Electronic engineering

QuickLogic CEO to Present at Silicon Summit East

Retrieved on: 
Friday, October 5, 2018
Electronic engineering, Field-programmable gate array, Internet of things, Ice, Fabless semiconductor companies, Electronics, Electrical engineering

SUNNYVALE, Calif., Oct. 5, 2018 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice enabled SoCs, embedded FPGA (eFPGA) IP, display bridge and programmable logic solutions, will be presenting, participating in a panel and demonstrating its ArcticPro eFPGA solutions at the Silicon Summit East 2018 in Saratoga Springs, NY.

Key Points: 
  • SUNNYVALE, Calif., Oct. 5, 2018 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice enabled SoCs, embedded FPGA (eFPGA) IP, display bridge and programmable logic solutions, will be presenting, participating in a panel and demonstrating its ArcticPro eFPGA solutions at the Silicon Summit East 2018 in Saratoga Springs, NY.
  • QuickLogic Corporation (NASDAQ: QUIK) enables OEMs to maximize battery life for highly differentiated, immersive user experiences with Smartphone, Wearable, Hearable and IoT devices.
  • QuickLogic delivers these benefits through industry leading ultra-low power customer programmable SoC semiconductor solutions, embedded software, and algorithm solutions for always-on voice and sensor processing.
  • The QuickLogic logo and QuickLogic are registered trademarks of QuickLogic Corporation and ArcticPro is a trademark of QuickLogic.

Altium Previews "First Step" in Connecting Electronics Design to the Manufacturing Floor

Retrieved on: 
Thursday, October 4, 2018
Electronic design automation, Electronic engineering, Digital electronics, Altium Designer, Altium, Mentor Graphics, CircuitMaker, Printed circuit board, PCB, Upverter

Altium 365, a cloud-based platform, is the first step in directly connecting desktop printed circuit board (PCB) design with the manufacturing floor.

Key Points: 
  • Altium 365, a cloud-based platform, is the first step in directly connecting desktop printed circuit board (PCB) design with the manufacturing floor.
  • "Altium 365 will ultimately provide direct, real-time connectivity between design, supply chain, and the people and equipment on the manufacturing floor to achieve this."
  • Along with Altium 365, Altium has also announced the upcoming release of its widely used PCB design software, Altium Designer.
  • Altium Designer 19 will also be the first release to be connected with the Altium 365 cloud-based platform, delivering the world's first seamless design to manufacturing floor experience.

Global Low Dielectric Resin Market 2012-2018 & Forecast to 2023: Promising Opportunities in the PCB, Wire & Cable, Antenna, Microelectronics, and Radome Applications

Retrieved on: 
Thursday, October 4, 2018
Electromagnetism, Electronic engineering, Electrical engineering, Electronics manufacturing, Printed circuit board, Dielectric, Resin

The future of the low dielectric resin market looks promising with opportunities in the PCB, wire & cable, antenna, microelectronics, and radome applications.

Key Points: 
  • The future of the low dielectric resin market looks promising with opportunities in the PCB, wire & cable, antenna, microelectronics, and radome applications.
  • Some of the features of Low Dielectric Resin Market Report: Trends, Forecast and Competitive Analysis include:
    Market size estimates: Global low dielectric resin market size estimation in terms of value ($M) and volume (M Lbs.)
  • Growth opportunities: Analysis on growth opportunities in different applications and regions of low dielectric resin in the global low dielectric resin market.
  • Strategic analysis: This includes M&A, new product development, and competitive landscape of low dielectric resin in the global low dielectric resin market.

Eltek Receives Non-Compliance Notice Regarding Nasdaq Minimum Stockholders' Equity Requirement

Retrieved on: 
Thursday, October 4, 2018
Pollution, Electromagnetism, Electronic engineering, Eltek, Monsanto, Electronics manufacturing, Polychlorinated biphenyl, Printed circuit board, Flex

Eltek has 45 calendar days, until November 16, 2018, to submit a plan to regain compliance.

Key Points: 
  • Eltek has 45 calendar days, until November 16, 2018, to submit a plan to regain compliance.
  • If the plan is accepted, the Listing Qualifications Department of Nasdaq can grant an extension of up to 180 calendar days from October 2, 2018, to allow the Company to evidence compliance.
  • Eltek specializes in the manufacture and supply of complex and high quality PCBs, HDI, multilayered and flex-rigid boards for the high-end market.
  • Eltek also operates through its subsidiaries in North America and in Europe and by agents and distributors in Europe, India, South Africa and South America.

TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event

Retrieved on: 
Wednesday, October 3, 2018
TSMC, Synopsys, Technology, Electronic engineering, Digital electronics, Fabless semiconductor companies, Electronic design automation

Synopsys and TSMC have collaborated for more than 18 years, most recently to accelerate the adoption of FinFET technology for optimum power, performance, and area for the 5-nm process.

Key Points: 
  • Synopsys and TSMC have collaborated for more than 18 years, most recently to accelerate the adoption of FinFET technology for optimum power, performance, and area for the 5-nm process.
  • This is the eighth consecutive year Synopsys has received both IP and electronic design automation (EDA) accolades from TSMC.
  • "We are honored to receive these prestigious awards from TSMC," said Dr. Michael Jackson, corporate vice president of Synopsys' Design Group.
  • "With its extensive high-quality DesignWare IP portfolio, certified Design Platform, and Cloud Solution, Synopsys and TSMC are addressing our customers' needs to achieve their design goals and accelerate production."

Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies

Retrieved on: 
Wednesday, October 3, 2018
Hillsboro, Oregon, Synopsys, Semiconductor device fabrication, Electronic engineering, Technology, TSMC, Wafer, Electronics, Integrated circuits

Synopsys, Inc. (Nasdaq: SNPS) today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.

Key Points: 
  • Synopsys, Inc. (Nasdaq: SNPS) today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.
  • "We extend our collaboration with Synopsys to deliver design solutions for TSMC's CoWoS and WoW advanced packaging technologies.
  • We look forward to our mutual customers benefiting from the enabled design solutions, boosting designer productivity and accelerating time-to-market."
  • "The Synopsys Design Platform and methodologies will allow designers to confidently meet their schedules for cost-effective, high-performance, and low-power multi-die solutions."

OmniSci (formerly MapD) Secures $55 Million in New Funding

Retrieved on: 
Wednesday, October 3, 2018
OmniSci, Coprocessors, GPGPU, Nvidia, Graphics processing unit, Computer engineering, Computing, Electronic engineering, Draft:MapD

We are delighted to lead this funding round and help OmniSci capture significant market share in the following years."

Key Points: 
  • We are delighted to lead this funding round and help OmniSci capture significant market share in the following years."
  • Commercially launched in 2016, adoption of OmniSci has paralleled the dramatic rise of GPUs in private and public data centers.
  • NVIDIA's quarterly data center revenues have risen from $151 million in Q2-FY17 to $760 million in Q2-FY19.
  • OmniSci is funded by GV, In-Q-Tel, New Enterprise Associates (NEA), NVIDIA, Tiger Global Management, Vanedge Capital and Verizon Ventures.

The Machine Learning Chip Market is Expected to Grow as Technology Advances

Retrieved on: 
Wednesday, October 3, 2018
Digital electronics, Theoretical computer science, Integrated circuit, CHIP, Algorithm, Electronic engineering, Mathematics, Coprocessors, Electromagnetism

The report indicates that machine learning chips as a multiprocessor system is capable of learning, reasoning, and self-correction of its algorithm without any external programming.

Key Points: 
  • The report indicates that machine learning chips as a multiprocessor system is capable of learning, reasoning, and self-correction of its algorithm without any external programming.
  • Based on technology, the system-on-chip segment is anticipated to dominate the market throughout the forecast period (20182025).
  • Moreover, based on industry vertical, the BFSI segment dominates the overall machine learning chip market.
  • The machine learning chip market signifies a promising future for the technological industry.

Mentor extends solutions to support TSMC 5nm FinFET and 7nm FinFET Plus process technologies

Retrieved on: 
Wednesday, October 3, 2018
TSMC, 7 nanometer, Mentor Graphics, FinFET, Electrical engineering, Electronic engineering, Economy of Taiwan, ARM architecture

"TSMC is working closely with Mentor, which continues to increase its value to the TSMC ecosystem by offering more features to its EDA solutions in support of our new 5nm and 7nm FinFET Plus processes," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division.

Key Points: 
  • "TSMC is working closely with Mentor, which continues to increase its value to the TSMC ecosystem by offering more features to its EDA solutions in support of our new 5nm and 7nm FinFET Plus processes," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division.
  • Mentor enhanced the Calibre nmDRC and Calibre nmLVS tools for TSMC's 7nm FinFET Plus process and the latest version of 5nm FinFET process.
  • Mentor's Caliber YieldEnhancer tool is certified for TSMC's 5nm and 7nm FinFET Plus processes.
  • The AFS platform, including the AFS Mega circuit simulator, is certified for TSMC's 7nm FinFET Plus process and the latest version of 5nm FinFET process.

Lumerical Joins TSMC OIP EDA Alliance

Retrieved on: 
Tuesday, October 2, 2018
Electromagnetism, Electronic engineering, Force, Simulation software, TSMC, Integrated circuit, Enablement, Mentor Graphics, Photonics, Finite-difference time-domain method

VANCOUVER, B.C., Oct. 2, 2018 /PRNewswire-PRWeb/ --Lumerical Inc. ( http://www.lumerical.com ) today announces that it has joined Taiwan Semiconductor Manufacturing Company, Ltd. Open Innovation Platform EDA Alliance enabling photonic simulation.

Key Points: 
  • VANCOUVER, B.C., Oct. 2, 2018 /PRNewswire-PRWeb/ --Lumerical Inc. ( http://www.lumerical.com ) today announces that it has joined Taiwan Semiconductor Manufacturing Company, Ltd. Open Innovation Platform EDA Alliance enabling photonic simulation.
  • The new partnership addresses this domain through TSMC and Lumerical providing customer enablement of Lumerical's component simulation tools (FDTD Solutions, MODE Solutions, and DEVICE) and INTERCONNECT photonic circuit simulator.
  • TSMC originally launched the Open Innovation Platform in 2008 as an industry-wide design enablement initiative.
  • We can provide this by enabling Lumerical's tools into existing OIP partner IC design flows," stated Suk Lee, Senior Director of Design Infrastructure Marketing Division at TSMC.