LeCroy Corporation

Industry-First SSD Compliance Suite Software Enables Open Compute Project (OCP) Validation Testing

Retrieved on: 
Thursday, September 22, 2022
Cloud, Software, Adoption, Open Compute Project, Time, Risk, LeCroy Corporation, Teledyne Technologies, Company, Compliance, Microsoft, Industry, Solution, Solid-state drive, OCP, SSD, Multimedia, Computer data storage, Video game console, Online shopping

LOOMIS, Calif., Sept. 22, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test and measurement solutions, announces availability of the OCP 1.0a Cloud solid state drive (SSD) compliance suite software for use with the OakGate SSD test platform. This compliance suite software provides an unprecedented level of functionality, performance, and ease of use for testing enterprise-level storage devices.

Key Points: 
  • OakGate test platform with new compliance suite software validates OCP specification compliance, ensuring unmatched performance in hyperscale data centers.
  • This compliance suite software provides an unprecedented level of functionality, performance, and ease of use for testing enterprise-level storage devices.
  • Testing for compliance using the OCP Cloud SSD Compliance Suite software makes validation easy.
  • "We are excited to see Teledyne LeCroy deliver the industry's first OCP Cloud SSD Compliance Suite in support of our Cloud SSD initiatives" said Dillip Dash, Sr. Director Storage Device Validation at Microsoft.

Ethernet Alliance Lights Up ECOC 2022 With Cutting-Edge Interoperability Demonstration

Retrieved on: 
Tuesday, September 13, 2022
VoIP, Software, Mobile, Wireless, Networks, Internet, Hardware, Electronic Design Automation, Data Management, Technology, Semiconductor, Security, Telecommunications, Gigabit, VP, Connected space, TE, Twitter, NYSE, LeCroy Corporation, JNPR, TEL, TE Connectivity, Tektronix, Teledyne Technologies, SFP56, QSFP, ECOC, OSFP, LinkedIn, TDY, Compliance, Gigabit Ethernet, Industry, IEEE, IP, Â, Ethernet Alliance, Transport, Facebook, Amphenol, Technology, EXFO, Solution, Juniper Networks, European Conference on Wireless Sensor Networks, NASDAQ, SFP, Conference, INTC, Education, Intel, Internet service provider, Ethernet

The Ethernet Alliance , a global consortium dedicated to the continued success and advancement of Ethernet technologies, today unveiled details of its multivendor interoperability demonstration at the 2022 European Conference on Optical Communication (ECOC) .

Key Points: 
  • The Ethernet Alliance , a global consortium dedicated to the continued success and advancement of Ethernet technologies, today unveiled details of its multivendor interoperability demonstration at the 2022 European Conference on Optical Communication (ECOC) .
  • Representing a diverse array of industry pacesetters, this years Ethernet Alliance ECOC interoperability demo is the centerpiece of its interactive exhibit.
  • The Ethernet Alliance interoperability demonstration at ECOC 2022 further highlights the interdependencies of the Ethernet ecosystem and the need for heightened specification conformance from all its participants.
  • This years Ethernet Alliance demonstration at ECOC brings together an abundance of products and testing solutions that showcases interoperability and test solutions for 25Gb/s up to 800Gb/s.

Protocol Test system approved by USB-IF for USB Power Delivery, USB Type-C® and USB 3.2 Link Layer Compliance Testing

Retrieved on: 
Tuesday, September 6, 2022
COO, USB-C, USB, Personal computer, Voyager, USB Implementers Forum, PD, USB PD, Company, Compliance, USB hardware, Ecosystem, Automation, USB4, Marketing, Computer data storage, Satellite navigation device, Inspection, LeCroy Corporation, Teledyne Technologies

MILPITAS, Calif., Sept. 6, 2022 /PRNewswire/ -- Teledyne LeCroy Inc., the worldwide leading supplier of serial protocol test solutions, has announced that the Voyager M4x Analyzer/Exerciser system has been approved by the USB Implementer's Forum (USB-IF) for USB Power Delivery (USB PD), USB Type-C Functional and USB 3.2 Link Layer compliance testing.  The Voyager M4x also supports USB4® logical and protocol layer compliance allowing this single test platform to address the most critical technologies within the USB Type-C ecosystem.

