PCI Express

Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet ExpressTM (UCIeTM) Subsystem for High-Performance AI Infrastructure

Retrieved on: 
Tuesday, March 12, 2024
Networks, Internet, Hardware, Artificial Intelligence, Data Management, Technology, IOT (Internet of Things), Semiconductor, HBM, Info, Innovation, Integration, CHI, CXL, CXS, PCI Express, Multi, Marketing, OIP, Semi, Ecosystem, PHY, Multimedia, Computation, UCIe, TSMC, Silicon, Video game

This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon.

Key Points: 
  • This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon.
  • It paves the way for a robust, open chiplet ecosystem that accelerates connectivity and compute for high-performance AI systems.
  • An industry-first live demo of Alphawave Semi’s 24Gbps UCIe silicon platform on the TSMC 3nm process was recently unveiled at the Chiplet Summit in Santa Clara, CA.
  • View the full release here: https://www.businesswire.com/news/home/20240311461384/en/
    Alphawave Semi 24Gbps UCIe 3nm silicon platform (Graphic: Business Wire)
    Alphawave Semi’s 3nm UCIe complete PHY + Controller subsystem is capable of 24Gbps data rates, delivering high bandwidth density at extremely low power and low latency.

Inventec Unveils P8000IG6 - The Most Advanced Platform for AI and HPC Workloads

Retrieved on: 
Wednesday, April 3, 2024
DDR5 SDRAM, GPU, Small Business Saturday, Communication, H100, HPC, DDR5, PCI Express, AI, Graphics processing unit, TPE, Atmosphere, NIC, McKinsey & Company, CPU, Video game

TAIPEI, April 3, 2024 /PRNewswire/ -- Inventec (TPE: 2356), a global leader in high-powered servers headquartered in Taiwan, is launching its P8000IG6 server for rapidly and flexibly scaling up data center capacity to take on the most advanced AI and high-performance computing (HPC) workloads.

Key Points: 
  • "In the age of AI, data centers are increasingly faced with the need to rapidly scale up capacity — and Inventec's P8000IG6 server is the answer," notes George Lin, VP of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG).
  • "Not only does our modular design deliver rapid deployment and maximal flexibility, but its leading-edge technology enables our customers to run the most advanced applications."
  • Powered by up to eight GPUs, P8000IG6 is built around the NVIDIA® HGX™ AI supercomputing platform, optimized for the most advanced AI and HPC workloads, and customers can select from NVIDIA® H100, H200, or B100 GPUs.
  • Adding to its array of top technologies, P8000IG6 offers the latest DDR5 SDRAM and PCIe Gen. 5.0 connectivity.

AMD Showcases AEWIN High-Density Edge Computing Server at Embedded World 2024

Retrieved on: 
Tuesday, April 2, 2024
DTLS, SSL/TLS, OS, QAT, IPMI, CRPS, Total cost, Memory, Embedded, RAID, Common, NVM Express, DDR5, PCI Express, AI, BMC, OCP, Solid-state drive, AMD, IPsec, TDP, CPU, Video game

TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.

Key Points: 
  • TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.
  • The BAS-6101A supports the latest AMD Bergamo CPU with up to 128 cores (~100% increased) and 400W TDP (~28% increased) to enable the extreme computing power pursued in the market.
  • With its short-depth design of 600mm for easy deployment at the edge, the system is suitable for diverse Edge AI applications.
  • Learn more about AEWIN BAS-6101A at AMD's booth at Embedded World 2024 or contact AEWIN sales at any time!

Solid State Cooling Market worth $1.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 27, 2024
Cloud, Genomics, External, SLC, Urbanization, MLC, Biomedical Research, Transport, Enterprise, Molecular biology, NvSRAM, USB, PMC, Statistics, PCR, FRAM, Biotechnology, EVS, Row, Form, Air conditioning, Electronics, DNA, PCI Express, TLC, USB flash drive, Payment card, Region, Polymerase chain reaction, EEPROM, SAS, Agriculture, SATA, Refrigeration, Food, Authentication, PCI, Resistive random-access memory, LED, Defense, Temperature, Consumer electronics, Growth, Access management, SSD, LAN, Internal, MRAM, Content, Near-field communication, EPROM, Protection, Coherent Corp., NRAM, Government, Hardware, Adhesive

Solid state cooling market for electrocaloric technology to hold the highest CAGR during the forecast period.

Key Points: 
  • Solid state cooling market for electrocaloric technology to hold the highest CAGR during the forecast period.
  • Solid state cooling market for thermocycler type to hold the highest CAGR during the forecast period.
  • Solid state cooling market for automotive vertical to hold the highest CAGR during the forecast period.
  • These players have a strong market presence for Solid state cooling s across various North America, Europe, Asia Pacific, and RoW countries.

XConn Technologies Releases Early Production Silicon Samples of "Apollo" CXL 2.0 Switch at MemCon 2024

Retrieved on: 
Tuesday, March 26, 2024
Memorandum, SOC, Computer, Computer History Museum, Apollo, Memory, 2.0, CXL, AI, PCI Express, Samsung, 1.1, Cloud computing, Ecosystem, OAM, Silicon, Video game

MOUNTAIN VIEW, Calif., March 26, 2024 /PRNewswire/ -- XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced the release of early production samples for its "Apollo" CXL 2.0 switch. XConn Apollo will be the central component of a real-world use case demonstration of a CXL Memory Pool, with Samsung during MemCon 2024, March 26-27, in Mountain View, Calif.

Key Points: 
  • MOUNTAIN VIEW, Calif., March 26, 2024 /PRNewswire/ -- XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced the release of early production samples for its "Apollo" CXL 2.0 switch.
  • The XConn Apollo switch is the industry's first and only hybrid CXL 2.0 and PCIe Gen 5 interconnect solution.
  • "Today's release of production silicon samples of our Apollo CXL 2.0 switch marks a new milestone in our next-generation interconnect journey.
  • XConn CXL switch SoC chip is used in Samsung CMM-B (CXL Memory Module – Box)."

Silicon Motion Unveils High-Performance Single Chip PCIe Gen4.0 BGA Ferri® SSD with i-temp for Industrial and Automotive Applications

Retrieved on: 
Tuesday, March 26, 2024
IOV, Temperature, EFuse, SIMO, Embedded, Sale, PCI Express, Motion, Silicon, TB, Solid-state drive, Telecommunications, Marketing, Silicon Motion, Computer data storage

TAIPEI and MILPITAS, Calif., March 26, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries™ technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

Key Points: 
  • This latest solution features support for i-temp and integrates advanced IntelligentSeries™ technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.
  • The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16mm x 20mm BGA chip-scale package.
  • Additional features of the FerriSSD solution includes:
    Built-in SR-IOV capability, enabling virtual machines to share a single physical PCIe device, ensuring greater flexibility and scalability, while maintaining security.
  • Digitally signed firmware with eFuse, AES-128/256 encryption
    Silicon Motion is dedicated to developing innovative and highly adaptable cutting-edge solutions.

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Tuesday, March 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Computer appliance, TDP, Video game

TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Tuesday, March 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Multimedia, Computer appliance, TDP, Video game

TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

Retrieved on: 
Monday, March 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

Retrieved on: 
Monday, March 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.