Ansys

Ansys Continues AI Innovations

Retrieved on: 
Wednesday, October 25, 2023
Intelligence, Engineering, ANSYS, Transport, Machine learning, Instrumentation, Medical device, Video game, Ansys, AI

PITTSBURGH, Oct. 25, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) is reinforcing its ongoing investment in artificial intelligence (AI) innovation through the upcoming introduction of Ansys SimAI and Ansys AI+ technologies. The upcoming releases build on Ansys' ongoing expansion of AI integration across its simulation portfolio and customer community.

Key Points: 
  • The physics-agnostic and cloud-enabled tool combines the accuracy of Ansys simulation with the speed of AI
    PITTSBURGH, Oct. 25, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) is reinforcing its ongoing investment in artificial intelligence (AI) innovation through the upcoming introduction of Ansys SimAI and Ansys AI+ technologies.
  • With Ansys AI+, Ansys will incorporate and extend AI features within its industry-leading desktop products to enhance core functionalities.
  • "Ansys' expanded AI offerings, like Ansys optiSLang AI+, allowed our team to perform a design of experiment on a parametrized model of air filter properties, which we used to run an AI-based optimization strategy.
  • While Ansys SimAI will launch in early 2024, AI+ product capabilities will be available on a rolling basis beginning this Fall, first with the release of Ansys optiSLang AI+ and then Ansys Granta MI AI+.

Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions

Retrieved on: 
Thursday, October 19, 2023
Internet of things, TSMC, RF, HPC, Ecosystem, Partner, OIP, Joint, Silicon, Printed circuit board, Semiconductor, Electronics, Ansys

PITTSBURGH, Oct. 19, 2023 /PRNewswire/ -- Ansys (Nasdaq: ANSS) has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform® (OIP) Partner of the year awards for 2023. The OIP Partner of the Year awards honor TSMC Open Innovation Platform ecosystem partners' pursuit of excellence in next-generation design enablement over the past year. Ansys and other OIP ecosystem partners collaborate with TSMC to effectively promote innovation in the semiconductor industry. 

Key Points: 
  • The OIP Partner of the Year awards honor TSMC Open Innovation Platform ecosystem partners' pursuit of excellence in next-generation design enablement over the past year.
  • Ansys and other OIP ecosystem partners collaborate with TSMC to effectively promote innovation in the semiconductor industry.
  • Both the OIP Partner Collaboration award and the Joint Development of Millimeter-Wave Design Solutions award reflect the two tiers of collaborative effort with OIP partners to jointly develop four reference flows for radio-frequency (RF) design enablement with Ansys RaptorX™ , Ansys Exalto™ , Ansys VeloceRF™ , and Ansys Totem™ across multiple TSMC process technologies.
  • "We congratulate Ansys for winning these four 2023 TSMC OIP Partner of the Year awards," said Dan Kochpatcharin, head of the design infrastructure management division at TSMC.

Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology

Retrieved on: 
Wednesday, October 18, 2023
3D, Certification, ANSYS, Transport, World of Warcraft, Electronics, Silicon, UMC, Cow, Printed circuit board, Video game, Ansys

PITTSBURGH, Oct. 18, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology, which will improve the power, efficiency and performance of edge AI, graphic processing, and wireless communication systems. The certification empowers more chip designers to employ Ansys' semiconductor simulation solutions that perform multi-die co-analysis for streamlining and ensuring successful design.

Key Points: 
  • Chip designers can leverage Ansys semiconductor solutions to perform multi-die co-analysis for WoW and CoW packaging technology, accelerating and ensuring successful design
    PITTSBURGH, Oct. 18, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology, which will improve the power, efficiency and performance of edge AI, graphic processing, and wireless communication systems.
  • The certification empowers more chip designers to employ Ansys' semiconductor simulation solutions that perform multi-die co-analysis for streamlining and ensuring successful design.
  • These 3D-IC solutions for multiphysics analysis fit into a larger set of comprehensive Ansys solutions for board and system electrothermal analysis, including Ansys SIwave™ and Ansys Icepak™.
  • "The collaborative efforts combining Ansys' comprehensive chip-package co-analysis solutions with UMC's advanced chip-stacking technology address complex multiphysics challenges in 3D-IC packaging technologies."

