Wafer

Cree, Inc. Announces Expansion of Operations Leadership Team

Retrieved on: 
Tuesday, August 3, 2021
Technology, Mobile, Wireless, Semiconductor, Data management, Semiconductor device fabrication, Wolfspeed, Wafer, Companies

Cree, Inc. (Nasdaq: CREE), the global leader in Silicon Carbide (SiC) technology through its Wolfspeed business, today announced the expansion of the operations leadership team as part of the Companys accelerated growth and capacity expansion plans and planned retirement of Rick McFarland, Crees Senior Vice President of Global Operations, in the Summer of 2022.

Key Points: 
  • Cree, Inc. (Nasdaq: CREE), the global leader in Silicon Carbide (SiC) technology through its Wolfspeed business, today announced the expansion of the operations leadership team as part of the Companys accelerated growth and capacity expansion plans and planned retirement of Rick McFarland, Crees Senior Vice President of Global Operations, in the Summer of 2022.
  • Rick has done an incredible job of helping us position the company for long-term growth and improve performance across our operations footprint.
  • Felton joined Cree in 2019 and currently serves as Senior Vice President of Fab Operations.
  • As a former factory and site manager for a high-volume wafer fab, she possesses extensive expertise in overseeing large-scale manufacturing operations.

SONIC Takes Guests Back in Time With New Banana Pudding Shake

Retrieved on: 
Monday, August 2, 2021
Retail, Restaurant, Bar, Food, Beverage, Food and drink, Foods, Puddings, Cuisine of the Southern United States, Banana pudding, Canadian cuisine, Nilla, Wafer, Dessert, Icebox cake

SONIC Drive-In adds a new, limited-time-only Banana Pudding Shake to its delicious dessert lineup, creating a creamy, sippable version of a classic childhood treat that features the comforting taste of banana pudding.

Key Points: 
  • SONIC Drive-In adds a new, limited-time-only Banana Pudding Shake to its delicious dessert lineup, creating a creamy, sippable version of a classic childhood treat that features the comforting taste of banana pudding.
  • View the full release here: https://www.businesswire.com/news/home/20210802005049/en/
    The Banana Pudding Shake is made with SONICs creamy Real Ice Cream, blended with fresh banana, banana pudding flavor and NILLA Wafers.
  • (Photo: Business Wire)
    The Banana Pudding Shake is made with SONICs creamy Real Ice Cream, blended with fresh banana, banana pudding flavor and NILLA Wafers.
  • Complete with whipped topping, extra pieces of crumbled NILLA Wafers and a cherry top, the Banana Pudding Shake is sure to bring you back to your childhood with every sip.

DGAP-News: Siltronic reports strong sales growth and high profitability in Q2 2021

Retrieved on: 
Wednesday, July 28, 2021
Chemistry, Physical sciences, Natural sciences, Siltronic, Wafer, Silicon, SEMI

The Q2 interim report and the latest investor presentation are also published on the Siltronic website.

Key Points: 
  • The Q2 interim report and the latest investor presentation are also published on the Siltronic website.
  • Siltronic is one of the world's largest manufacturers of hyperpure silicon wafers and partner to many leading semiconductor companies.
  • Siltronic AG employs around 3,900 people and has been a stock-listed company in Germany (Prime Standard) since 2015.
  • This press release contains forward-looking statements based on assumptions and estimates made by the Executive Board of Siltronic AG.

STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers

Retrieved on: 
Tuesday, July 27, 2021
Materials, Chemistry, Physical sciences, Semiconductor device fabrication, Wafer, Silicon carbide, Silicon, STMicroelectronics, Micropipe

Among the first in the world, STs initial 200mm SiC wafers are also very high quality, with minimal yield-impacting and crystal-dislocation defects.

Key Points: 
  • Among the first in the world, STs initial 200mm SiC wafers are also very high quality, with minimal yield-impacting and crystal-dislocation defects.
  • The low defectivity has been achieved by building on the excellent know-how and expertise in SiC ingot growth technology developed by STMicroelectronics Silicon Carbide A.B.
  • Silicon Carbide is a compound semiconductor material with intrinsic properties providing superior performance and efficiency over silicon in key, high-growth power applications for electro-mobility (e-mobility) and industrial processes, among others.
  • 200mm wafers enable a capacity increase, with almost twice the useful area for manufacturing integrated circuits compared to 150mm wafers, delivering 1.8 - 1.9 times as many working chips.

AKHAN Semiconductor Fabricates First of its Kind 300MM Diamond Wafer

Retrieved on: 
Tuesday, July 27, 2021
Mobile, Wireless, Technology, Semiconductor, Other Technology, Telecommunications, Nanotechnology, Networks, Hardware, Electronic design automation, Consumer electronics, Semiconductor device fabrication, Chemistry, Physical sciences, Natural sciences, MOSFETs, Wafer, Silicon

AKHAN Semiconductor (AKHAN), a technology company specializing in the fabrication and application of synthetic, lab-grown electronics-grade diamond materials addressing semiconductor, telecom, and consumer industries and global markets, today showcased the ability to manufacture 300MM complementary metaloxidesemiconductor (CMOS) diamond wafers.

