Electronic engineering

Hackaday's Flexible PCB Contest Launches Today!

Retrieved on: 
Wednesday, March 6, 2019
Electronics manufacturing, Electromagnetism, Pollution, Electrical engineering, Electronic engineering, Printed circuit board, Polychlorinated biphenyl, Flexible circuit, Flexible electronics, Hackaday, PCBS, Flexible

PASADENA, Calif., March 6, 2019 /PRNewswire/ -- Digi-Key Electronics and Hackaday are teaming up for the Flexible PCB Contest and challenging makers to get creative with a board design 2 square inches (13 square cm) or smaller.

Key Points: 
  • PASADENA, Calif., March 6, 2019 /PRNewswire/ -- Digi-Key Electronics and Hackaday are teaming up for the Flexible PCB Contest and challenging makers to get creative with a board design 2 square inches (13 square cm) or smaller.
  • Flexible PCBs can have useful applications: their thinness and flexibility allow them to fit in places where rigid PCBs and wires might not work and can reduce the overall weight of a project.
  • The most exciting part of the contest is the prize - 60 winners will be chosen, each of whom will receive a code to get threePCBs of their design manufactured for free.
  • The Flexible Circuit Contest runs from March 6 through May 29, 2019.

WINDGO Granted Intelligent Glass Display Patent

Retrieved on: 
Wednesday, March 6, 2019
Electronics, Display technology, Technology, Electronic engineering, Energy-saving lighting, Video hardware, Emerging technologies, Flexible electronics, OLED, Liquid-crystal display, Smart glass, Light-emitting diode

COLUMBIA, Mo., March 6, 2019 /PRNewswire/ --Today, WINDGO, Inc., a research and development company specializing in smart material and vibrational transfer technologies announced that they were granted US Patent # 10,223,985 for its multi-functional intelligent glass display.

Key Points: 
  • COLUMBIA, Mo., March 6, 2019 /PRNewswire/ --Today, WINDGO, Inc., a research and development company specializing in smart material and vibrational transfer technologies announced that they were granted US Patent # 10,223,985 for its multi-functional intelligent glass display.
  • This patent is in line with the WINDGO focus on energy resonant vibrational technologies and products.
  • Windgo has now combined its Smart Glass technology with visual display technologies such as LED, LCD, oLED, and other new emerging display technologies.
  • A near term practical application of the Windgo Smart Window display will be replacing plastic aircraft window shades.

Global Automotive Domain Control Unit (DCU) Industry Report, 2018-2019 with Focus on the Chinese Market

Retrieved on: 
Wednesday, March 6, 2019
Electronic engineering, Electronics, Digital signal processing, Electrical engineering, Integrated circuits, Microcomputers, Microprocessor, Telecommunications engineering, Digital signal processor, Processor

DUBLIN, March 6, 2019 /PRNewswire/ -- The "Global and China Automotive Domain Control Unit (DCU) Industry Report, 2018-2019" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 6, 2019 /PRNewswire/ -- The "Global and China Automotive Domain Control Unit (DCU) Industry Report, 2018-2019" report has been added to ResearchAndMarkets.com's offering.
  • Automotive electronic controllers are used to receive and process signals from sensors and export control commands to the actuator to execute.
  • Microprocessors, the core of an automotive ECU, include the micro control unit (MCU), microprocessor unit (MPU), digital signal processor (DSP) and logic integrated circuits (IC).
  • In other words, unlike peripheral parts just playing their own roles, a central domain control unit looks at the whole system.

IDTechEx Research: Technologies to Watch in 2019

Retrieved on: 
Tuesday, March 5, 2019
Flexible electronics, Electronic engineering, Electronics manufacturing, Printed electronics, User interface design, Design, Human behavior, Draft:Printed Electronics USA

The "user pull" comes from the idea of having a large display when you need it but in a portable format.

Key Points: 
  • The "user pull" comes from the idea of having a large display when you need it but in a portable format.
  • Many new foldable display products will come to market from 2019, but apps and user interface design now need to catch up.
  • IDTechEx guides your strategic business decisions through its Research, Consultancy, and Events services, helping you profit from emerging technologies.
  • Find out more about IDTechEx research on display technologies , printed electronics , electric vehicles and enabling components , wearable healthcare technologies and more at www.IDTechEx.com .

Kazuhm Joins NVIDIA Inception Program

Retrieved on: 
Tuesday, March 5, 2019
Computer architecture, GPGPU, Coprocessors, Graphics hardware, Electronic engineering, Nvidia, Computer engineering, Graphics processing unit

SAN DIEGO, March 5, 2019 /PRNewswire/ -- Kazuhm, the next-generation workload processing platform, today announced it has joined the NVIDIA Inception program, a virtual accelerator program that is designed to nurture startups during critical stages of product development, prototyping and deployment, to revolutionize industries with advancements in artificial intelligence (AI) and data science.

Key Points: 
  • SAN DIEGO, March 5, 2019 /PRNewswire/ -- Kazuhm, the next-generation workload processing platform, today announced it has joined the NVIDIA Inception program, a virtual accelerator program that is designed to nurture startups during critical stages of product development, prototyping and deployment, to revolutionize industries with advancements in artificial intelligence (AI) and data science.
  • As a member of Inception, Kazuhm will strengthen its deep learning expertise through powerful graphics processing unit (GPU) tools, hardware grants and best-in-class training in neutral-network machine learning applications, among other benefits.
  • "To meet this need head-on, we recognize the value in working alongside industry pioneers, like NVIDIA through its Inception program, to improve our insights and access to game-changing technology and resources.
  • Kazuhm will be presenting a Tech Talk at NVIDIA's GPU Technology Conference in Silicon Valley on March 18-21, 2019.