Ansys Congratulates Oracle Red Bull Racing on Historic Championship Season

Retrieved on: 
Tuesday, October 10, 2023
Red Bull Racing, World Driver Championship, Static pressure, ANSYS, Safety, Transport, Behavior, Simulation, Constructor, Driver, Formula One, F1, Data management, Atmosphere, Entertainment, Instrumentation, Ansys

PITTSBURGH, Oct. 10, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) is proud to congratulate Oracle Red Bull Racing on its record-breaking season culminating in clinching the 2023 Formula 1 World Constructors' and World Drivers' Championships. The team's newest car model, RB19, which was designed using Ansys simulation solutions, has notched 16 wins, 24 podiums, and 657 points this season — with five races to go.

Key Points: 
  • Instead of focusing solely on the downforce generated above the car, the Oracle Red Bull Racing Team redesigned the car's floor to improve downforce underneath the car.
  • Knowing the car's physical limits through simulation has helped the Oracle Red Bull Racing team triumph over their opponents.
  • Data management optimization from Ansys Granta MI™ and virtual safety testing with Ansys LS-DYNA™ , empowered the Oracle Red Bull Racing team throughout the season.
  • To learn more or watch Oracle Red Bull Racing in action, watch "Building A Champion" of Ansys' Driven by Simulation .

Ansys Earns Two Best Workplaces in Europe Awards

Retrieved on: 
Monday, October 9, 2023
BPI, Emotion, 100 Best Workplaces in Europe, Respect, Workplace, Alignment, The Last Best Place, Nursing, Management, Ansys, Newsweek

PITTSBURGH, Oct. 9, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) was recognized as one of the Best Workplaces in Europe and one of Newsweek's Top 100 Most Loved Workplaces in the UK. Ansys was ranked 25 in the Multinational category of Best Workplaces in Europe and 24 in Newsweek's Top 100 UK's Most Loved Workplaces. The awards were based on employee-reported responses and rankings around topics like emotional fulfillment and employee engagement, respectively.

Key Points: 
  • PITTSBURGH, Oct. 9, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) was recognized as one of the Best Workplaces in Europe and one of Newsweek's Top 100 Most Loved Workplaces in the UK.
  • Ansys was ranked 25 in the Multinational category of Best Workplaces in Europe and 24 in Newsweek's Top 100 UK's Most Loved Workplaces.
  • To be recognized as one of the Best Workplaces in Europe, a company must first rank very highly among other companies of the same size in their own country.
  • Of the 3,350 participating companies — small, medium, large and multinational — only 150 Best Workplaces in Europe have been selected.

Digital Twin Market size worth USD 133.7 Billion, Globally, by 2030 at 38.1% CAGR: Verified Market Research®

Retrieved on: 
Friday, September 29, 2023
IBM, Ansys, General Electric, Bank statement, PTC, COVID-19, Digital twin, Research, SAP, USD, Organization, Microsoft, Siemens, Geography, Growth, Transport, Retail, Cryptocurrency, Oracle

JERSEY CITY, N.J., Sept. 29, 2023 /PRNewswire/ -- The Global Digital Twin Market is projected to grow at a CAGR of 38.1% from 2023 to 2030, according to a new report published by Verified Market Research®. The report reveals that the market was valued at USD 7.2 Billion in 2022 and is expected to reach USD 133.7 Billion by the end of the forecast period.

Key Points: 
  • The " Global Digital Twin Market Size By Type, By Technology, By Industry, By Geographic Scope And Forecast " report has been published by Verified Market Research®.
  • The report provides an in-depth analysis of the global Digital Twin Market, including its growth prospects, market trends, and market challenges.
  • The "Global Digital Twin Market" study report will provide valuable insight with an emphasis on the global market.
  • Based on the research, Verified Market Research® has segmented the global Digital Twin Market into Type, Technology, Industry, And Geography.

