Ansys

Ansys and Carnegie Mellon University Name Professor Rebecca Taylor to Inaugural Ansys Career Development Chair in Engineering

Retrieved on: 
Tuesday, November 21, 2023
Carnegie Mellon University, Biomedical engineering, Research, DNA, Workforce, Student, Faculty, Fourth Industrial Revolution, ANSYS, Nano, Software, Partnership, Mechanics, Life, Transport, Management, Ansys, CMU, Engineering

PITTSBURGH, Nov. 21, 2023 /PRNewswire/ -- CMU and Ansys (NASDAQ: ANSS) deepen their longstanding partnership, appointing Professor Rebecca Taylor to the inaugural Ansys Career Development Chair in Engineering. The title recognizes engineering faculty at CMU who conduct education and research in fields related to Ansys or integrate Ansys solutions into research projects and curricula.

Key Points: 
  • The title recognizes engineering faculty at CMU who conduct education and research in fields related to Ansys or integrate Ansys solutions into research projects and curricula.
  • Professor Taylor is a faculty member in mechanical engineering with courtesy appointments in biomedical engineering, and electrical and computer engineering.
  • Students will employ Ansys solutions in assignments and research projects, using the maker space in Ansys Hall to bring their innovations to life.
  • "The endowment from Ansys will play a major role in the future of mechanical engineering curricula at CMU," said Rebecca Taylor, Ansys career development associate professor at Carnegie Mellon University.

Ansys Chief Executive Officer to Present at the 49th Nasdaq Investor Conference

Retrieved on: 
Monday, November 20, 2023
Webcast, 10-Q, Morgan Stanley, Multimedia, The May Fair Hotel, ANSYS, Conference, ANSS, Growth, Transport, Ansys

PITTSBURGH, Nov. 20, 2023 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced today that Ajei Gopal, president and chief executive officer, will participate in a moderated discussion at the 49th Nasdaq Investor Conference, held in association with Morgan Stanley at the May Fair Hotel in London on Wednesday, December 6, 2023, at 8:30 a.m.

Key Points: 
  • PITTSBURGH, Nov. 20, 2023 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced today that Ajei Gopal, president and chief executive officer, will participate in a moderated discussion at the 49th Nasdaq Investor Conference, held in association with Morgan Stanley at the May Fair Hotel in London on Wednesday, December 6, 2023, at 8:30 a.m.
  • When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation.
  • For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation.
  • From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud

Retrieved on: 
Thursday, November 16, 2023
Risk, Electronics, Element, TSMC, ANSYS, HPC, Microsoft Azure, 3D, Microsoft, Silicon, Temperature, Transport, Printed circuit board, Semiconductor, Video game, Ansys, Azure

PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC's 3DFabric™ advanced packaging technologies. This collaborative solution gives customers added confidence to address novel multiphysics requirements that improve the functional reliability of advanced designs using TSMC's 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

Key Points: 
  • Ansys Mechanical is the industry-leading finite element analysis software used to simulate mechanical stresses caused by thermal gradients in 3D-ICs.
  • The solution flow has been proven to run efficiently on Microsoft Azure, helping to ensure fast turn-around times with today's very large and complex 2.5D/3D-IC systems.
  • 3D-IC systems often have large temperature gradients that lead to intense mechanical stresses between components due to differential thermal expansion.
  • Ansys Mechanical, running on Azure's purpose-built HPC infrastructure, is instrumental in scaling up computationally demanding stress simulations while maintaining predictive accuracy.

Chemical Software Market is driven by the increasing establishment of new chemical plants worldwide - Technavio

Retrieved on: 
Thursday, November 16, 2023
BatchMaster Software, Organization, Ansys, ISO, USD, Fourth Industrial Revolution, Automation, Quality control, Chemical substance, Geography, Growth, SDS, Chemical industry, Online shopping

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Key Points: 
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    The market is primarily driven by the increasing establishment of new chemical plants worldwide, the rise of Industry 4.0, and the growing need for digitalization in the chemical industry.
  • Chemical software facilitates processes such as chemical process simulation, inventory management, ISO management, and more.
  • North America plays a significant role in the global chemical software market, with the United States leading the way.
  • This positions the chemical software market for sustained growth, innovation, and adaptability in the evolving landscape of the chemical industry.

