Electronics manufacturing

Methode Electronics to Present at the Stifel 2021 Virtual Cross Sector Insight Conference

Retrieved on: 
Wednesday, June 2, 2021
Electronics manufacturing, Methode Electronics, Stifel, Mei, New York Stock Exchange, Service companies, Companies, Finance

CHICAGO, June 02, 2021 (GLOBE NEWSWIRE) -- Methode Electronics, Inc. (NYSE: MEI), a leading global supplier of custom-engineered solutions for user interface, LED lighting system, and power distribution applications, will present at the Stifel 2021 Virtual Cross Sector Insight Conference on Wednesday, June 9 at 9:20 a.m. EDT.

Key Points: 
  • CHICAGO, June 02, 2021 (GLOBE NEWSWIRE) -- Methode Electronics, Inc. (NYSE: MEI), a leading global supplier of custom-engineered solutions for user interface, LED lighting system, and power distribution applications, will present at the Stifel 2021 Virtual Cross Sector Insight Conference on Wednesday, June 9 at 9:20 a.m. EDT.
  • A simultaneous webcast can be accessed through the companys website, www.methode.com, by selecting the Investors page.
  • Methode Electronics, Inc. (NYSE: MEI) is a leading global supplier of custom-engineered solutions with sales, engineering and manufacturing locations in North America, Europe, Middle East, and Asia.
  • Our business is managed on a segment basis, with those segments being Automotive, Industrial, Interface and Medical.

Small/Mid-size Semiconductor Equipment Markets and Strategies Report 2021

Retrieved on: 
Tuesday, June 1, 2021
Semiconductor device fabrication, Wafer, SEMI, Semiconductor devices, Electronics industry, Electronics manufacturing, Soitec

DUBLIN, June 1, 2021 /PRNewswire/ -- The "Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies" report from The Information Network has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, June 1, 2021 /PRNewswire/ -- The "Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies" report from The Information Network has been added to ResearchAndMarkets.com's offering.
  • In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete.
  • In Chapter 2 we identify high-tech applications that are fabricated on 300mm wafers.
  • In Chapter 3 we discuss high-tech applications that are built on non- 300mm wafers.

A "deeper dive" into security is needed says Trusted Objects White Paper

Retrieved on: 
Tuesday, June 1, 2021
Computing, Technology, Science and technology, Electronics manufacturing, JTAG, Internet of things, Computer security

AIX EN PROVENCE, France, June 1, 2021 /PRNewswire-PRWeb/ --Trusted Objects new White Paper "A deeper dive into security of embedded systems" explores the security needs for embedded electronics and IoT systems facing security attacks.

Key Points: 
  • AIX EN PROVENCE, France, June 1, 2021 /PRNewswire-PRWeb/ --Trusted Objects new White Paper "A deeper dive into security of embedded systems" explores the security needs for embedded electronics and IoT systems facing security attacks.
  • In fact, many systems developers already implement basic security principles: security by design, end-to-end security and security all along the product life.
  • The White Paper explores various well-known countermeasures, including JTAG, Bootloader, Security by separation, Communication protocols in embedded systems, and Memory protection.
  • Jean Pierre Delesse, COO and cofounder of Trusted Objects, declares: "Trusted Objects experts have been looking at security from a different perspective, by exploring the limitations of legacy countermeasures.

Fralock Holdings Acquires Lenthor

Retrieved on: 
Thursday, May 27, 2021
Electronics manufacturing, Electronic engineering, Flexible electronics, Flexible circuit, Flex, Technology, Science and technology, Electrical engineering

VALENCIA, Calif., May 27, 2021 /PRNewswire/ --Fralock Holdings, LLC, ("Fralock Holdings") a leading developer and manufacturer of engineered materials solutions for critical applications, today announced the acquisition of Lenthor Engineering, Inc. ("Lenthor"), one of the largest privately owned companies in North America that designs, manufactures and assembles flex and rigid-flex printed circuits.

