Wide Open West

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

Retrieved on: 
Monday, March 25, 2024
Wide Open West, Cleveland Avenue, HBM, Samsung Catalyst Fund, Growth, Intel Capital, AI, Tiger Global Management, Telescopic sight

Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.

Key Points: 
  • Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.
  • The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.
  • Eliyan's chiplet interconnect technology achieves up to 4x the performance and half the power of other solutions.
  • The company's NuLink PHY, proven on advanced process nodes, addresses both Die-to-Die and Die-to-Memory interconnect with its highly efficient performance metrics.

UTMHealthcare Partners with Somml Health to Enhance Chronic Disease Care with Launch of NuLink Health

Retrieved on: 
Wednesday, March 6, 2024
Health Technology, Diabetes, Telemedicine, Virtual Medicine, Technology, Practice Management, Apps, Applications, Managed Care, Mental Health, Infectious Diseases, Hospitals, Cardiology, Software, Nursing, Health, Mobile, Wireless, Heart, Hospital, Caregiver, RPM, Conditional sentence, Communication, Chronic obstructive pulmonary disease, Hypertension, Patient, Wide Open West, Pharmaceutical industry

UTMHealthcare , a leading mobile health technology company, today announced the launch of NuLink Health in collaboration with virtual care platform Somml Health .

Key Points: 
  • UTMHealthcare , a leading mobile health technology company, today announced the launch of NuLink Health in collaboration with virtual care platform Somml Health .
  • NuLink Health partners with providers to improve the care of at-risk patients between office visits, creating operational and cost efficiencies for medical practices.
  • NuLink Health leverages UTMHealthcare’s remote patient monitoring (RPM) solution and Somml Health’s virtual care platform to provide optimal care for patients with complex chronic conditions, with the goal of lowering hospital readmissions for these patients.
  • “NuLink transmits live, accurate and secure patient data to help busy medical practices manage the care of chronic disease patients,” said Seth Lachterman, a partner and co-founder of UTMHealthcare and its parent company, YouThisMe.

Consolidated Communications Reiterates Proposed Transaction is the Best Outcome for Shareholders

Retrieved on: 
Wednesday, December 27, 2023
Communications, Technology, VoIP, Telecommunications, Networks, Other Communications, Internet, Copper, Wide Open West, DSL, ATN, BCI, Cravath, Swaine & Moore, CNSL, Rothschild & Co, Lumen Technologies, Acquisition, LLP, Committee, Latham & Watkins, Searchlight Capital, Special, Letter, Consolidated Communications, ATN International, Crown corporations of Canada, Holding company

The full text of the letter mailed to shareholders follows:

Key Points: 
  • The full text of the letter mailed to shareholders follows:
    You have an essential decision to make regarding the value of your investment.
  • In order to realize the benefits of this value-maximizing transaction, the majority of our independent shareholders must support the deal.
  • The board of directors of the Company (the “Board”) strongly believes the $4.70 per share cash offer from Searchlight and BCI is the best risk-adjusted outcome for shareholders and urges that you vote “FOR” the Proposed Transaction.
  • Following its extensive and thorough review, the Board believes this transaction is critical for Consolidated’s future and represents the best risk-adjusted outcome for its shareholders.

Consolidated Communications Files Letter to Shareholders Highlighting Benefits of Proposed Transaction with Searchlight and BCI

Retrieved on: 
Monday, December 18, 2023
Security, Technology, Telecommunications, Mobile, Wireless, Networks, Internet, Carriers and Services, Sale, EBITDA, Acquisition, Frontier Communications, Transaction, Crown corporations of Canada, LLP, Wide Open West, BCI, Investment, Risk, Copper, Government, CNSL, Consolidated, Multimedia, Public expenditure, Bring Your Board!!, ATN, Calendar, Latham & Watkins, Special, ATN International, Data-rate units, Cravath, Swaine & Moore, Consolidated Communications, Mergers and acquisitions, Charter Communications, Growth, DSL, Searchlight Capital, Rothschild & Co, Committee, Letter, Altice USA, Human, Security (finance), Cryptocurrency, Internet service provider, Holding company, Renewable energy, Risk management, Commercial property, Shentel, Access

