Global Low Profile Additives Market Size, Share & Trends Analysis Report 2019 - ResearchAndMarkets.com

The "Global
Low Profile Additives Market Size, Share & Trends Analysis Report 2019"
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The global low profile additives market size is expected to reach USD
1.71 billion by 2025, expanding at a CAGR of 7.4% over the forecast
period, according to this new report. Growing demand for low shrinkage
and surface finished plastic products is likely to drive the demand for
Low Profile Additives (LPA).

Demand for low profile additives is anticipated to witness significant
growth in the forthcoming years on account of expanding automotive
industry in Asia Pacific and North America. Increasing application of
Polyvinyl Acetate (PVA) low profile additives in headlamp reflectors,
lighting systems, and under the hood components is likely to drive
growth of the low profile additives market. On the down side,
fluctuation in raw material prices is expected to hinder the growth over
the forecast period. An increase in raw material prices could result in
a surge in cost of production, thereby affecting LPA prices.

Low cost for per unit weight is likely to drive demand for polystyrene
products over the forecast period. Growing demand from construction
industry and increasing SMC and BMC applications are expected to drive
demand for low profile additives. Polystyrene LPAs are used in various
markets including building and construction, electronics and electrical,
home and domestic appliances, and industrial sector. Growing demand for
low shrinkage products from end-use industries is expected to drive
demand for polystyrene products in near future.

Increasing demand from sheet and bulk molding compounds is prominently
fueling the LPA market growth. Although Sheet Molding Compounds (SMC)
and Bulk Molding Compounds (BMC) are similar in composition, they are
processed differently. Production technologies for both these composites
involve similar two-part process for molded parts.

Low profile additives used in the resin premixes perform the role of
reduction of polymerization shrinkage and thermal contraction. The
resulting composite parts from these applications compete with steel
parts in their mechanical properties and ensure pronounced chemical and
corrosion resistance and allow very high design freedom.

SMCs ensure superior mechanical properties on the backdrop of the longer
fibers utilized in this process. On the other hand, BMCs impart several
essential advantages to the composite materials such as better flow and
temperature resistance as compared to SMC owing to the shorter fibers
and higher filler content.

Most companies actively participating in the market have extensive
production capacities and vast distribution channels across the globe.
Manufacturers are involved in new product developments and expansion
strategies, such as mergers and acquisitions, to strengthen their
position in the market.

Further key findings from the study suggest:

• Asia Pacific led the low profile additives market during the forecast
  period. China is the fastest-growing country on account of growing
  automotive industry.
• Polyvinyl acetate segment is fueling the market growth owing to its
  improved surface finished and low shrinkage properties.
• Various strategic initiatives were recorded over the past few years to
  boost the growth of the market. For instance, in November 2017, Wacker
  Chemie AG expanded its existing production facilities dispersions and
  dispersible polymer powders in South Korea. Purpose of the expansion
  was to increase annual production capacity of dispersible polymer
  powders up to 80,000 MT.

Companies Mentioned

• Ashland
• Reichhold
• Arkema Group
• Wacker AG
• PolyOne Corporation
• Lucite International
• FRP Services & Company
• Mechemco
• LyondellBasell Industries Holdings B.V.
• Swancor Holding Co. Ltd.
• Polynt SpA
• KONINKLIJKE DSM N.V.

For more information about this report visit https://www.researchandmarkets.com/r/3l6rzc

View source version on businesswire.com: https://www.businesswire.com/news/home/20190610005524/en/