Key Points: 
  • MILPITAS, Calif., Sept. 6, 2022 /PRNewswire/ -- Teledyne LeCroy Inc., the worldwide leading supplier of serial protocol test solutions, has announced that the Voyager M4x Analyzer/Exerciser system has been approved by the USB Implementer's Forum (USB-IF) for USB Power Delivery (USB PD), USB Type-C Functional and USB 3.2 Link Layer compliance testing.
  • The Voyager M4x also supports USB4 logical and protocol layer compliance allowing this single test platform to address the most critical technologies within the USB Type-C ecosystem.
  • And now the addition of USB Type-C, USB PD and USB 3.2 Link Layer compliance brings together all the critical technologies that USB developers care about," said Joe Mendolia, vice-president of marketing at Teledyne LeCroy's Protocol Solutions Group.
  • USB Power Delivery (USB PD), USB Type-C Functional and USB 3.2 Link Layer compliance testing are available now as licensed options that can be added to existing Voyager M4x systems.

First PCI Express® 5.0 Mini Cool Edge IO™ (MCIO) Interposer

Retrieved on: 
Tuesday, August 2, 2022
PCI-SIG, Time, View, Transfer (computing), CXL, PCI Express, NVM Express, Solution, Teledyne Technologies, Multimedia, PCIE, Interposer, HPC, NVM, PHY, Company, Compute Express Link, PCI, Summit, Sega, Video game console, Printed circuit board, Online shopping, LeCroy Corporation, Test probe

MILPITAS, Calif., Aug. 2, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy's Summit™ family of PCI Express 5.0 protocol analyzers.  The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express® (NVMe) or Compute Express Link™ (CXL) technologies.  The PCIe 5.0 MCIO Interposer joins the list of CrossSync™ PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views. No other solution gives this type of insight into link behavior.

Key Points: 
  • Test MCIO-based high-speed interfaces for PCIe, NVMe, or CXL up to 32GT/s
    MILPITAS, Calif., Aug. 2, 2022 /PRNewswire/ --Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy's Summit family of PCI Express 5.0 protocol analyzers.
  • The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies.
  • The Mini Cool Edge IO connector is a flexible, robust, and cost-effective connector and cable assembly that helps equipment designers offer flexibility, reduce overall space requirements, and extend the reach for high data rate signals.
  • NVMe and NVM Express are registered trademarks and/or service marks of NVM Express, Inc. CXL and Compute Express Link are trademarks and/or service marks of the Compute Express Link Consortium, Inc.
    View original content to download multimedia: https://www.prnewswire.com/news-releases/first-pci-express-5-0-mini-cool...

Fibre Channel Industry Association Exhibits Next-Gen Fibre Channel Technologies at Flash Memory Summit 2022

Retrieved on: 
Monday, August 1, 2022
Y/Y, Hewlett Packard Enterprise, LeCroy Corporation, CA, Santa Clara Convention Center, Fibre Channel, Congestion, Teledyne Technologies, Multimedia, FCP, Adoption, Organization, FC, Technology, Marvell, NVM Express, Growth, Tissue paper, Nightclub, Fiber, Amphenol, SAN, Textile, Broadcom Inc.

MINNEAPOLIS, Aug. 1, 2022 /PRNewswire/ -- Ahead of the first in-person Flash Memory Summit since 2019, the Fibre Channel Industry Association (FCIA) today announced that it will be demonstrating why Fibre Channel is the go-to transport for business and mission critical applications at this year's show as adoption continues to grow.