Ansys Collaborates with Sony Semiconductor Solutions to Advance Next-Generation Simulation of Automotive Image Sensors

Retrieved on: 
Thursday, November 9, 2023
Sony, ADAS, AV, LED, ANSYS, Transport, Electronics, Motion, HDR, Instrumentation, Camera, Ansys

PITTSBURGH, Nov. 9, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) collaborated with Sony Semiconductor Solutions (Sony) to enhance high-fidelity image sensor simulation and camera-based features in next-generation automotive applications, including AV and ADAS. Ansys Speos can now seamlessly integrate with Sony's sensor models to streamline development and validation with more precise modeling.

Key Points: 
  • Ansys solutions can now integrate with Sony Semiconductor Solutions' sensor models, optimizing and accelerating the development of camera features for autonomous vehicle (AV) and advanced driver assistance system (ADAS) applications
    PITTSBURGH, Nov. 9, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) collaborated with Sony Semiconductor Solutions (Sony) to enhance high-fidelity image sensor simulation and camera-based features in next-generation automotive applications, including AV and ADAS.
  • Automotive image sensors must continuously evolve to deliver safer, higher functioning ADAS capabilities.
  • To meet this demand, Ansys developed a novel software interface compatible with Sony's sensor models, which are based on the internal architecture of image sensors used in camera systems.
  • "The collaboration between Ansys and Sony will provide an automotive-grade, end-to-end spectral simulation pipeline from lens models to sensor models for the ADAS perception system developers," said Kenji Onishi, deputy senior general manager, automotive business division, Sony Semiconductor Solutions Corporation.

Ansys medini Accelerates Andes’ Development of Automotive-Grade IP

Retrieved on: 
Thursday, November 2, 2023
ISO 26262, SIP, FTA, VLSI, Certification, Original equipment manufacturer, Andes Technology, Maintenance, FMEDA, Functional safety, Safety management system, Quality, Semiconductor, Safety, IP, Automation, ISO, Associate, Risk management, Medical device, Silicon, Ansys

To streamline ISO 26262 verification and to integrate verification information conveniently, the decision was made to introduce Ansys medini to achieve the automation and modulization of safety analysis process.

Key Points: 
  • To streamline ISO 26262 verification and to integrate verification information conveniently, the decision was made to introduce Ansys medini to achieve the automation and modulization of safety analysis process.
  • In the field of RISC-V CPU IP for the automotive market, Andes Technology has achieved remarkable milestones.
  • In 2020, Andes became the world's first RISC-V supplier to have its development process certified to ISO-26262 ASIL-D standard.
  • There are high expectations that Ansys medini will bring enhanced competitiveness to Andes Technology's automotive-grade IP business”.

Ansys, Materialise Partnership Connects Industry-Leading Solutions to Enhance Additive Manufacturing Software

Retrieved on: 
Monday, November 6, 2023
3D, Gold, Research, AM, Engineering, Software, ANSYS, Transport, Partnership, Magic, Workflow, Mobile phone, 3D printing, Materialise NV, Ansys

PITTSBURGH, Nov. 6, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS), the global leader in engineering simulation software, and Materialise, a global leader in 3D printing software and service solutions, are joining forces to deliver integrated digital solutions to help overcome workflow challenges in the AM industry. The partnership will seamlessly integrate Ansys Additive Suite into Materialise's data and build preparation tool, Magics. An initial solution, to be previewed at Formnext 2023 and arriving in Q2 2024, will provide a best-in-class workflow for managing AM industrial projects across industries, including the medical and aerospace sectors.

Key Points: 
  • The partnership will seamlessly integrate Ansys Additive Suite into Materialise's data and build preparation tool, Magics .
  • In many cases, the AM process requires users to perform build and data preparation tasks on one software platform and run simulations on another.
  • The Ansys and Materialise partnership alleviates these issues by combining Ansys' gold standard simulation software with https://www.materialise.com/en/industrial/software/magics-data-build-pre... Magics into one streamlined workflow, resulting in faster time-to-market and efficient distortion compensation.
  • For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation.

Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program

Retrieved on: 
Tuesday, October 31, 2023
Cloud, Element, Keysight, Azure, GlobalFoundries, Microsoft, Kurdistan, Ansys, Synopsys, Customer, Environment, EDA, Advanced Design System, SNPS, Ecosystem, Microsoft Azure, API, AI, IP, GM, Software as a service, Video game, Software, Electronics, Semiconductor, SOC

SUNNYVALE, Calif., Oct. 31, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the launch of its new Synopsys Cloud OpenLink program to foster semiconductor industry interoperability through an open cloud environment. The first of its kind program enables chip designers to seamlessly access third-party electronic design automation (EDA) tools and IP in the Synopsys Cloud environment. As part of this initiative, Synopsys is releasing an application programming interface (API) specification that Synopsys Cloud OpenLink program members can use to deploy system-level integration with a highly secure and reliable transfer of entitlements to Synopsys Cloud. This offers mutuals customers an end-to-end SoC design environment with efficient access to EDA solutions, IP, and compute of their choice.

Key Points: 
  • Chip design ecosystem vendors are invited to join the Synopsys Cloud OpenLink program.
  • SUNNYVALE, Calif., Oct. 31, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS ) today announced the launch of its new Synopsys Cloud OpenLink program to foster semiconductor industry interoperability through an open cloud environment.
  • "The Synopsys Cloud OpenLink program will further enable additional Keysight tools to be used on Synopsys Cloud, such as our Advanced Design System – making the program an excellent enabler of industry-wide interoperability for cloud-based EDA."
  • "The Synopsys Cloud OpenLink program makes interoperability across diverse chip design flows seamless and efficient for our mutual customers."

The Future of Automotive Safety Testing - The Automotive Crash Impact Simulator

Retrieved on: 
Tuesday, October 31, 2023
Software as a service, Crash, Heart, Growth, Ansys, Benefit, USD, Renewable energy, Video game, Retail

The " Global Automotive Crash Impact Simulator Market 2023-2027 " report recently added to ResearchAndMarkets.com's offering highlights the significance of this cutting-edge technology in meeting the ever-evolving demands of the automotive industry.

Key Points: 
  • The " Global Automotive Crash Impact Simulator Market 2023-2027 " report recently added to ResearchAndMarkets.com's offering highlights the significance of this cutting-edge technology in meeting the ever-evolving demands of the automotive industry.
  • The Automotive Crash Impact Simulator ensures accurate and reliable testing, helping manufacturers meet the stringent safety standards required in different parts of the world.
  • In a market driven by the need for crash and safety testing, the simulator enables continuous advances and developments in automotive crash technology, thanks to high-performance computing.
  • One of the prime reasons driving the automotive crash impact simulator market's growth is the utilization of parallelism in virtual crash testing.

Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards

Retrieved on: 
Thursday, October 26, 2023
TSMC, Silicon, Interface, RF, Certification, N3P, Architecture, N16, Ansys, Radio, Engineering, Collaboration, EDA, SNPS, Ecosystem, Partner, OIP, AI, IP, High-pass filter, Semiconductor, Printed circuit board, Synopsys

SUNNYVALE, Calif., Oct.  26, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) has been selected as a TSMC Open Innovation Platform® (OIP) Partner of the Year, earning five awards spanning digital, analog, multi-die system, radio frequency (RF) design, and interface IP. The long-standing collaboration between the two companies continues to deliver production-proven solutions, including certified design flows, powered by the Synopsys.ai™ full-stack AI-driven EDA suite, that help mutual customers accelerate the development and silicon success of innovative AI, automotive, and high-performance computing designs. Synopsys solutions were featured in an unprecedented number of presentations at the 2023 North America TSMC OIP Ecosystem forum, highlighting strong collaboration with TSMC and partners on proven solutions for TSMC's advanced process and 3DFabric™ technologies. 

Key Points: 
  • Silicon success of Synopsys Interface IP portfolio on TSMC N3E reduces integration risk, accelerates time-to-market, and provides a fast path to TSMC N3P.
  • Synopsys solutions were featured in an unprecedented number of presentations at the 2023 North America TSMC OIP Ecosystem forum, highlighting strong collaboration with TSMC and partners on proven solutions for TSMC's advanced process and 3DFabric™ technologies.
  • "The partner awards recognize the significant contributions made by the TSMC OIP ecosystem partners like Synopsys to advance the next generation of high-performance designs on TSMC's technologies, with massively improved quality of results and time to results."
  • Partner Collaboration: Synopsys, Ansys, and Keysight were recognized for their unprecedented collaboration to develop the RF reference flows for TSMC's leading N16, N6 and N4P processes.