Key Points: 
  • AKHAN Semiconductor (AKHAN), a technology company specializing in the fabrication and application of synthetic, lab-grown electronics-grade diamond materials addressing semiconductor, telecom, and consumer industries and global markets, today showcased the ability to manufacture 300MM complementary metaloxidesemiconductor (CMOS) diamond wafers.
  • Due to its inherent properties, diamond is proven to be the most optimal semiconductor material, far outmatching the capabilities of silicon, the industry-standard material for more than six decades.
  • To produce the worlds most advanced technologies, semiconductor fabricators traditionally rely on 300MM silicon wafers despite the fact that silicon has reached its physical limitations.
  • AKHANs 300MM diamond wafer is the foundational building block that will lead to more powerful and durable devices that run cooler, and fabricators only need to make minor updates to their existing manufacturing processes, said Adam Khan, Founder of AKHAN Semiconductor.

Wafer Dicing Saws Market | Post COVID-19 Analysis | Technavio

Retrieved on: 
Monday, July 26, 2021
Semiconductor device fabrication, Dicing saw, Wafer dicing, Wafer, Saw, DICING, Marketplace, DICING, Human activities, Human behavior

The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio's latest market report.

Key Points: 
  • The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio's latest market report.
  • The wafer dicing saws market share growth by the pureplay foundriessegment has been significant and is expected to provide significant growth opportunities to market vendors.
  • Taiwan, South Korea (Republic of Korea), Japan, and Chinaare the key markets forwafer dicing saws market in APAC.
  • Advanced Dicing Technologies operates its business under segments- Dicing Saws, Dicing Blades, Peripheral Equipment, and Dicing Accessories.

ACM Research to Release Second Quarter 2021 Financial Results on August 5, 2021; Conference Call on August 6, 2021

Retrieved on: 
Wednesday, July 21, 2021
Semiconductor device fabrication, Electronics manufacturing, Electronics industry, Wafer, Semiconductor device, Microtechnology, Semiconductors

ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing, as well as wafer-level packaging.

Key Points: 
  • ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing, as well as wafer-level packaging.
  • The company is committed to delivering customized, high performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield.
  • ACM Research, Inc.
  • The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a symbol, but that practice does not mean that ACM Research will not assert, to the fullest extent under applicable law, its rights to such trademark.

GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

Retrieved on: 
Monday, July 19, 2021
Semiconductor device fabrication, GlobalFoundries, Companies, Electronics industry, Semiconductor fabrication plant, SEMI, Wafer, TSMC, Wafer fabrication

MALTA, N.Y., July 19, 2021 /PRNewswire/ --GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years.

Key Points: 
  • MALTA, N.Y., July 19, 2021 /PRNewswire/ --GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years.
  • GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing fab to help address the global chip shortage.
  • GF has invested more than $15 billion in its Fab 8 facility over the last decade to support innovation and increase manufacturing capacity.
  • GlobalFoundries (GF) is one of the world's leading semiconductor manufacturers and the only one with a truly global footprint.

Aehr Receives $10.8 Million Order for Production Test and Burn-in of Silicon Carbide Power Semiconductors for Electric Vehicles

Retrieved on: 
Monday, July 19, 2021
Materials, Semiconductor device fabrication, Matter, Chemistry, Wafer, Silicon carbide, Silicon Valley Microelectronics

Our solution can not only test 100mm and 150mm diameter silicon carbide wafers, but can test the future 200mm wafers planned to be introduced over the next several years.

Key Points: 
  • Our solution can not only test 100mm and 150mm diameter silicon carbide wafers, but can test the future 200mm wafers planned to be introduced over the next several years.
  • Aehr provides a unique fully integrated solution that includes the test systems, full wafer WaferPak Contactors, and WaferPak Aligners.
  • Silicon carbide power semiconductors have emerged as the preferred technology for battery electric vehicle power conversion in on-board and off-board electric vehicle battery chargers, and the electric power conversion and control of the electric engines.
  • These stats highlight the tremendous opportunity Aehr Test has in front of it with its wafer level test and burn-in solution for electric vehicle semiconductors.

Taiwanese Semiconductor Manufacturing Industry, 2Q 2021 Market Report: Shipment Value Reached $15.7 Billion in the Q1 of 2021, Up 3.0% Sequentially and 28.8% y-o-y - ResearchAndMarkets.com

Retrieved on: 
Monday, July 19, 2021
Technology, Semiconductor, Semiconductor device fabrication, 1Q, Wafer, Semiconductor devices, Electronics industry, Industry economics)

The report finds that the shipment value of the Taiwanese semiconductor manufacturing industry reached US$15.7 billion in the first quarter of 2021, up 3.0% sequentially and 28.8% year-on-year.

Key Points: 
  • The report finds that the shipment value of the Taiwanese semiconductor manufacturing industry reached US$15.7 billion in the first quarter of 2021, up 3.0% sequentially and 28.8% year-on-year.
  • This research report presents a shipment value forecast and a recent quarter review of the Taiwanese semiconductor manufacturing industry.
  • Taiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2019 - 3Q 2021
    Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2019 - 3Q 2021
    Taiwanese Semiconductor Manufacturing Industry 8"-Equiv.
  • Wafer Shipment Volume and Utilization Rate, 1Q 2019 - 3Q 2021
    Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2019 - 3Q 2021
    Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2019 - 1Q 2021
    Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Business Type, 1Q 2019 - 1Q 2021
    Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2019 - 1Q 2021
    Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2019 - 1Q 2021
    Taiwanese Foundry Industry's Shipment Value Ranking, 1Q 2019 - 1Q 2021
    Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2019 - 1Q 2021
    Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2019 - 1Q 2021
    Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2019 - 1Q 2021
    Taiwanese DRAM Industry's 8"-Equiv.