SEMI

Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports

Retrieved on: 
Tuesday, June 13, 2023
Foundry, Semiconductor, Analog, SEMI, Investment, Memory, Logic, Renewable energy, Pet industry

After the projected 18% drop to US$74 billion this year, global 300mm fab equipment spending is forecast to rise 12% to $US82 billion in 2024, 24% to US$101.9 billion in 2025 and 17% to US$118.8 billion in 2026.

Key Points: 
  • After the projected 18% drop to US$74 billion this year, global 300mm fab equipment spending is forecast to rise 12% to $US82 billion in 2024, 24% to US$101.9 billion in 2025 and 17% to US$118.8 billion in 2026.
  • "The projected equipment spending growth wave underscores the strong secular demand for semiconductors," said Ajit Manocha, SEMI President and CEO.
  • Korea is expected to lead global 300mm fab equipment spending in 2026 with US$30.2 billion in investments, nearly doubling from US$15.7 billion in 2023.
  • Analog spending is forecast to increase from US$5 billion this year to US$6.2 billion in 2026.

Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports

Retrieved on: 
Tuesday, June 6, 2023
AI, SEMI, Mobile phone

MILPITAS, Calif., June 6, 2023 /PRNewswire/ -- Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .

Key Points: 
  • MILPITAS, Calif., June 6, 2023 /PRNewswire/ -- Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .
  • "Semiconductor equipment revenue in the first quarter was robust despite macroeconomic headwinds and a challenging industry environment," said Ajit Manocha, SEMI president and CEO.
  • Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.
  • Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports

Retrieved on: 
Tuesday, June 6, 2023
AI, SEMI, Mobile phone

MILPITAS, Calif., June 6, 2023 /PRNewswire/ -- Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .

Key Points: 
  • MILPITAS, Calif., June 6, 2023 /PRNewswire/ -- Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report .
  • "Semiconductor equipment revenue in the first quarter was robust despite macroeconomic headwinds and a challenging industry environment," said Ajit Manocha, SEMI president and CEO.
  • Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.
  • Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027

Retrieved on: 
Tuesday, May 23, 2023
Electronics, SIP, FOWLP, RDL, SEMI, Research, US, Artificial intelligence, Growth, Silicon, Printed circuit board

MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.

Key Points: 
  • MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.
  • "The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and founder of TechSearch International.
  • "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging.
  • The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.

Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027

Retrieved on: 
Tuesday, May 23, 2023
Electronics, SIP, FOWLP, RDL, SEMI, Research, US, Artificial intelligence, Growth, Silicon, Printed circuit board

MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.

Key Points: 
  • MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.
  • "The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and founder of TechSearch International.
  • "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging.
  • The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.

AUO Digitech Provides Smart Upgrades for Semiconductor Assembly and Packaging Plants

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Tuesday, May 23, 2023
Risk, Partnership, MES, WEF, 3D, Amreli Steels, Hope, SEMI, Product-form solution, Shanghai New International Expo Center, AMR, Intelligence services in Canada, 2D, Movement, RGV, MLA, Automation, Algorithm, Ecosystem, Transport, MCS, Intelligence, AUO, The labor problem, International, 3D printing

HSINCHU, Taiwan, May 23, 2023 /PRNewswire-PRWeb/ -- In recent years, the semiconductor assembly and packaging industry, which has been known for its labor-intensive nature, has been facing talent shortages due to the issue of declining birth rates. To address the labor shortage challenge faced by semiconductor assembly and packaging field, AUO Digitech, a subsidiary of AUO specializing in providing smart industrial services, has independently developed the Intelligent Automated Material Handling System (iAMHS). By combining the world-leading ball bonder from Kulicke & Soffa Industries, Inc. (K&S) and the rail guided vehicle (RGV) system from Leyu Precision Co., Ltd. (Leyu), AUO Digitech has created a comprehensive solution that has been successfully implemented at multiple semiconductor production sites. This solution not only helps client achieve full automation of their production lines, but also increases production capacity by at least 10%.

Key Points: 
  • To address the labor shortage challenge faced by semiconductor assembly and packaging field, AUO Digitech, a subsidiary of AUO specializing in providing smart industrial services, has independently developed the Intelligent Automated Material Handling System (iAMHS).
  • To address the labor shortage challenge faced by semiconductor assembly and packaging field, AUO Digitech, a subsidiary of AUO specializing in providing smart industrial services, has independently developed the Intelligent Automated Material Handling System (iAMHS).
  • AUO Digitech Collaborates with K&S and Leyu to Create a Comprehensive Solution, Reducing the Risk of Material Mishandling and Alleviating Labor Shortages Problems
    AUO Digitech has paid close attention to the needs of the smart manufacturing industry, and together with K&S and Leyu, AUO Digitech provides one-stop service solutions that target the issues faced by the semiconductor assembly and packaging field.
  • AUO Digitech, in collaboration with K&S, is advancing into the semiconductor assembly and packaging field to provide smart manufacturing solutions.