Key Points: 
  • VALENCIA, Calif., May 27, 2021 /PRNewswire/ --Fralock Holdings, LLC, ("Fralock Holdings") a leading developer and manufacturer of engineered materials solutions for critical applications, today announced the acquisition of Lenthor Engineering, Inc. ("Lenthor"), one of the largest privately owned companies in North America that designs, manufactures and assembles flex and rigid-flex printed circuits.
  • "Lenthor's advanced capabilities in flexible circuit design and manufacturing, and its leading position in high-value market segments make it a perfect complement to Fralock's core business," said Marc Haugen, CEO, Fralock Holdings.
  • This new acquisition will enable Fralock to expand its market position and to better serve its existing end markets from the products created by Lenthor.
  • The acquisition adds over 160 new associates, building upon Fralock Holdings' deep technical expertise and bench strength.

Thin Film & Printed Battery Market Report 2021: Global Trends, Forecast and Competitive Analysis, 2013-2024 - ResearchAndMarkets.com

Retrieved on: 
Thursday, May 27, 2021
Other Energy, Energy, Flexible electronics, Electronics manufacturing, Printed electronics, Electric battery, Electrical engineering, Electricity, Electromagnetism

The "Thin Film & Printed Battery Market Report: Trends, Forecast and Competitive Analysis" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Thin Film & Printed Battery Market Report: Trends, Forecast and Competitive Analysis" report has been added to ResearchAndMarkets.com's offering.
  • The study includes the thin film and printed battery market size and forecast for the global thin film and printed battery market through 2024, segmented by voltage rating, chargeability, application, and region.
  • Some of the features of Thin Film and Printed Battery Market Report: Trends, Forecast, and Opportunity Analysis include:
    Market size estimates: thin film and printed battery market size estimation in terms of value ($M) shipment.
  • Strategic analysis: This includes M&A, new product development, and competitive landscape for, thin film and printed battery in the thin film and printed battery market.

Silver Demand for Printed and Flexible Electronics Forecast to Consume 615 Million Ounces of Silver Through 2030

Retrieved on: 
Wednesday, May 19, 2021
Electronics manufacturing, Electronic engineering, Flexible electronics, Flexible

b'WASHINGTON, May 19, 2021 (GLOBE NEWSWIRE) -- Silver demand for printed and flexible electronics is forecast to increase 54 percent, from 48 million ounces (Moz) in 2021 to 74 Moz in 2030, consuming 615 million ounces for these applications during the 10-year timeframe, as this market continues to mature and expand.

Key Points: 
  • b'WASHINGTON, May 19, 2021 (GLOBE NEWSWIRE) -- Silver demand for printed and flexible electronics is forecast to increase 54 percent, from 48 million ounces (Moz) in 2021 to 74 Moz in 2030, consuming 615 million ounces for these applications during the 10-year timeframe, as this market continues to mature and expand.
  • It also assesses current silver demand by market sector, the fundamentals of printed and flexible electronics, and concludes with a forecast for silver\xe2\x80\x99s use in this application through 2030.\nManufacturers are incorporating printed and flexible electronics into their devices and products because they are flexible, customizable, innovative, and portable.
  • For example, printed and flexible electronics are increasingly being used in labels and packaging for retail goods, and warehouse logistical operations.
  • Established in 1971, the Institute\xe2\x80\x99s members include leading silver producers, prominent silver refiners, manufacturers, transporters, and dealers.

Himax Technologies, Inc. to Attend Cowen 49th Annual Technology, Media & Telecom Virtual Conference on June 1 – June 3, 2021

Retrieved on: 
Wednesday, May 19, 2021
Fabless semiconductor companies, Himax, Electronics industry, Industry economics), Electronics manufacturing

Conference participation is by invitation only and registration is mandatory.

