Electronics manufacturing

Global Market Report From IDTechEx Research on Stretchable and Conformal Electronics 2019-2029

Retrieved on: 
Thursday, December 13, 2018
Electronics manufacturing, Electronic engineering, Electromagnetism, Electrical engineering, Stretchable electronics, Emerging technologies, E-textiles, Printed circuit board

BOSTON, Dec. 13, 2018 /PRNewswire/ --The IDTechEx Research report ' Stretchable and Conformal Electronics 2019-2029 ' provides you with everything that you need to know about stretchable electronics.

Key Points: 
  • BOSTON, Dec. 13, 2018 /PRNewswire/ --The IDTechEx Research report ' Stretchable and Conformal Electronics 2019-2029 ' provides you with everything that you need to know about stretchable electronics.
  • Prominent options today include stretchable sensors and stretchable connectors (including conductive inks, yarns/cabling, stretchable PCBs and more).
  • Stretchable and Conformal Electronics 2019-2029 ' is the result of years of global primary research on stretchable electronics itself, but also on its constituent elements and target applications.
  • For example, IDTechEx analysts have covered topics such as conductive inks, in-mold electronics, electronic textiles, flexible/stretchable printed circuit boards, wearable technologies, stretchable sensors, stretchable transparent conductive films, structural electronics and more.

The Fan-out Wafer Level Packaging (Fowlp) Market will register a CAGR of almost 16% by 2023

Retrieved on: 
Wednesday, December 12, 2018
Semiconductor device fabrication, Electronics manufacturing, Electronics, Electronic engineering, Microtechnology, Fan-out wafer-level packaging, Wafer-level packaging, Wafer, Integrated circuit packaging, ASE Group, Wafer-scale integration

The introduction of panel level packaging has reduced the overall cost of wafer level packaging.

Key Points: 
  • The introduction of panel level packaging has reduced the overall cost of wafer level packaging.
  • The increasing demand for electronics across different industries will further drive the demand for panel level packaging and thereby boost fan-out wafer level packaging market growth.
  • Technavio's analysts have predicted that the fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.
  • This packaging technology also reduces the packaging and testing costs by allowing the fabrication and testing at wafer level.

Global Electronic Films Market Outlook to 2023: DowDuPont, Toray Industries, Nitto Denko Corporation, Saint-Gobain, and The Chemours Company are Dominating

Retrieved on: 
Tuesday, December 11, 2018
Technology, Electromagnetism, Electronics, Nitto Denko, Personal computing, Electronics manufacturing, Nitto, Smartphone, Printed circuit board, Consumer electronics, Touchscreen, DuPont

The electronic films market is growing due to the growing demand for electronic displays, semiconductors, and PCBs from the consumer electronics industry.

Key Points: 
  • The electronic films market is growing due to the growing demand for electronic displays, semiconductors, and PCBs from the consumer electronics industry.
  • The rising adoption of smartphones and touch-sensitive display devices in diverse applications is expected to drive the market in the near future.
  • This increases the cost of production and leads to the high price of electronic films.
  • The key players in the market include DowDuPont (US), Toray Industries, Inc. (Japan), Nitto Denko Corporation (Japan), Saint-Gobain S.A. (France), and The Chemours Company (US).

Sense Home Energy Monitor Supports Google Assistant, Belkin Wemo Insight Plug and TP-Link Kasa HS110 Smart Plug for Smarter, More Efficient Homes

Retrieved on: 
Tuesday, December 11, 2018
Technology, Computing, Belkin Wemo, Electronics manufacturing, Home automation, Building engineering, Belkin, Google Assistant, TP-Link, Google, Muzzley

Now Google Assistant users can ask Sense about their home's activity, and homeowners can both track and control any device connected to the Wemo and Kasa smart plugs in the intuitive Sense app.

Key Points: 
  • Now Google Assistant users can ask Sense about their home's activity, and homeowners can both track and control any device connected to the Wemo and Kasa smart plugs in the intuitive Sense app.
  • Sense tracks the entire home's energy usage, so Google Assistant can ask Sense how much power the home is using or how much solar energy it is producing.
  • Sense users can make their homes safer by tracking and controlling specific devices that are connected to the Belkin Wemo Insight Plug or TP-Link Kasa HS110 smart plug.
  • Sense users can bring smart plugs into their smart home energy management for the entire home or specific devices.

Metcal Introduces the New CV-500 Connection Validation™ Soldering System

Retrieved on: 
Monday, December 10, 2018
Electronics manufacturing, Soldering, Metalworking, Rework, Solder, Tweezers, CV, Equipment, Chemistry, Technology

CYPRESS, Calif., Dec. 10, 2018 /PRNewswire/ -- Metcal, part of OK International and Dover (NYSE: DOV), is pleased to introduce the new CV-500 Connection Validation Soldering System, the companion station to the CV-5210 CV Soldering System.

Key Points: 
  • CYPRESS, Calif., Dec. 10, 2018 /PRNewswire/ -- Metcal, part of OK International and Dover (NYSE: DOV), is pleased to introduce the new CV-500 Connection Validation Soldering System, the companion station to the CV-5210 CV Soldering System.
  • The CV-500 packs all of the Connection Validation ("CV") technology into a compact, economical housing.
  • The CV-500 soldering system excels at SMD touch-up and small component rework using the Ultrafine hand-piece and Ultrafine tweezer hand-piece (both sold separately).
  • The CV-500 is compatible with Metcal's eight hand-pieces and upgrade kits for the CV soldering system.

