Electronic design automation

Synopsys: IC Electronic Design Automation - Higher Performance, Lower Cost and Faster Time-to-market

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Tuesday, November 8, 2022
Johannes Gutenberg, Li, Environment, Era, VP, SOC, Silicon, Industrial Development Bureau, Interview, EDA, Renaissance, Revolution, Economy, Printing, Behavior, Statistics, Will Power (performer), Electronic design automation, SIPO, Ministry, Time, View, IC, Industrial Revolution, ICS, IP, Solution, AI, IOT, Hand, Ministry of the economy, Multimedia, PPA, Knowledge, Automation, Technology, ITRI, Silicon Beach Software, Consumer electronics, Printed circuit board, Medical device, Synopsys, Software

As reliance on electronic products continues to grow, how to design higher performing and cost-effective chips, and to do so in a shorter time, has become a key challenge for IC designers.

Key Points: 
  • As reliance on electronic products continues to grow, how to design higher performing and cost-effective chips, and to do so in a shorter time, has become a key challenge for IC designers.
  • Synopsys is an S&P 500 companyand has a long history of being a global leader in IC electronic design automation (EDA) and IC interface IP.
  • The key indicator of IC design is PPA (Power, Performance, Area), which means less power, higher performance and more transistors packed into the same geometry.
  • Statistics show that future market demand for IC design engineers will be 1000 times higher than it is now.

Pulsonix Honored as Recipient of 'Best PC Design Software' at EM Media Best Awards 2022

Retrieved on: 
Tuesday, October 11, 2022
Electronic design automation, Electronics, SMT, PCB, EDA, Electronic, Technology, Software, Industry, Solution, EMS, Leadership, Printed circuit board, Pulsonix, Semiconductor, Automation

TEWKESBURY, U.K., Oct. 11, 2022   /PRNewswire-PRWeb/ -- Pulsonix™ (http://www.pulsonix.com), the Electronic Design Automation (EDA) company delivering technology-leading PCB design solutions, today announced that they were awarded the 'Best PC Design Software' at the EM Best Awards 2022, India's biggest and most prestigious electronics awards celebrating excellence and achievements of true pioneers. "We are extremely honored to be recognized for this award and will continue with our objective to provide the most highly advanced and productive EDA technology suite in the industry," said Bob Williams, marketing director for Pulsonix. "Our software engineering professionals at Pulsonix understand the need for high quality and fast response times, and we use the very latest software techniques in graphics and data handling to produce best-in-class tools. Our EDA technology suite has been designed to meet the ever-changing needs of PCB design in the 21st century and sets the new standard for the electronics industry with easy-to-use and learn schematic capture and PCB layout programs."

Key Points: 
  • Pulsonix has been honored with the 'Best PC Design Software' award at the EM Best Awards 2022, based on the nominees having demonstrated leadership, product innovation, excellence in their field, and effectiveness in addressing a need or defining a new market.
  • TEWKESBURY, U.K., Oct. 11, 2022 /PRNewswire-PRWeb/ -- Pulsonix ( http://www.pulsonix.com ), the Electronic Design Automation (EDA) company delivering technology-leading PCB design solutions, today announced that they were awarded the 'Best PC Design Software' at the EM Best Awards 2022, India's biggest and most prestigious electronics awards celebrating excellence and achievements of true pioneers.
  • Over the years, the EM Best Awards have established themselves as the industry standard for honoring contributions to the electronics industry.
  • EM Best Awards 2022 includes key electronics categories as Semiconductor, Test and Measurement, Electronics Components, Automation, SMT, PCB, EMS.

GBT Filed a Non-Provisional Patent for Automatic Generation of Integrated Circuits Layout Blocks

Retrieved on: 
Thursday, October 6, 2022
SAN, Electronic design automation, U.S. Securities and Exchange Commission, GBT, Logic, System, IOT, Electronics, SOC, USB, Silicon, HDMI, Intellectual property, IC, Research, EDA, Security (finance), CPU, Â, Electronic, GPS, Technology, Software, Company, AI, IP, Patent, OTC, Artificial intelligence, GLOBE, Forward-looking statement, Public policy, Internet of things, IPS, ID, Semiconductor, ICS, Video game console, Blockchain

SAN DIEGO, Oct. 06, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), filed a non-provisional patent application seeking to protect an Electronic Design Automation (EDA) software technology, internal code name Phi, which software is designed to automate the generation of reusable integrated circuits (IC) layout blocks. The concept produces a layout according to the IC’s description and its goal is to save time during the design of a microchip. The intellectual property block can be used as a black-box to be inserted within existing or future IC projects, as a plug-and-play unit, with the goal of enabling time saving by avoiding entire re-design process. The patent was filed on September 27, 2022 and received an application ID: 17953378. Intellectual Property (IP) as it pertains to semiconductors is a reusable logic or layout unit design that is developed with the intent of licensing to multiple vendors or using internally for using as building blocks in different chip designs. Using reusable IPs is an efficient method to quickly design a System on Chip (SoC). A SoC is an IC that includes sub-units’ components. It is typically consistent of core blocks for each to perform its own task such as internal storage, central processing unit (CPU), input/output ports and more. Modern SoCs also may include AI and other complex blocks to enable advanced capabilities. Using reusable, pre-designed IP cores/blocks is becoming more and more crucial to minimize the entire IC’s design time. The non-provisional patent application describes a system that has the goal of automatically generate IC layout IP blocks, reading a defined process design rules, constraints and the microchip’s specifications. The goal of this IP is to reduce IC project’s design and costs, as well as the silicon space occupied by large systems. GBT plans to continue its research and development efforts in this area of enabling efficient microchip’s design projects and, in turn, reducing their time-to-market factor.