Highlights from the letter include:

Key Points: 
  • Highlights from the letter include:
    The Proposed Transaction delivers a significant cash premium, representing a compelling opportunity for shareholders to receive an attractive and certain value for their investment.
  • The Proposed Transaction eliminates the ongoing uncertainty from liquidity, funding and execution risks and transfers those risks to Searchlight and BCI.
  • The Board recommends that you vote "FOR" the proposal to approve the Searchlight and BCI transaction (the “Proposed Transaction”) on the enclosed proxy card today.
  • The Board’s robust evaluation underscores that the Proposed Transaction is the most compelling path forward for Consolidated and its shareholders.

WOW! Extends Relationship with Netcracker for Next-Generation Revenue Management

Retrieved on: 
Tuesday, October 3, 2023
5G, Telecommunications, Internet, TV and Radio, Technology, Carriers and Services, Mobile, Wireless, Entertainment, Science and technology in Asia, Wide Open West, GM, WOW, Netcracker Technology, Sales

(WideOpenWest) has extended its relationship with Netcracker to provide a converged experience for its customer sales and care agents.

Key Points: 
  • (WideOpenWest) has extended its relationship with Netcracker to provide a converged experience for its customer sales and care agents.
  • The U.S.-based broadband provider, which offers Internet, TV and phone services in 15 markets located primarily in the Midwest and Southeast, will consolidate Netcracker’s Intelligent Agent Desktop with Netcracker Revenue Management – part of Netcracker Digital BSS – to enhance its business and improve the overall customer experience.
  • By integrating revenue management functions, the cloud-based, multitenant platform gives the WOW!
  • “We are excited to continue our close collaboration with WOW!,” said Rohit Aggarwal, GM at Netcracker.

Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry's First Working Silicon Compliant with the Spec

Retrieved on: 
Wednesday, August 16, 2023
Lead, PHY, Wide Open West, Synthetic media, Open Compute Project, Bunch, Physics, Cloud computing, IEEE, PAM4, OCP, OSDA, Generative, Artificial intelligence, Silicon, AI, Bow, Printed circuit board

Eliyan's team has deep roots in driving standards-based technologies to solve important industry challenges, which includes earlier work with OCP and its Open Domain Specific Architecture (OSDA) to propose BoW (Bunch of Wires) interconnect approach as a basis for the organization's multi-die interconnect specification.

Key Points: 
  • Eliyan's team has deep roots in driving standards-based technologies to solve important industry challenges, which includes earlier work with OCP and its Open Domain Specific Architecture (OSDA) to propose BoW (Bunch of Wires) interconnect approach as a basis for the organization's multi-die interconnect specification.
  • "We support the evolution of BoW in this latest version, which notably doubles the data rate per lane from 16Gbps to 32Gbps, and provides support for configurable directionality, both of which we support in our silicon-proven solution.
  • Farjadrad is an inventor of the original interconnect technology behind BoW, which he proposed to OCP in 2018 and it was used as the basis for the development of the initial specification of the standard.
  • The chip operates at 40Gbps/bump delivering over 2.2Tbps/mm of beachfront bandwidth at 130um pitch on standard organic packaging while meeting aggressive power and area targets.

Meta Era Summit Website Launch: Unveiling Elite Sponsors and a Star-Studded Speaker Lineup

Retrieved on: 
Friday, July 28, 2023
Crypto, Legislative Council of Hong Kong, Partnership, CPPCC, Wide Open West, Aleksandr Salnikov, National University of Singapore, Social science, General partnership, CertiK, Economics, Singapore University of Social Sciences, Cryptocurrency and crime, CoinDesk, Trailblazer, News, Cryptocurrency, Mała Panew, Wachsman, Metaverse

The highly anticipated Meta Era Summit, organized by the pioneering blockchain media powerhouse, Meta Era, in partnership with BitMart, CertiK, iPollo, and Web3Hub as title sponsors, alongside Fenbushi Capital, G-Rocket, and Cipholio Ventures as co-organizers, is all set to dazzle the world on September 12, 2023, in the vibrant city of Singapore.

