Memory

Renesas Introduces Industry’s First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core

Retrieved on: 
Tuesday, March 26, 2024

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core.
  • Similar to existing general-purpose MCUs, designers will have access to a full-scale development environment for the R9A02G021, provided by Renesas and its extensive network of toolchain partners.
  • The R9A02G021 group represents the first generation of general- purpose MCUs based on the internally developed RISC-V core by Renesas that will roll out over the next several years.
  • The R9A02G021 RISC-V MCUs are fully supported by Renesas’ e² studio Integrated Development Environment (IDE), offered to customers at no cost.

Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024

Retrieved on: 
Tuesday, March 26, 2024

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240326037385/en/
    Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America – Memory at Samsung Electronics, unveiled the industry's first CXL Memory Module Hybrid for Persistent Memory (CMM-H PM) during his keynote presentation at Memcon 2024.
  • Samsung also partnered with Supermicro , a global leader in Plug and Play Rack-Scale IT solutions, to demonstrate the industry’s first Rack-Level memory solution for highly scalable and composable disaggregated infrastructure.
  • On stage, Samsung and VMware by Broadcom also introduced project Peaberry, the world’s first FPGA (Field Programmable Gate Arrays)-based tiered memory solution for hypervisors called CXL Memory Module Hybrid for Tiered Memory (CMM-H TM) .
  • To learn more about Samsung Semiconductor’s advanced memory technologies and solutions, please visit: https://semiconductor.samsung.com/us/

NielsenIQ BASES Collaborates with McDonald’s USA to Introduce Cultural Resonance Module - Transforming Inclusive Advertising Testing

Retrieved on: 
Monday, March 25, 2024

NIQ, a global leader in consumer intelligence, proudly announces the integration of its new, industry-leading NIQ BASES Cultural Resonance module into BASES renowned ad testing portfolio, built in thought-partnership with McDonald’s USA.

Key Points: 
  • NIQ, a global leader in consumer intelligence, proudly announces the integration of its new, industry-leading NIQ BASES Cultural Resonance module into BASES renowned ad testing portfolio, built in thought-partnership with McDonald’s USA.
  • This module offers a validated set of cultural resonance metrics, to guide creative optimization discussions to help marketers produce more impactful and inclusive advertising.
  • NIQ’s BASES Cultural Resonance module serves as a dynamic solution to address this need, helping advertisers connect with their customers authentically and meaningfully.
  • For more information on NIQ’s Ad360 tool and the BASES Cultural Resonance module, please visit NIQ’s website .

Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

Retrieved on: 
Monday, March 25, 2024

Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).

Key Points: 
  • Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).
  • The chiplet interconnect extends ultra-high density die-to-die (D2D) connections up to 10m at multi-Tbps/mm shoreline bandwidth density and class leading sub-pJ/bit energy efficiency.
  • The LightBundle chiplet interconnect extends HBM and other ultra-high performance D2D connections up to 10m while dissipating
  • “At Avicena, we are excited to announce our ultra-low power scalable chiplet interconnect based on our LightBundle platform,” says Bardia Pezeshki, Founder and CEO of Avicena.

Toshiba Releases Arm® Cortex®-M4 Microcontrollers for Motor Control

Retrieved on: 
Tuesday, March 26, 2024

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added eight new products with 512KB/1MB flash memory capacity and four types of packages to the M4K Group of the TXZ+™ Family Advanced Class 32-bit microcontrollers equipped with Cortex®-M4 core with FPU.

Key Points: 
  • Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added eight new products with 512KB/1MB flash memory capacity and four types of packages to the M4K Group of the TXZ+™ Family Advanced Class 32-bit microcontrollers equipped with Cortex®-M4 core with FPU.
  • View the full release here: https://www.businesswire.com/news/home/20240325053408/en/
    Toshiba: TXZ+™ Family Advanced Class Arm® Cortex®-M4 microcontrollers for motor control (Graphic: Business Wire)
    Continuing advances in the functionality of motor applications supporting IoT is increasing demand for large program capacity and firmware over-the-air support.
  • The microcontrollers also offer various interfaces and motor control options, such as advance-programmable motor driver (A-PMD), advanced encoder 32-bit (A-ENC32), advanced vector engine plus (A-VE+) and three units of high-speed, high-resolution 12-bit analog/digital converters.
  • Toshiba is planning to increase capacity of flash memory also for M4M Group with CAN interface.

