LVS

Clean the World Foundation & Las Vegas Sands Partner with Conservation International Singapore to Inspire Young Changemakers to Develop a Passion for Ocean Conservation

Retrieved on: 
Friday, April 21, 2023
Conservation International, Heart, Hear the World Foundation, LVS, Woman, Carbon, Forest, Hygiene, Natural Resources, Literacy, School, ArtScience Museum, Climate change, Sustainability, Sanitation, Water, Society, Environment, NYSE, Renewable energy, Tourism, Science

ORLANDO, Fla., April 21, 2023 /PRNewswire-PRWeb/ -- Clean the World Foundation, a global leader in water, sanitation, hygiene and sustainability, and Las Vegas Sands (NYSE: LVS) have selected Conservation International in Singapore to receive a 2022-2023 Drop by Drop Project grant for the second year to continue work centered on inspiring young changemakers to protect Singapore's marine ecosystems. Conservation International was a recipient of a 2021-2022 Drop by Drop Project grant for a related program.

Key Points: 
  • Clean the World Foundation and Las Vegas Sands have awarded a 2022-2023 Drop by Drop Project grant to Conservation International in Singapore for the second year to promote ocean conservation among young changemakers in Singapore.
  • Conservation International was a recipient of a 2021-2022 Drop by Drop Project grant for a related program.
  • Managed and operated by Clean the World Foundation, the Drop by Drop Project was established in 2019 to support initiatives centered around water conservation and environmental sustainability.
  • "Clean the World Foundation places women, children and families at the heart of our mission," says Manohar Shenoy, Executive Director, Clean the World Foundation.

Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio

Retrieved on: 
Wednesday, April 19, 2023
5G, Software, Hardware, Electronic Design Automation, Technology, Semiconductor, Mobile, Wireless, Other Technology, Spectre, Cloud, DRC, High-pass filter, Renesas Electronics, Cadence Design Systems, Chip on board, LVS, CDNS, Pegasus, Virtuoso, IC, Multimedia, IP, SOC, RFIC, Monte Carlo, Machine learning, Engineering, ADI, Algorithm, TSMC, Studio, Environment, RF, Automation, Video game, Printed circuit board, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Virtuoso® Studio, a next-generation custom design platform that delivers an optimal design experience and ushers in the future for custom analog design.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Virtuoso® Studio, a next-generation custom design platform that delivers an optimal design experience and ushers in the future for custom analog design.
  • This new platform features seamless integration with other Cadence solutions, including the Cadence Spectre® Simulation Platform, Cadence Allegro® PCB Design and Cadence Pegasus™ Verification System, removing traditional barriers between different design domains and speeding design closure.
  • Virtuoso Studio stays at the forefront of delivering designs accurately and on time through innovative improvements in traditional custom design tools.
  • With the release of the Virtuoso Studio platform, we look forward to improving design productivity by using the more automated environment with the new process migration flow and AI-based functions.”
    “TSMC has partnered with Cadence on the Virtuoso Custom Design Platform for over three decades.

Clean the World Foundation and Las Vegas Sands Partner with University of Saint Joseph Macao to Enhance Coastal Protection & Natural Solutions to Reduce Plastic Pollution

Retrieved on: 
Thursday, April 13, 2023
Volunteering, Plastic, Hear the World Foundation, University, University of Saint Joseph, LVS, Education, Microplastics, Research, Hygiene, Biodiversity, School, Student, ISE, Sanitation, Water, Health, NYSE, Civil engineering, Management, Agriculture, Science, USJ, Environment

ORLANDO, Fla., April 13, 2023 /PRNewswire-PRWeb/ -- Clean the World Foundation, a global leader in water, sanitation, hygiene and sustainability, and Las Vegas Sands (NYSE: LVS) have announced that the University of Saint Joseph (USJ) in Macao has been awarded a 2022-2023 Drop by Drop Project grant to study the role of mangroves in reducing plastic pollution in coastal wetlands, marking the university's third year of participation in the program.

Key Points: 
  • The University of Saint Joseph (USJ) in Macao has been granted a Drop by Drop Project award for 2022-2023 to investigate the impact of mangroves in diminishing plastic pollution in coastal wetlands.
  • The Drop by Drop Project is a collaboration between the Clean the World Foundation and Sands to support innovative water stewardship projects with local water champions in the company's regions of Macao and Singapore.
  • Managed and operated by Clean the World Foundation, the Drop by Drop Project was established in 2019 to support initiatives centered around water conservation and environmental sustainability through water and nature-based solutions.
    "
  • As part of the 2022-2023 grant, USJ is focusing on coastal protection and nature-based solutions to reduce plastic pollution through entrapment by mangroves in Macao.