Digital Twin Market size worth USD 133.7 Billion, Globally, by 2030 at 38.1% CAGR: Verified Market Research®

Retrieved on: 
Friday, September 29, 2023
IBM, Ansys, General Electric, Bank statement, PTC, COVID-19, Digital twin, Research, SAP, USD, Organization, Microsoft, Siemens, Geography, Growth, Transport, Retail, Cryptocurrency, Oracle

JERSEY CITY, N.J., Sept. 29, 2023 /PRNewswire/ -- The Global Digital Twin Market is projected to grow at a CAGR of 38.1% from 2023 to 2030, according to a new report published by Verified Market Research®. The report reveals that the market was valued at USD 7.2 Billion in 2022 and is expected to reach USD 133.7 Billion by the end of the forecast period.

Key Points: 
  • The " Global Digital Twin Market Size By Type, By Technology, By Industry, By Geographic Scope And Forecast " report has been published by Verified Market Research®.
  • The report provides an in-depth analysis of the global Digital Twin Market, including its growth prospects, market trends, and market challenges.
  • The "Global Digital Twin Market" study report will provide valuable insight with an emphasis on the global market.
  • Based on the research, Verified Market Research® has segmented the global Digital Twin Market into Type, Technology, Industry, And Geography.

Ansys Named in U.S. News & World Report's 2024 Best Companies to Work For in Technology

Retrieved on: 
Thursday, September 28, 2023
Benchmark, Industry Classification Benchmark, Workplace, The Last Best Place, FTSE Russell, ICB, U.S. News & World Report, Creativity, Interface (computing), Russell, Glassdoor, News, Nursing, Creative industries, Ansys

 PITTSBURGH, Sept. 28, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) was recently named to U.S. News & World Report, the global authority in rankings and consumer advice, as one of the best companies to work for in Technology in its 2024 Best Companies to Work For by Industry list.

Key Points: 
  • Ansys recognized for quality of pay, work-life balance, and professional development
    PITTSBURGH, Sept. 28, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) was recently named to U.S. News & World Report , the global authority in rankings and consumer advice, as one of the best companies to work for in Technology in its 2024 Best Companies to Work For by Industry list.
  • Ansys was ranked among 349 companies across 20 fields of work on factors contributing to job seekers' decision-making when choosing a workplace that best meets their needs in their industries of interest.
  • The new recognitions expand on the general 2023-2024 U.S. News Best Companies to Work For list by looking at how companies measure up to the expectations of their employees and the standing of their competitors within their respective industries.
  • The rankings take into account quality of pay, work-life balance, and opportunities for professional development and advancement by industry.

TSMC Announces Breakthrough Set to Redefine the Future of 3D IC

Retrieved on: 
Wednesday, September 27, 2023
Apps, Applications, Technology, Mobile, Wireless, Packaging, Semiconductor, Engineering, Manufacturing, Electronic Design Automation, Artificial Intelligence, DFM, Ansys, SK, Introduction, DRAM, 3D IC, AMD, EDA, ATE, 3D, HBM3, UMTC, Micrometre, OIP, Language, Committee, DFT, European Technology Platform on Smart Systems Integration, SRAM, HPC, Architecture, Growth, Silicon, Ecosystem, AI, TSM, Substrate, Memory, NYSE, TSE, Video game, Synopsys, TSMC

The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.

Key Points: 
  • The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.
  • TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.
  • With contribution from the largest ecosystem of companies, 3Dblox has emerged as a critical design enabler of future 3D IC advancement.
  • 3Dblox 2.0 has won support from key EDA partners to develop design solutions that fully support all TSMC 3DFabric offerings.

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process

Retrieved on: 
Wednesday, September 27, 2023
Electronic Design Automation, Semiconductor, IOT (Internet of Things), Technology, Networks, Hardware, Partnership, CUI, LC, EM, Fort Dix, Goldengate, RFIC, SNPS, Risk, Sign-on and sign-off, Fin field-effect transistor, TSMC, Physics, Environment, NYSE, PathWave Design, Video game, Electronics, Ansys, Synopsys, RF

Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
  • The reference flow is based on the Synopsys Custom Design Family, which provides a complete RF design solution for customers seeking an open RF design environment with higher predictive accuracy and productivity.
  • Design complexity of RF integrated circuits used for wireless data transmission such as transceivers and RF front-end components continues to grow.
  • PathWave RFIC design (GoldenGate) supports harmonic balance simulation in early chip design and verification process.