Molex Showcases Expanded Portfolio of Next-Generation Optical Solutions at OFC 2019

Molex will
feature several next-generation optical interconnect, wavelength
management, optoelectronic and optical subsystem solutions for dynamic
high-bandwidth telecommunications and network solutions at the Optical
Networking and Communication Conference and Exhibition (OFC), March 5-7,
2019 at the San Diego (CA) Convention Center in booth 2807.

“By combining our core technologies with additional complementary
capabilities from our acquisitions and venture investments, we are proud
to offer our customers a strong portfolio of innovative optical
solutions to meet their needs today and in the future. At OFC 2019, we
are excited to highlight those combined solutions including high-speed
optical transceivers, flexible and scalable optical transport products,
compact connectors and fiber management, which are all vital
capabilities to building high-bandwidth and high-density communication
equipment needed to serve telecom, enterprise and hyperscale data
centers,” said Doug Busch, vice president and general manager, optical
solutions at Molex.

To help build the infrastructure of tomorrow’s optical networks,
Molex will feature several public and private demos, including:

• OptoConnect
  Optical Enclosures – OptoConnect optical management solutions
  simplify complex fiber mapping while greatly reducing intra-system
  cabling footprints in advanced network architectures.
• Fiber
  Management Solutions for COBO Based Optical Engines – A COBO*
  module-based reference layout board including high-density front panel
  Optical EMI shielding adapters, blind mating optical backplane
  interconnects and on-card optical cabling featuring FlexPlane
  technology will highlight how system vendors can implement COBO on
  board optical module-based architectures.
  *For more
  COBO-related information, visit the consortium for on board optics at
  booth 1817.

• Dirac
  – Is the latest offering of high-port-count WSS for route-and-select
  architectures that demand 32+ ports.
• BittWare,
  a Molex Company, will preview its SVL-29P – a PCIe board with dual
  400G-compatible ports directly connected to a Xilinx VU29P FPGA. This
  FPGA utilizes the new 58 Gbps PAM-4 transceivers. The low-profile
  SVL-29P is an excellent board for those who want to get a head-start
  on 400G FPGA-based designs.
• Molex
  will demonstrates interoperability of its 400G DR4, 100G optics
  modules and 3m QSFP-DD DAC cables with Cisco N3432D-S switch, Innovium
  TERALYNX^TM Switch and Keysight Technologies IXIA AresONE.

The following demos are by appointment only. Please contact Molex to
schedule.

• C+L
  band EDFA and Raman Amplifier will highlight how a compact,
  low-loss DGE can greatly reduce accumulated gain error,
  eliminate dynamic gain ripple and lower the noise figure.
• Molex
  will demonstrate its coherent module capable to achieve 400G
  transmission and low power consumption. Performances under 16-QAM
  modulation at 60G baud rates will be shown in real-time for critical
  parameters.

Molex will also participate in speaking engagements:

• In a session organized by the Consortium for On-Board Optics (COBO),
  Molex’s Tom Marrapode will join other COBO members presenting on
  topics related to on board optical modules. This will include
  development in systems and sub-systems discussing both electrical and
  optical interconnects. The session
  will take place Wednesday, March 6, 2019 from 10:15-11:45AM in Theater
  II, Hall E.
• Molex’s Tom Strasser will teach the ever popular foundational course
  on Reconfigurable
  Networks, SC 261: ROADM Technologies and Network Applications on
  Monday, March 4, 2019.

Molex joins other Optical Internetworking Forum (OIF) members
attending OFC 2019 to showcase interoperability of Common Electrical
Interface (CEI) solutions over a range of channel reaches and
modulations. Live technology demonstrations featuring Molex solutions
include:

• Cables with Connector/Cage and Cables Demo
  A baseline
  draft of the CEI 112G LR Implementation Agreement has been developed.
  This demonstration, which establishes early stage feasibility for this
  topology, utilizes Molex’s QSFP-DD (Double Density) passive copper
  cable.

• CEI-112G-VSR SerDes with Module demo incorporates multiple
  silicon supplier products operating over a 112 Gbps PAM-4 VSR
  (chip-to-module) link. This demo utilizes Molex’s QSFP-DD, a
  CEI-112G-VSR interface, to electrically drive interoperating HCB/MCB
  test boards.

Please visit the Molex booth at OFC 2019 or https://www.connector.com/solutions/ofc
to explore a robust portfolio of next-generation, high-speed,
high-density optical solutions. To learn more about how you can become a
part of the Molex innovation, please visit booth 5349 in the Career Zone.

About Molex:

Molex brings together innovation and technology to deliver electronic
solutions to customers worldwide. With a presence in more than 40
countries, Molex offers a full suite of solutions and services for many
markets, including data communications, consumer electronics, medical,
industrial, automotive, and commercial vehicle. For more information,
please visit www.molex.com.

Molex Resources:

• Learn more about Molex at www.molex.com
• Follow us at www.twitter.com/molexconnectors
• Watch our videos at www.youtube.com/molexconnectors
• Connect with us at www.facebook.com/molexconnectors
• Read our blog at www.connector.com

Molex is a registered trademark of Molex, LLC in the United States of
America and may be registered in other countries; all other trademarks
listed herein belong to their respective owners.

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