Key Points: 
  • SAN DIEGO, Oct. 06, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company), filed a non-provisional patent application seeking to protect an Electronic Design Automation (EDA) software technology, internal code name Phi, which software is designed to automate the generation of reusable integrated circuits (IC) layout blocks.
  • The concept produces a layout according to the ICs description and its goal is to save time during the design of a microchip.
  • The patent was filed on September 27, 2022 and received an application ID: 17953378.
  • GBT envisions this system as a creation of a global mesh network using advanced nodes and super performing new generation IC technology.

Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022

Retrieved on: 
Tuesday, October 4, 2022
5G, Automotive, Artificial Intelligence, Consumer Electronics, Wearables, Mobile Technology, Technology, General Automotive, Semiconductor, Cloud, Solution, Electronics, IOT, Pyeongtaek, Samsung Electronics, Samsung, News, Television, GAA, Ecosystem, LED, Technology, SAFE, Memory, DSP, Electronic, The, Multimedia, Head, IC, Internet of things, Artificial intelligence, Speech, LSI, HPC, EDA, OSAT, IP, Electronic design automation, Tablet, Semiconductor, Mobile phone

View the full release here: https://www.businesswire.com/news/home/20221004005569/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20221004005569/en/
    Dr. Si-young Choi, president and head of Foundry Business at Samsung Electronics, is giving his keynote speech at Samsung Foundry Forum 2022.
  • To that end, Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.
  • During the event, Samsung also outlined steps its Foundry Business is taking in order to meet customers needs, including: foundry process technology innovation, process technology optimization for each specific applications, stable production capabilities, and customized services for customers.
  • Following the 'Samsung Foundry Forum,' Samsung will hold the 'SAFE Forum' (Samsung Advanced Foundry Ecosystem) on October 4th.

Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022

Retrieved on: 
Tuesday, October 4, 2022
Semiconductor, Hardware, Nanotechnology, Mobile, Wireless, Technology, Cloud, Solution, Electronics, IOT, Pyeongtaek, Samsung Electronics, Samsung, News, Television, GAA, Ecosystem, LED, Technology, SAFE, Memory, DSP, Electronic, The, Multimedia, Head, IC, Internet of things, Artificial intelligence, LSI, HPC, EDA, OSAT, IP, Electronic design automation, Tablet, Semiconductor, Mobile phone

View the full release here: https://www.businesswire.com/news/home/20221003006073/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20221003006073/en/
    Attendees of Samsung Foundry Forum 2022 are gathered around the customer booths.
  • To that end, Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.
  • During the event, Samsung also outlined steps its Foundry Business is taking in order to meet customers needs, including: foundry process technology innovation, process technology optimization for each specific applications, stable production capabilities, and customized services for customers.
  • Following the 'Samsung Foundry Forum,' Samsung will hold the 'SAFE Forum' (Samsung Advanced Foundry Ecosystem) on October 4th.

Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier

Retrieved on: 
Wednesday, September 14, 2022
Semiconductor, Hardware, Electronic Design Automation, Technology, Software, Engineering, QA, CPU, Economics, IP, EDA, OPEX, CEO, CAPEX, FPGA, Quality assurance, GPU, Electronic design automation, HPC, AI, TPU, Video game console, Medical device, Prodigy

Tachyum today announced it has entered the Quality Assurance (QA) phase for hardware and software testing on field-programmable gate array (FPGA) emulation boards for Prodigy, the world's first universal processor.

Key Points: 
  • Tachyum today announced it has entered the Quality Assurance (QA) phase for hardware and software testing on field-programmable gate array (FPGA) emulation boards for Prodigy, the world's first universal processor.
  • The QA process covers component testing, integration testing, regression testing, and performance testing.
  • Achieving QA status demonstrates that Tachyum is succeeding in the preproduction phase, said Dr. Radoslav Danilak, founder and CEO of Tachyum.
  • A video demonstration of the QA process for hardware and software testing on Prodigy FPGA can be found at https://youtu.be/jytbktD0G4I.