Key Points: 
  • The FCIA is attending this year's Flash Memory Summit at a time when Fibre Channel adoption shows strong growth.
  • This week in booth #755 at the Flash Memory Summit , the FCIA is conducting a public demonstration highlighting the latest multi-vendor Fibre Channeltechnologies in an end-to-end fabric utilizing NVMe over Fabrics (FC-NVMe) running over Fibre Channel concurrentlywith legacy FCP/SCSI.
  • This year's Solutions Guide provides the latest insights into how Fibre Channel delivers value for organizations, including how Fibre Channel networks deliver more than just speed, and how organizations can learn to succeed with Fibre Channel solutions.
  • FCIA representatives will be on-hand at booth #755 at Flash Memory Summit from August 2-4, Santa Clara Convention Center, Santa Clara, CA.

SmartTest™ Automation Improves Internet of Things (IoT) Device Testing

Retrieved on: 
Thursday, July 28, 2022
LeCroy Corporation, Zigbee, Electronics, Solution, Artificial intelligence, Front line, Teledyne Technologies, USB, Android Auto, Adoption, Machine learning, Company, Bluetooth, CarPlay, Robotics, Health, IOT, Medical device, Online shopping

FARMINGTON HILLS, Mich., July 28, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in connectivity test solutions, is pleased to announce that their Frontline Test Services team has developed SmartTest automated testing to enhance their testing capabilities. SmartTest automated testing enables the most rigorous and repeatable testing possible while reducing test times and customer costs.

Key Points: 
  • SmartTest automated testing enables the most rigorous and repeatable testing possible while reducing test times and customer costs.
  • Many IoT device manufacturers do not have these testing capabilities, and some find outsourced testing services to be cost prohibitive.
  • Now, with the adoption of SmartTest automated testing, testing is better and more affordable.
  • Combined with Frontline Test Services' expert-level testing and analysis, the SmartTest automation system can speed up test cycles from years to just days.

OakGate PCIe® Gen5 Solid-State Storage Test Solutions Deliver Increased Scalability and Performance

Retrieved on: 
Tuesday, July 12, 2022
Interposer, Compliance, Availability, LeCroy Corporation, Solution, SSD, Solid-state drive, U.2, Company, Digital, PCI, DE200, CEM, EDSFF, PCI Express, NVM, Driving licence in Singapore, System, NVM Express, SVF, Save, M.2, Adoption, Modularity, Industry, Flash memory, Warehouse, Medical device, Computer data storage, Video game console, Online shopping, Teledyne Technologies, Western Digital

LOOMIS, Calif., July 12, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test and measurement solutions, announces availability of validation test appliances for PCIe Gen5 based Solid State Drives. The OakGate R300 3U rackmount test appliance and the OakGate DE200 desktop test appliance offer scalable validation and conformance testing of the latest generation of solid-state drives (SSDs).

Key Points: 
  • The OakGate R300 and the OakGate DE200 test appliances provide design and test engineers the means to test the performance and specification compliance of these PCIe Gen5 quickly and efficiently based SSDs.
  • OakGate's PCIe Gen5 test solutions push the boundary for performance and functionality by providing:
    Products for any size project Systems can be configured to match your requirements.
  • "Our PCIe Gen5 test solutions are powered by the industry's most widely used software suite, SVF Pro/Enduro.
  • OakGate R300 rackmount test appliances and the OakGate DE200 desktop test appliances for PCIe Gen5 SSD can be ordered now.

First PCIe® Integrity and Data Encryption (IDE) Protocol Testing Solutions Now Available

Retrieved on: 
Tuesday, June 14, 2022
CA, Time, Company, IDE, LeCroy Corporation, PCI Express, PCIE, Conference, Generation, Confidentiality, Solution, Developer, PCI-SIG, Technology, Integrity, Teledyne Technologies, Summit, Muscle Atrophy Research and Exercise System, Cryptocurrency

MILPITAS, Calif., June 14, 2022 /PRNewswire/ -- Teledyne LeCroy, a worldwide leader in serial data test solutions, will be showcasing new protocol analysis and traffic generation solutions for testing PCI Express (PCIe) Integrity and Data Encryption (IDE) security protocols using their Summit Protocol Analyzers and Exercisers at the PCI Special Interest Group (PCI-SIG) Developers Conference 2022 in Santa Clara, CA on June 21-22, 2022.

