU, SOI, Texas Instruments, Operating system, Honeywell, Middleware, Silicon, BAE Systems, GCC, Deployment, ASIC, STMicroelectronics, Data center, COVID-19, MPU, Internal, Consumer electronics

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

SHAREHOLDER UPDATE: Halper Sadeh LLC Investigates AKTX, HES, TGAN, NS

Retrieved on: 
Tuesday, March 5, 2024
Renesas Electronics, Fraud, Akari, Sale, NuSTAR, Hess Corporation, Advertising, Therapy, Transphorm, Chevron Corporation, Electronics, Sunoco, NuStar Energy, Security (finance)

If you are an Akari shareholder, click here to learn more about your rights and options .

Key Points: 
  • If you are an Akari shareholder, click here to learn more about your rights and options .
  • If you are a Hess shareholder, click here to learn more about your rights and options .
  • Halper Sadeh LLC may seek increased consideration for shareholders, additional disclosures and information concerning the proposed transaction, or other relief and benefits on behalf of shareholders.
  • Halper Sadeh LLC represents investors all over the world who have fallen victim to securities fraud and corporate misconduct.

AXCELIS STRENGTHENS ITS BOARD WITH THE ELECTION OF TWO DIRECTORS

Retrieved on: 
Wednesday, February 28, 2024
Physics, Axcelis Technologies, Rambus, Renesas Electronics, Strategic planning, Pillsbury (brand), Growth, Silicon, University, RBC, Boğaziçi University, Business administration, Engineering, Accounting, Silicon Labs, Electrical engineering, Electronics, IP, Piper Sandler Companies, Agere Systems, Dain, Laboratory, Management

"We are pleased to welcome Gregory Graves and Dr. Necip Sayiner to the Axcelis board," said President and CEO of Axcelis Technologies, Russell Low.

Key Points: 
  • "We are pleased to welcome Gregory Graves and Dr. Necip Sayiner to the Axcelis board," said President and CEO of Axcelis Technologies, Russell Low.
  • "We believe their combined experience in semiconductor technology, strategy and business development will be a tremendous asset to Axcelis.
  • We look forward to their contributions as we lead Axcelis to the next level of growth."
  • He is currently a board member at Rambus, Inc., a manufacturer of semiconductor chips and IP that advance data center connectivity.

DIGITIMES Asia: Why TSMC may have different strategies in Japan and Arizona? Q&A with former TSMC General Counsel Richard Thurston

Retrieved on: 
Tuesday, February 27, 2024
IDM, Well, CHIPS, Online, Senior, Investment, Culture, Government, TSMC, METI, Apple, Angstrom, Workforce, CMOS, Fujitsu, Joint venture, Principal, TI, Renesas Electronics, AMD, Federal, Suggestion, State, Interview, SSMC, Multimedia, Foot, General counsel, Bleeding, Attitude, Research, Sony, Chartered Semiconductor Manufacturing, Friends, IBM, Samsung, Texas Instruments, Communication, MediaTek, UMC, MOTIE, Politics, Semiconductor

Based on your experience in Japan and your work at TSMC, why is semiconductor manufacturing so successful in this part of Asia?

Key Points: 
  • Based on your experience in Japan and your work at TSMC, why is semiconductor manufacturing so successful in this part of Asia?
  • In Japan, pure-play foundries have not yet been successful, and making this business model work in Japan will be challenging.
  • Therefore, I've been in a unique position to observe the successful development of the semiconductor industry in these Asian countries.
  • Online Forum - TSMC Sparks Semiconductor Renaissance in Japan:
    Delve into "TSMC Sparks Semiconductor Renaissance in Japan" at our GeoWatch Webinar.