GBT is Implementing Machine Learning Driven, Pattern Matching Technology for its Epsilon, Mi-crochip Reliability Verification and Correction EDA Tool

Retrieved on: 
Thursday, September 1, 2022
Machine learning, Software, Machine, Gate, Security (finance), AI, Technology, OTC, Research, SAN, Verification, GBT, Physics, Artificial intelligence, Heart, IOT, Forward-looking statement, Data analysis, EDA, GAA, FinFET, GPS, U.S. Securities and Exchange Commission, Deep learning, Overheating, Medicine, GLOBE, Company, Internet of things, Algorithm, IC, IP, Risk, Public policy, Electronic design automation, Transport, Epsilon, Aviation, Electronics, Efficiency, RV, Blockchain

SAN DIEGO, Sept. 01, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company), is implementing a machine learning driven, pattern matching technology within its Epsilon, microchips reliability verification and correction Electronic Design Automation (EDA) tool.

Key Points: 
  • SAN DIEGO, Sept. 01, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company), is implementing a machine learning driven, pattern matching technology within its Epsilon, microchips reliability verification and correction Electronic Design Automation (EDA) tool.
  • High performance computing systems require advanced processing with high reliability to ensure the consistency and accuracy of the processed data.
  • GBT is implementing new machine learning driven, pattern matching techniques within its Epsilon system with the goal of addressing the advanced semiconductors physics, ensuring high level of reliability, optimal power consumption and high performance.
  • Epsilons pattern matching technology will be analyzing the chips data according to a set of predefined and learned-from-experience rules.

GBT Filed a Non-Provisional Patent Application Seeking to Protect the Automatic Correction of Integrated Circuits Connectivity Mismatches

Retrieved on: 
Tuesday, August 16, 2022
U.S. Securities and Exchange Commission, Electronic design automation, CAD, Forward-looking statement, GLOBE, GBT, Algorithm, AI, DFM, Technology, IOT, IP, Artificial intelligence, Electronic, Research, Security (finance), IC, Company, SAN, OTC, Physics, EDA, LVS, Automation, Design, GPS, RF, Internet of things, Integrated circuit, Software, Reliability verification, Solution, ICS, Time, Public policy, DRC, Verification, Printed circuit board, Blockchain

SAN DIEGO, Aug. 16, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company) filed a nonprovisional patent application for automatic correction of Integrated Circuits (IC) electrical connectivity mismatches system and method.

Key Points: 
  • SAN DIEGO, Aug. 16, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. ( OTC PINK:GTCH ) ("GBT or the Company) filed a nonprovisional patent application for automatic correction of Integrated Circuits (IC) electrical connectivity mismatches system and method.
  • The nonprovisional patent application seeks to protects programmatic methodologies and algorithms to automate ICs electrical connectivity mismatches correction to achieve faster and more efficient designs, particularly for advanced nanometer range of 5nm and below.
  • GBTs nonprovisional patent application seeks to protect an algorithmic systems and method to perform an automatic LVS correction with a click of a button.
  • Our nonprovisional patent application seeks to protect an automated LVS correction system to analyze an entire chip data, checks for electrical connectivity mismatches and Auto-Corrects them with a click of a button.

Global Engineering Software (CAD, CAM, CAE, AEC, & EDA) Market Report 2022: Market to Reach $50.2 Billion by 2026 - Electronics Industry Extends Opportunities

Retrieved on: 
Monday, August 15, 2022
CAD, Computer-aided engineering, Electronic design automation, Industry, 3D, AI, IOT, Growth, Investment, Direct stiffness method, Electronic, MDB, CFD, Engineering, FEA, CAM, EDA, Engineered Software Inc., CAE, CAGR, Automation, Tablet, Software, AEC, Adoption, Pet, Video game, 3D printing, Renewable energy

DUBLIN, Aug. 15, 2022 /PRNewswire/ -- The "Engineering Software (CAD, CAM, CAE, AEC, & EDA) - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Aug. 15, 2022 /PRNewswire/ -- The "Engineering Software (CAD, CAM, CAE, AEC, & EDA) - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
  • Growth in the global market is driven by rising adoption across diverse industries and strong contribution from different software segments.
  • Rapid automation of industrial operations and equipment will fuel demand for engineering software such as CAD, CAM and CAE software, among others.
  • Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1.1 Billion by the year 2026.

Global $32.6 Billion Engineering Software (CAD, CAM, CAE, AEC, & EDA) Market Trajectory & Analytics to 2026 - ResearchAndMarkets.com

Retrieved on: 
Thursday, August 11, 2022
Architecture, Software, Construction & Property, Electronic Design Automation, Engineering, Technology, Aerospace, Manufacturing, CAD, Computer-aided engineering, Electronic design automation, Industry, 3D, AI, IOT, Growth, Investment, Direct stiffness method, Electronic, MDB, CFD, Engineering, FEA, CAM, EDA, Engineered Software Inc., CAE, CAGR, Automation, Tablet, Software, AEC, Adoption, Pet, Video game, 3D printing, Renewable energy

The "Engineering Software (CAD, CAM, CAE, AEC, & EDA) - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Engineering Software (CAD, CAM, CAE, AEC, & EDA) - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
  • Growth in the global market is driven by rising adoption across diverse industries and strong contribution from different software segments.
  • Rapid automation of industrial operations and equipment will fuel demand for engineering software such as CAD, CAM and CAE software, among others.
  • Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1.1 Billion by the year 2026.