Key Points: 
  • MILPITAS, Calif., June 14, 2022 /PRNewswire/ -- Teledyne LeCroy, a worldwide leader in serial data test solutions, will be showcasing new protocol analysis and traffic generation solutions for testing PCI Express (PCIe) Integrity and Data Encryption (IDE) security protocols using their Summit Protocol Analyzers and Exercisers at the PCI Special Interest Group (PCI-SIG) Developers Conference 2022 in Santa Clara, CA on June 21-22, 2022.
  • The PCIe technology is integral to high-speed flow of information, and the PCI-SIG has recognized the importance of secured data transfers with the introduction of IDE capabilities to the PCI Express specification.
  • Users of Teledyne LeCroy systems appreciate the rich library of decodes and analysis capabilities that are available on all of Teledyne LeCroy's PCIe specification test tools.
  • The PCIe IDE Analysis and Generation licenses for Summit Protocol Analyzers and Exercisers can be ordered now.

First PCI Express® 5.0 OCP NIC 3.0 Interposer

Retrieved on: 
Tuesday, May 10, 2022
GPU, Summit, Transfer (computing), OCP, Teledyne Technologies, NVM Express, Company, Sega, Time, LeCroy Corporation, Network interface controller, Compute Express Link, PHY, CXL, PCI Express, PCI, PCI-SIG, NIC, Solution, SFF, NVM, PCIE, Cryptocurrency, Online shopping, Probe effect

MILPITAS, Calif., May 10, 2022 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of a PCI Express 5.0 Open Compute Project (OCP) Network Interface Card (NIC) 3.0 interposer that works in combination with Teledyne LeCroy's Summit family of PCI Express 5.0 protocol analyzers.  The new OCP interposer allows engineers to test product designs that incorporate OCP NIC 3.0 with PCIe 5.0, NVM Express® (NVMe) or Compute Express Link™ (CXL) technologies.  The PCIe 5.0 OCP interposer joins the list of CrossSync™ PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views. No other solution gives this type of insight into link behavior.

Key Points: 
  • The new OCP interposer allows engineers to test product designs that incorporate OCP NIC 3.0 with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies.
  • The specification utilizes the SFF-TA-1002 connector and enables any OCP NIC 3.0 card from any vendor to work in any OCP NIC 3.0 server.
  • The PCIe 5.0 OCP NIC 3.0 interposer, which can be optionally upgraded withCrossSync PHY support, has been added to the Teledyne LeCroy PCI Express test solutions product line with the product code of PE260UIA-X.
  • NVMe and NVM Express are registered trademarks and/or service marks of NVM Express, Inc. CXL and Compute Express Link are trademarks and/or service marks of the Compute Express Link Consortium, Inc.

PCI-SIG® Approves Teledyne LeCroy PCI Express® 5.0 Compliance Solution

Retrieved on: 
Tuesday, March 15, 2022
Time, Solution, Technology, PCI Express, Director, Peripheral, PCI, Adoption, Compliance, IOT, PCI-SIG, Board, Company, Teledyne Technologies, Industry, Ecosystem, LeCroy Corporation, Interest group, Payment card, Inspection

"As a member of PCI-SIG, Teledyne LeCroy contributes to compliance testing as part of the PCI Express ecosystem enablement," said Al Yanes, PCI-SIG President and Chairman.

Key Points: 
  • "As a member of PCI-SIG, Teledyne LeCroy contributes to compliance testing as part of the PCI Express ecosystem enablement," said Al Yanes, PCI-SIG President and Chairman.
  • Teledyne LeCroy protocol analyzers and exercisers have been at the forefront of PCI Express technology development since its deployment of PCI Express protocol analyzers 18 years ago, working closely with the computer, storage and IoT industry to provide the most comprehensive analysis functionality engineers need for their products.
  • For additional information, contact Teledyne LeCroy at 1-800-5LeCroy (1-800-553-2769) or visit Teledyne LeCroy's web site at teledynelecroy.com .
  • Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy's website at teledynelecroy.com .