Key Points: 
  • Conference participation is by invitation only and registration is mandatory.
  • For more information on the conference or to schedule a one-on-one or group meeting, please contact a Cowen Representative or the conference coordinator at: [email protected] .\nHimax Technologies, Inc. (NASDAQ: HIMX) is a fabless semiconductor solution provider dedicated to display imaging processing technologies.
  • Himax is a worldwide market leader in display driver ICs and timing controllers used in TVs, laptops, monitors, mobile phones, tablets, automotive, digital cameras, car navigation, virtual reality (VR) devices and many other consumer electronics devices.
  • Himax has 3,012 patents granted and 534 patents pending approval worldwide as of March 31, 2021.

Global Printed Circuit Boards (PCBs) Market to Reach $72.7 Billion by 2026

Retrieved on: 
Tuesday, May 18, 2021
Pollution, Electrical engineering, Electronic engineering, Electronics manufacturing, Printed circuit board, Polychlorinated biphenyl, Chemistry

b'SAN FRANCISCO, May 18, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Printed Circuit Boards (PCBs) - Global Market Trajectory & Analytics".

Key Points: 
  • b'SAN FRANCISCO, May 18, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Printed Circuit Boards (PCBs) - Global Market Trajectory & Analytics".
  • Previews provide deep insider access to business trends; competitive brands; domain expert profiles; and market data templates and much more.
  • Amid the COVID-19 crisis, the global market for Printed Circuit Boards (PCBs) estimated at US$54.8 Billion in the year 2020, is projected to reach a revised size of US$72.7 Billion by 2026, growing at a CAGR of 4.8% over the analysis period.
  • Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$3.4 Billion by the year 2026.

Global Flexible Printed Circuit Boards Market to Reach $19.5 Billion by 2026

Retrieved on: 
Tuesday, May 18, 2021
Electronics manufacturing, Electronic engineering, Electrical engineering, Technology, Flexible circuit, Flexible electronics, Printed circuit board, Polyimide, Integrated circuit, Electronic circuit, Flex, Circuit

b'SAN FRANCISCO, May 18, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Flexible Printed Circuit Boards - Global Market Trajectory & Analytics".

Key Points: 
  • b'SAN FRANCISCO, May 18, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Flexible Printed Circuit Boards - Global Market Trajectory & Analytics".
  • Previews provide deep insider access to business trends; competitive brands; domain expert profiles; and market data templates and much more.
  • Preview Registry\nFlexible printed circuit boards or flex circuits refer to electronic circuits mounted over flexible substrates such as transparent conductive polyester film or polyimide.
  • Amid the COVID-19 crisis, the global market for Flexible Printed Circuit Boards estimated at US$11.8 Billion in the year 2020, is projected to reach a revised size of US$19.5 Billion by the year 2026, growing at a CAGR of 8.9% over the analysis period.

Heilind Electronics Adds TE Connectivity's 2 mm Receptacles, Breakaway and Shrouded Headers

Retrieved on: 
Tuesday, May 18, 2021
Electrical engineering, Electronic engineering, Electronics manufacturing, Printed circuit board, NTE, TE Connectivity, Engineering

Available in vertical and right-angle orientations, the shrouded headers come in a double row configuration with through-hole or surface mount termination for ease of manufacturing.\nAMPMODU 2 mm breakaway headers can be mounted onto boards with thicknesses of 1.6 mm or 2.4 mm, providing customers with a wide range of options for PCB assembly.

Key Points: 
  • Available in vertical and right-angle orientations, the shrouded headers come in a double row configuration with through-hole or surface mount termination for ease of manufacturing.\nAMPMODU 2 mm breakaway headers can be mounted onto boards with thicknesses of 1.6 mm or 2.4 mm, providing customers with a wide range of options for PCB assembly.
  • The headers offer an intermateable solution with major brand receptacles via a polarization feature that favors correct mating.
  • Founded in 1974, Heilind has locations throughout the U.S., Canada, Mexico, Brazil, Germany, Singapore, Hong Kong and China.\nTE Connectivity is a global industrial technology leader creating a safer, sustainable, productive and connected future.
  • With approximately 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS.\n"