Sands to Release First Quarter 2023 Financial Results

Retrieved on: 
Thursday, April 13, 2023
LVS, NYSE, Casino, Communications satellite

LAS VEGAS, April 12, 2023 /PRNewswire/ -- Las Vegas Sands (NYSE: LVS) will release its first quarter 2023 financial results on Wednesday, April 19, 2023, after market close.

Key Points: 

LAS VEGAS, April 12, 2023 /PRNewswire/ -- Las Vegas Sands (NYSE: LVS) will release its first quarter 2023 financial results on Wednesday, April 19, 2023, after market close.
The company will host a conference call to discuss its results at approximately 1:30 p.m. Pacific Time.

GBT’s Automatic Correction of Integrated Circuits connectivity mismatches patent - Granted

Retrieved on: 
Tuesday, February 14, 2023
Automation, Patent, Sigma, Design rule checking, DFM, GBT, LVS, DRC, Research, Integrated circuit, IC, Design, RF, SAN, IP, Invention, Layout, AI, OTC, Printed circuit board, RV

SAN DIEGO, Feb. 14, 2023 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH ) ("GBT” or the “Company”), nonprovisional patent application for automatic correction of Integrated Circuits electrical connectivity mismatches, is expected to be granted on February 21, 2023. The patent number is 11,586,799. The patent protects an innovative software approach to automate integrated circuits electrical connectivity discrepancies correction with the goal of accelerating integrated circuits design time and producing higher quality designs, particularly for advanced nanometer range of 5nm and below. An electrical connectivity mismatch means erroneous wiring between the circuit’s components that may cause a malfunction or wrong functionalities. Especially in custom, semi-custom analog, mixed and RF layout styles, these corrections must be fixed manually which takes a significant amount of design time, which corrections may have further impact on area growth and introduce additional violations.

Key Points: 
  • SAN DIEGO, Feb. 14, 2023 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK: GTCH ) ("GBT” or the “Company”), nonprovisional patent application for automatic correction of Integrated Circuits electrical connectivity mismatches, is expected to be granted on February 21, 2023.
  • The patent protects an innovative software approach to automate integrated circuits electrical connectivity discrepancies correction with the goal of accelerating integrated circuits design time and producing higher quality designs, particularly for advanced nanometer range of 5nm and below.
  • An electrical connectivity mismatch means erroneous wiring between the circuit’s components that may cause a malfunction or wrong functionalities.
  • GBT’s patent describes an algorithmic systems and methods to perform an automatic connectivity correction with a click of a button.

Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs

Retrieved on: 
Thursday, February 9, 2023
Data Management, Semiconductor, Technology, Telecommunications, Mobile, Wireless, Software, Hardware, EDA, High-pass filter, PDK, LVS, Maxwell, Intel, Kurdistan, PCB, IC, RF, Silicon, IP, HCS, Video game

Lorentz Solution, Inc, a world leading provider of Electromagnetic (EM) design platform and simulation solutions, proudly joins the Intel Foundry Services (IFS) Accelerator EDA Alliance to support mutual customers.

Key Points: 
  • Lorentz Solution, Inc, a world leading provider of Electromagnetic (EM) design platform and simulation solutions, proudly joins the Intel Foundry Services (IFS) Accelerator EDA Alliance to support mutual customers.
  • PeakView EM IC and 3DIC design tools have been enabled on IFS’s advanced process nodes with early customer access.
  • The IFS Accelerator EDA Alliance program will make silicon technology available to customers to design innovative chips, and foster collaborative innovation with world-leading EDA, design services and IP partners.
  • As a part of IFS Accelerator EDA Alliance program, Lorentz’ PeakView EM IC and 3DIC Design platform, will support customers and spur their innovation, playing a key role in the success of RF, mmWave and high-speed analog EM IC designs.

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

Retrieved on: 
Wednesday, February 1, 2023
Electronic Design Automation, Semiconductor, Technology, Mobile, Wireless, Telecommunications, Hardware, Automation, United Microelectronics Corporation, Cadence, Proposed UK Internet age verification system, Internet of things, NYSE, LVS, TWSE, Integrity, Cadence Design Systems, ERC, UMC, Communication, Digital, CDNS, 3D, AI, R, Video game, Printed circuit board

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market.

Key Points: 
  • United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market.
  • UMC’s hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes that are suitable for edge AI, image processing, and wireless communication applications.
  • “The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation solution that enables them to create and verify innovative 3D-IC designs with confidence while accelerating time to market.”
    The reference flow, featuring Cadence’s Integrity 3D-IC Platform, is built around a high-capacity, multi-technology hierarchical database.
  • Multiple chiplets in a 3D stack can be designed and analyzed together through integrated early analysis for thermal, power and static timing analysis.