Celestial AI Announces Photonic Fabric™ Adoption by Lead Hyperscaler Customers

Retrieved on: 
Monday, March 25, 2024

Celestial AI™ , a leading innovator in AI technology, is pleased to present the Photonic Fabric ™, a pioneering optical compute and memory fabric solution for supercharging AI infrastructure at OFC 2024 .

Key Points: 
  • Celestial AI™ , a leading innovator in AI technology, is pleased to present the Photonic Fabric ™, a pioneering optical compute and memory fabric solution for supercharging AI infrastructure at OFC 2024 .
  • Celestial AI has been collaborating with some of the largest hyperscalers to develop a deep understanding of compute, memory and network system infrastructure chokepoints.
  • After successful validation of the Photonic Fabric silicon that implements a complete link (electrical–optical–electrical) during the summer of 2023, hyperscaler customers and semiconductor customers are now designing in the Photonic Fabric optical chiplets as an initial phase of technology adoption.
  • We’re excited to be working with the giants of our industry to propel commercialization of the Photonic Fabric.”
    To accelerate customer adoption of the memory and compute fabric, Celestial AI is cultivating a Photonic Fabric ecosystem.

Kingston Digital Adds i-Temp SSDs to High-Quality Industrial Line

Retrieved on: 
Monday, March 25, 2024

These SSDs are designed for devices such as self-serve kiosks, digital signage, robots, point of sale, and military and agriculture applications among others.

Key Points: 
  • These SSDs are designed for devices such as self-serve kiosks, digital signage, robots, point of sale, and military and agriculture applications among others.
  • View the full release here: https://www.businesswire.com/news/home/20240325002828/en/
    Kingston adds line of Industrial Temp solid-state drives for applications that require a wider operating temperature range for extreme environments.
  • (Photo: Business Wire)
    With support for SATA interfaces, these industrial SSDs will be available in 128GB through 1TB capacities in industrial operating temperature range (-40°C to 85°C) to address climate-controlled and non-climate-controlled environments.
  • “When you work with Kingston, you’re provided quality products and access to our dedicated team of experts for industry-leading technical support,” said Ariel Perez, SSD business manager, Kingston.

Intranasal Delivery of shRNA Edits to Silence 5-HT2A Receptor Shows Promise in Enhancing Memory and Alleviating Anxiety

Retrieved on: 
Thursday, March 21, 2024

In a groundbreaking study, they successfully used a non-invasive intranasal delivery platform to administer short-hairpin RNA (shRNA) that targets the 5-HT2A receptor resulting in long-lasting improvements in memory and reduced anxiety in animal models.

Key Points: 
  • In a groundbreaking study, they successfully used a non-invasive intranasal delivery platform to administer short-hairpin RNA (shRNA) that targets the 5-HT2A receptor resulting in long-lasting improvements in memory and reduced anxiety in animal models.
  • Neurological disorders such as Mild Cognitive Impairment (MCI), depression, and anxiety disorders pose significant challenges to public health worldwide.
  • In this study, the researchers designed shRNA sequences to specifically target and silence the human HTR2A gene, which is associated with anxiety and memory.
  • The ability to bypass the blood-brain barrier using intranasal delivery opens up new avenues for precision-based therapeutics in neurological disorders."

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Cornerstone Becomes End-to-End Learning Content Solution with Spatial Learning Acquisition

Retrieved on: 
Tuesday, March 19, 2024

Cornerstone OnDemand Inc. , a leader in learning and talent experience solutions, today announced the acquisition of extended reality capabilities and a team of highly specialized domain experts from Talespin, a spatial learning company focused on workforce skills development.

Key Points: 
  • Cornerstone OnDemand Inc. , a leader in learning and talent experience solutions, today announced the acquisition of extended reality capabilities and a team of highly specialized domain experts from Talespin, a spatial learning company focused on workforce skills development.
  • Talespin’s extended reality (XR) learning technology solidifies Cornerstone’s robust content subscriptions, curation, creation, and insights technology to create an end-to-end learning content solution powering the future of work.
  • A natural evolution from personalized is providing truly immersive learning experiences through spatial computing and GenAI.
  • This includes Talespin’s AI-powered, no-code XR content authoring tool, CoPilot Designer, and its generative AI immersive learning labs services offering.