Xpeedic Releases RF EDA Solution 2023 at IMS
RF EDA Solution Accelerates Design of RF Modules, Systems Using Chip-Package-System EDA tools and IPD IP
- RF EDA Solution Accelerates Design of RF Modules, Systems Using Chip-Package-System EDA tools and IPD IP
SAN DIEGO, June 13, 2023 (GLOBE NEWSWIRE) -- Xpeedic of Cupertino, Calif., unveiled RF EDA Solution 2023 edition today at the IEEE MTT International Microwave Symposium (IMS) here, showcasing its ability to accelerate the design of highly integrated RF modules and systems using its differentiating chip-package-system EDA tools and mass-production proven Integrated Passive Devices (IPD) IP. - The RF Electronic Design Automation (EDA) Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.
- Xpeedic will be in Booth #1121 at the IEEE MTT International Microwave Symposium (IMS) in the San Diego Convention Center in San Diego.
- “Overview of Integrated Passive Devices (IPD) for RF Front-end Applications” will be presented by Xpeedic Wednesday at 3 p.m. at the MicroApps Theater in Booth #2447.