Resilinc Receives Strategic Growth Investment from Vista Equity Partners

Retrieved on: 
Wednesday, May 17, 2023
Vista Equity Partners, LLP, Senior, Kongsberg Defence & Aerospace, Kirkland & Ellis, Health care, SEMI, Nixon Peabody, Stellantis, Algorithm, Snowflake, Growth, Weather, ESG, Keysight, News, Australian High Tech Crime Centre, Legislation, Software, Management, Automotive industry

LONDON, May 17, 2023 (GLOBE NEWSWIRE) -- Resilinc , a leading supply chain mapping, disruption sensing, and resiliency analytics company, today announced a strategic growth investment from Vista Equity Partners (“Vista”), a leading global investment firm focused exclusively on enterprise software, data, and technology-enabled businesses.

Key Points: 
  • LONDON, May 17, 2023 (GLOBE NEWSWIRE) -- Resilinc , a leading supply chain mapping, disruption sensing, and resiliency analytics company, today announced a strategic growth investment from Vista Equity Partners (“Vista”), a leading global investment firm focused exclusively on enterprise software, data, and technology-enabled businesses.
  • Resilinc will use the growth capital to accelerate product innovation, talent, and go-to-market functions to meet the growing demand for more resilient, sustainable, secure, and transparent supply chains.
  • “Resilinc and Vista share the same vision of making global supply chains more resilient.
  • The investment in Resilinc was made by Vista’s Endeavor Fund, which provides growth capital and strategic support to market-leading, high-growth enterprise software, data, and technology-enabled companies that have achieved at least $10 million in recurring revenue.

Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports

Retrieved on: 
Tuesday, May 16, 2023
IDM, OSAT, IC, Silicon, Partnership, SEMI, SMM, Rare-earth element, Semiconductor

MILPITAS, Calif., May 16, 2023 /PRNewswire/ -- The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter, SEMI announced in its Q1 2023 publication of the Semiconductor Manufacturing Monitor (SMM) Report , prepared in partnership with TechInsights .

Key Points: 
  • MILPITAS, Calif., May 16, 2023 /PRNewswire/ -- The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter, SEMI announced in its Q1 2023 publication of the Semiconductor Manufacturing Monitor (SMM) Report , prepared in partnership with TechInsights .
  • In the second quarter of 2023, industry indicators including IC sales and silicon shipments – both partly supported by seasonality – point to quarter-over-quarter improvements.
  • In addition, semiconductor equipment sales continue to decline in parallel with capital expenditure adjustments by major industry stakeholders.
  • The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry.

Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports

Retrieved on: 
Tuesday, May 16, 2023
IDM, OSAT, IC, Silicon, Partnership, SEMI, SMM, Rare-earth element, Semiconductor

MILPITAS, Calif., May 16, 2023 /PRNewswire/ -- The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter, SEMI announced in its Q1 2023 publication of the Semiconductor Manufacturing Monitor (SMM) Report , prepared in partnership with TechInsights .

Key Points: 
  • MILPITAS, Calif., May 16, 2023 /PRNewswire/ -- The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter, SEMI announced in its Q1 2023 publication of the Semiconductor Manufacturing Monitor (SMM) Report , prepared in partnership with TechInsights .
  • In the second quarter of 2023, industry indicators including IC sales and silicon shipments – both partly supported by seasonality – point to quarter-over-quarter improvements.
  • In addition, semiconductor equipment sales continue to decline in parallel with capital expenditure adjustments by major industry stakeholders.
  • The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry.

Opinion: Intel CEO Letter: 2022-23 Corporate Responsibility Report

Retrieved on: 
Thursday, May 11, 2023
Environment, Technology, Semiconductor, Other Technology, Professional Services, Sustainability, Hardware, Data Management, Environmental, Social and Governance (ESG), Artificial Intelligence, CHIPS, Science, DNA, Electricity, Corporate social responsibility, Commitment, Semiconductor Research Corporation, SEMI, Multimedia, Carbon, Intel, Corporate responsibility, Editorial, CPU, Investment, Corporation, RISE, AI, Digital, Credit, Renewable energy, Management, Diversity

View the full release here: https://www.businesswire.com/news/home/20230511005089/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20230511005089/en/
    Intel's dedication to environmental, social and corporate governance is key to its success as a business.
  • A graphic shows details from Intel's 2022-23 Corporate Responsibility Report.
  • More: Intel Surpasses First 2030 goal: $2 Billion in Diverse Supplier Spending | Full 2022-2023 Corporate Responsibility Report | Corporate Responsibility at Intel
    I was reminded of this with the recent passing of Intel’s co-founder Gordon Moore, an icon whose legacy continues to inspire us every day.
  • This was a big part of his legacy and why corporate responsibility and sustainability remain deeply engrained in Intel’s DNA.