OIF to Update Industry on Next-Generation Electrical and Optical Interface Projects, including 224 Gbps & Co-Packaging, at DesignCon 2023
At DesignCon 2023 , Jan 31 – Feb 2, in Santa Clara, CA, industry experts will reveal the work OIF is doing to address electrical interfaces optimized for new electrical and optical architecture aspirations, including 224 Gbps and the co-packaging of optical and electrical interfaces with ASICs.
- At DesignCon 2023 , Jan 31 – Feb 2, in Santa Clara, CA, industry experts will reveal the work OIF is doing to address electrical interfaces optimized for new electrical and optical architecture aspirations, including 224 Gbps and the co-packaging of optical and electrical interfaces with ASICs.
- This session will include lessons learned from 112 Gbps and how those lessons are being leveraged for the new 224 Gbps work in OIF.
- Experts will also discuss the challenges OIF must overcome to enable 224 Gbps electrical I/O interface solutions where reach, performance, power, and cost optimizations become paramount.
- These solutions are critical to keep the industry moving forward with the next generation of interoperable electrical I/O interface specifications that address the escalating network power consumption trends.