GBT’s Automatic Correction of Integrated Circuits connectivity mismatches patent, received a notice of allowance.

Retrieved on: 
Tuesday, January 31, 2023
LVS, IC, RF, Internal code, Analog, EDA, OTC, United States Patent and Trademark Office, Patent, SAN, Integrated circuit, Research, Printed circuit board

SAN DIEGO, Jan. 31, 2023 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), nonprovisional patent application for automatic correction of Integrated Circuits electrical connectivity mismatches, received a notice of allowance from the United States Patent and Trademark Office (“USPTO”). The application was filed on August 3, 2022 and received application #17880055. The non-provisional patent application describes programmatic algorithms to automate integrated circuits electrical connectivity mismatches correction with the goal of achieving faster and more efficient designs, particularly for advanced nanometer range of 5nm and below. A Layout-Vs-Schematics (“LVS”) Verification program is an integral part of the integrated circuits (“IC”) signoff process to compare the electrical connectivity (wiring) of an IC layout against its schematic diagram. If a connectivity mismatch is detected that means a faulty wiring connection exists between electronic components and may lead to a non-functional chip’s circuit or wrong electrical outcome. Typically, in a custom and semi-custom Analog, MIXED and RF layout styles, these corrections must be fixed manually which takes a significant amount of design time and may have further impacts resulting in other geometrical design rules violations and similar. GBT’s non-provisional patent application seeks to protect an algorithmic system and method to perform an automatic LVS correction with a click of a button. The system will read the IC’s schematic and layout data, compare their electrical connections (wiring) and in case of mismatches, disconnect the incorrect wires, and re-route them in the correct way.

Key Points: 
  • The patent describes an automatic correction of microchip’s electrical connectivity mismatches technology that could achieve major design cycle time reduction.
  • SAN DIEGO, Jan. 31, 2023 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK: GTCH ) ("GBT” or the “Company”), nonprovisional patent application for automatic correction of Integrated Circuits electrical connectivity mismatches, received a notice of allowance from the United States Patent and Trademark Office (“USPTO”).
  • The non-provisional patent application describes programmatic algorithms to automate integrated circuits electrical connectivity mismatches correction with the goal of achieving faster and more efficient designs, particularly for advanced nanometer range of 5nm and below.
  • A Layout-Vs-Schematics (“LVS”) Verification program is an integral part of the integrated circuits (“IC”) signoff process to compare the electrical connectivity (wiring) of an IC layout against its schematic diagram.

Sands to Release Fourth Quarter 2022 Financial Results

Retrieved on: 
Thursday, January 19, 2023
LVS, NYSE, Casino, Communications satellite

LAS VEGAS, Jan. 18, 2023 /PRNewswire/ -- Las Vegas Sands (NYSE: LVS) will release its fourth quarter 2022 financial results on Wednesday, January 25, 2023, after market close.

Key Points: 

LAS VEGAS, Jan. 18, 2023 /PRNewswire/ -- Las Vegas Sands (NYSE: LVS) will release its fourth quarter 2022 financial results on Wednesday, January 25, 2023, after market close.
The company will host a conference call to discuss its results at approximately 1:30 p.m. Pacific Time.

Las Vegas Sands to Pursue Multi-Billion-Dollar Downstate New York License at Nassau Veterans Memorial Coliseum Site on Long Island

Retrieved on: 
Thursday, January 12, 2023
RXR, Certification, RXR Realty, Quality of life, New York State Gaming Commission, Swimming, Environment, Nassau, NYSE, Tourism, Partnership, Organization, Nassau Coliseum, LEED, Collaboration, Investment, Request, Restaurant, LVS, Economy of Long Island

UNIONDALE, N.Y., Jan. 12, 2023 /PRNewswire/ -- With the recent release of the New York State Gaming Commission's Request for Application for three downstate New York gaming licenses, Las Vegas Sands (NYSE: LVS), the world's most valuable integrated resort company, today announced its intention to pursue the development of a multi-billion-dollar flagship hospitality, entertainment and casino project on Long Island, New York.

Key Points: 
  • The company has entered into agreements to purchase the long-term lease of the site currently home to the Nassau Veterans Memorial Coliseum.
  • These transactions, which still require certain approvals, would grant the company control of up to 80 acres in Nassau County, New York.
  • "Long Island has always attracted entrepreneurial businesses, and in this case, it would be creating an entirely new industry for the region.
  • Through the company's well-established and industry-leading environmental sustainability program, Sands ECO360, the Long Island development would also utilize cutting-edge sustainable building and operating practices.