Arteris IP FlexNoC® Interconnect Licensed by Lynxi Technologies for Artificial Intelligence (AI) Chips

Retrieved on: 
Tuesday, March 5, 2019
Electronic engineering, Technology, Arteris, Electronics, Hardware acceleration, Electronic design automation, Network on a chip, Integrated circuit

CAMPBELL, Calif., March 5, 2019 /PRNewswire-PRWeb/ -- Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Lynxi Technologies has licensed Arteris IP FlexNoC Interconnect for use in its high-performance neural network processing chips.

Key Points: 
  • CAMPBELL, Calif., March 5, 2019 /PRNewswire-PRWeb/ -- Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Lynxi Technologies has licensed Arteris IP FlexNoC Interconnect for use in its high-performance neural network processing chips.
  • "Arteris IP is excited that the Lynxi team has chosen FlexNoC interconnect IP as the network-on-chip communications backbone for their deep learning AI chips," said K. Charles Janac, President and CEO of Arteris IP.
  • Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO automated timing closure capabilities.
  • Arteris, FlexNoC, Ncore, and PIANO are registered trademarks of Arteris, Inc. Arteris IP, CodaCache, and the Arteris IP logo are trademarks of Arteris, Inc. All other product or service names are the property of their respective owners.

MACOM Expands 400G PAM-4 Chipset Solution for Data Center Optical Connectivity with New Low Noise Transimpedance Amplifiers

Retrieved on: 
Monday, March 4, 2019
Technology, Data management, Satellite, Semiconductor, MACOM Technology Solutions, Integrated circuits, Microwave, Interconnects, Earth–Moon–Earth communication, Electromagnetism, Electronics, Electronic engineering

(Photo: Business Wire)

Key Points: 
  • (Photo: Business Wire)
    Delivering industry-leading low noise performance less than 1.5 uA RMS typical and supporting bandwidth up to 35 GHz, MACOMs MATA-03820 and MATA-03819 TIA family supports high throughput optical data links in a very low power profile, optimal for use in high density optical Data Center interconnects.
  • The low noise performance of MACOMs TIA along with its flexible programmability, enable delivery of industry leading low bit error performance when implemented with a DSP for 400G modules.
  • OFC 2019 attendees are invited to visit with MACOM at the San Diego Convention Center, California, in the MACOM InnovationZone at booth #2739.
  • MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM.

Honeywell Forecasts 4,000 New Civil Helicopter Deliveries Over Next Five Years

Retrieved on: 
Monday, March 4, 2019
Aircraft instruments, Technology, Companies, Avionics, Electronic engineering, Honeywell, Helicopter, Economy of the United States

"Honeywell remains focused on bringing innovation to the market by delivering avionics, monitoring systems and Connected Helicopter technologies that boost a platform's efficiency and availability."

Key Points: 
  • "Honeywell remains focused on bringing innovation to the market by delivering avionics, monitoring systems and Connected Helicopter technologies that boost a platform's efficiency and availability."
  • A greater proportion of planned new helicopter purchases are for intermediate/medium twin-engine models in this year's survey compared with 2018.
  • The predicted increase in deliveries signals an overall healthy helicopter market poised for moderate growth.
  • North America is home to more than 40 percent of the world's helicopter fleet.

Lattice Semiconductor Names Fujitsu 2018 Supplier of the Year

Retrieved on: 
Monday, March 4, 2019
Technology, Data management, Internet, Networks, Semiconductor, Electronic engineering, Fabless semiconductor companies, Semiconductor device fabrication, Electronics, Lattice Semiconductor, Integrated circuits, Ice

Lattice Semiconductor Corporation (NASDAQ: LSCC), a leading provider of customizable smart connectivity solutions, today announced Mie Fujitsu Semiconductor Limited (MIFS) as its 2018 Supplier of the Year.

Key Points: 
  • Lattice Semiconductor Corporation (NASDAQ: LSCC), a leading provider of customizable smart connectivity solutions, today announced Mie Fujitsu Semiconductor Limited (MIFS) as its 2018 Supplier of the Year.
  • Lattice selected MIFS as its 2018 Supplier of the Year in recognition of significant productivity and reliability milestones the two companies achieved together.
  • Lattice Semiconductor (NASDAQ: LSCC) is a leader in low power, small form factor programmable logic devices.
  • Lattice Semiconductor Corporation, Lattice Semiconductor (& design) and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

QuickLogic to Present at the 31st Annual ROTH Conference

Retrieved on: 
Monday, March 4, 2019
Electronic engineering, Electronics, Semiconductors, Hardware acceleration, Fabless semiconductor companies, Field-programmable gate array, Intel, Ice

SUNNYVALE, Calif., March 4, 2019 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, plans to present at the 31st Annual ROTH Conference on Monday, March 18, 2019, at the Ritz-Carlton in Dana Point, California.

Key Points: 
  • SUNNYVALE, Calif., March 4, 2019 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, plans to present at the 31st Annual ROTH Conference on Monday, March 18, 2019, at the Ritz-Carlton in Dana Point, California.
  • The panel will be available for replay on the company's website at www.quicklogic.com by end of day on March 18th for 90 days.
  • QuickLogic develops low power, multi-core semiconductor platforms and Intellectual Property (IP) for Artificial Intelligence (AI), voice and sensor processing.
  • QuickLogic and logo are registered trademarks and EOS is a trademark of QuickLogic.