Key Points: 
  • The highly anticipated Meta Era Summit, organized by the pioneering blockchain media powerhouse, Meta Era, in partnership with BitMart, CertiK, iPollo, and Web3Hub as title sponsors, alongside Fenbushi Capital, G-Rocket, and Cipholio Ventures as co-organizers, is all set to dazzle the world on September 12, 2023, in the vibrant city of Singapore.
  • With a laser focus on the captivating worlds of Metaverse and Web3, this electrifying summit beckons an impressive lineup of nearly a hundred global luminaries and trailblazers as keynote speakers.
  • The Meta Era Summit is not just a milestone—it's a defining moment in the history of innovation, a celebration of boundless possibilities, and a convergence of extraordinary minds.
  • For more information and to secure your spot in this monumental gathering of visionaries, please visit the official website: https://www.metaerasummit.com/ .

Breezeline Doubles Network Capacity in Ohio

Retrieved on: 
Wednesday, July 12, 2023
Breezeline, Live, Wide Open West, Engineering, DVR, Investment, Internet, WOW, IPTV, Mobile phone

infrastructure to a new, state-of-the-art, high-capacity fiber network to deliver faster internet speeds and enhanced reliability for customers in Columbus and Cleveland, Ohio.

Key Points: 
  • infrastructure to a new, state-of-the-art, high-capacity fiber network to deliver faster internet speeds and enhanced reliability for customers in Columbus and Cleveland, Ohio.
  • Breezeline is investing over $100 million in Ohio to boost network capacity, performance and reliability in the region.
  • The initiative has already more than doubled network capacity from 500 Gigabit to 1,200 Gigabit (1.2 Terabit), with the capacity to grow even further.
  • The Breezeline network reaches over 700,000 homes and businesses in Ohio.

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

Retrieved on: 
Tuesday, May 23, 2023
Wide Open West, Open Compute Project, IC, SIP, Bunch, Economics, UCIe, NEC Software Solutions, Cloud computing, Computing, Silicon, TSMC, Bow, Memory, GPU, Electric power, Video game, Printed circuit board

SANTA CLARA, Calif., May 23, 2023 /PRNewswire/ -- Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced silicon availability for its breakthrough NuLink™ PHY technology. First silicon, achieved in one year from company's initial funding, validates Eliyan's UCIe-compatible approach to enabling high performance and highly scalable multi-die architectures for compute-intensive applications.

Key Points: 
  • SANTA CLARA, Calif., May 23, 2023 /PRNewswire/ -- Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced silicon availability for its breakthrough NuLink™ PHY technology.
  • "Eliyan's chiplet interconnect technology will make multi-die approaches more attractive to chip suppliers whose designs must optimize on power and bandwidth vectors.
  • It positions us as the front runner in enabling the most efficient chiplet interconnect in the semiconductor industry," said Eliyan's founding CEO Ramin Farjadrad.
  • Eliyan is also in the process of porting its design to multiple foundry and node technologies based on early customer interest and demand.

Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

Retrieved on: 
Tuesday, January 24, 2023
OCP, Bow, Wide Open West, High Bandwidth Memory, Open Compute Project, HBM, IEEE Standards Association, JEDEC, UCIe, Organization, PAM4, Printed circuit board, Video game

To support its commercial growth and stepped-up involvement in industry initiatives, Eliyan also announced the addition of two veteran semiconductor industry executives, Kevin Donnelly and Farhad Tabrizi, to its growing leadership team.

Key Points: 
  • To support its commercial growth and stepped-up involvement in industry initiatives, Eliyan also announced the addition of two veteran semiconductor industry executives, Kevin Donnelly and Farhad Tabrizi, to its growing leadership team.
  • Eliyan will be represented at the inaugural Chiplet Summit on January 24-26, 2023 in San Jose, Calif.
  • This includes executives participating on four panel discussions exploring the current state and future of die-to-die interconnect technologies.
  • In addition, Eliyan's current offering, the NuLink™ PHY, is compatible with UCIe as well as High Bandwidth Memory (HBM) protocols.