The Global Market for Printed Electronics to 2023: Projected to Register a CAGR of Over 12%

Retrieved on: 
Friday, December 7, 2018
Electronics manufacturing, Flexible electronics, Printed electronics, Electronics, Electromagnetism, Electrical engineering

The "Global Printed Electronics Market 2019-2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Printed Electronics Market 2019-2023" report has been added to ResearchAndMarkets.com's offering.
  • The Printed Electronics Market will register a CAGR of over 12% by 2023.
  • According to the report, one of the major drivers for this market is the increasing demand for flexible displays.
  • Since, it is a cost intensive process, the manufacturing cost of the product increases, which in turn leads to lower adoption of printed electronics.

Europe Stretchable Electronics Market - Competition Forecast & Opportunities, 2017 - 2023

Retrieved on: 
Wednesday, December 5, 2018
Electronic engineering, Electronics manufacturing, Stretchable electronics, Emerging technologies, Electronic skin, Technology, Electrical engineering, Engineering

LONDON, Dec. 5, 2018 /PRNewswire/ -- Europe Stretchable Electronics Market By Component (Electroactive Polymers, Stretchable Conductors, Stretchable Batteries, Stretchable Circuits & Photovoltaics), By Application, By Country, Competition Forecast & Opportunities, 2017 2023

Key Points: 
  • LONDON, Dec. 5, 2018 /PRNewswire/ -- Europe Stretchable Electronics Market By Component (Electroactive Polymers, Stretchable Conductors, Stretchable Batteries, Stretchable Circuits & Photovoltaics), By Application, By Country, Competition Forecast & Opportunities, 2017 2023
    According to "Europe Stretchable Electronics Market By Component, By Application, By Country, Competition Forecast & Opportunities, 2017 2023" stretchable electronics market is forecast to grow at a CAGR of 89% by 2023.Anticipated growth in the market can be attributed to increasing adoption of smart wearable, rising investments in development of touch sensitive e-skin and availability of stretchable conductive ink in the region.
  • Presence of companies, such as tacterion and IMEC, in addition to growing popularity of stretchable sensors for healthcare application, is expected to positively influence the region's stretchable electronics market in the coming years.
  • Some of the major players operating in Europe stretchable electronics market are tacterion GmbH, Du Pont de Nemours International SARL, FINELINE Ltd., WISE Srl, Bainisha cvba, Express Circuits Group Ltd, IMEC VZW, LEAP Technology ApS, etc.
  • "Europe Stretchable Electronics Market By Component, By Application, By Country, Competition Forecast & Opportunities, 2017 2023" discusses the following aspects of Stretchable Electronics market in Europe:
    Segmental Analysis By Component (Electroactive Polymers, Stretchable Conductors, Stretchable Batteries, Stretchable Circuits & Photovoltaics), By Application, By Country
    Why You Should Buy This Report?

HDI PCB Market to Reach $22.26 Bn, Globally, by 2025 at 11.1% CAGR, Says Allied Market Research

Retrieved on: 
Wednesday, December 5, 2018
Pollution, Electromagnetism, Electronic engineering, Electronics manufacturing, Electrical engineering, Printed circuit board, Polychlorinated biphenyl, Market research

As per the report, the global HDI PCB market generated $9.49 billion in 2017, and is expected to reach at $22.26 billion by 2025, growing at a CAGR of 11.1% from 2018 to 2025.

Key Points: 
  • As per the report, the global HDI PCB market generated $9.49 billion in 2017, and is expected to reach at $22.26 billion by 2025, growing at a CAGR of 11.1% from 2018 to 2025.
  • Miniaturization of PCBs and increasing efficiency of consumer electronics drive the growth of the high density interconnect (HDI) PCB market.
  • On the other hand, increased utilization of HDI technology in automobiles would offer new opportunities to the market.
  • Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions."

Seeed Introduces 10,000 New Parts for Enabling Faster and Cheaper Turnkey PCB Assembly from 7 Working Days

Retrieved on: 
Tuesday, December 4, 2018
Pollution, Electromagnetism, Electronic engineering, Electronics manufacturing, Electrical engineering, Printed circuit board, PCBA, Polychlorinated biphenyl

As one of their star services, the Fusion PCBA service offers turnkey PCB assembly that utilizes Seeed's industry connections and supply chain experience.

Key Points: 
  • As one of their star services, the Fusion PCBA service offers turnkey PCB assembly that utilizes Seeed's industry connections and supply chain experience.
  • Not long after, Seeed introduced the Seeed Open Parts Library (or OPL), a complimentary selection of in-stock parts to drastically reduce the PCBA production time from 20 working days to just 7.
  • Unlike the Seeed OPL, the Shenzhen OPL reaches out to local resources as opposed to maintaining internal stock.
  • Capabilities include rigid, multi-layer, flexible, aluminum PCB assembly, through-hole, SMT, double-sided, BGA, 0201 package, and 0.38mm fine-pitch lead-free assembly.

EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing

Retrieved on: 
Monday, December 3, 2018
Packaging, Electronics manufacturing, Semiconductor device fabrication, Microtechnology, Electronics, Wafer bonding, Electronic engineering, Chemical bonding, Wafer, Link aggregation

Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.

Key Points: 
  • Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.
  • BONDSCALE is being sold alongside EVG's industry benchmark GEMINI FB XT automated fusion bonding system, with each platform targeting different applications.
  • More information about the BONDSCALE automated fusion production bonding system for engineered substrate and front-end wafer bonding can be found at: https://www.evgroup.com/en/products/bonding/integrated_bonding/bondscale/ .
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.