There's Moore to come: SCHOTT strengthens glass substrate portfolio, allowing advanced semiconductor packaging for the age of AI
As uncompromised, high-quality glass substrates are crucial for enabling advanced packaging in the upcoming decade, SCHOTT is proactively setting the course to enable the industry to innovate even further.
- As uncompromised, high-quality glass substrates are crucial for enabling advanced packaging in the upcoming decade, SCHOTT is proactively setting the course to enable the industry to innovate even further.
- View the full release here: https://www.businesswire.com/news/home/20230927430641/en/
SCHOTT offers a diverse variety of panel glass and carrier wafers for advanced semiconductor packaging and processing. - “Today, we are announcing a three-point action plan to tackle the increasing demand for glass substrates for advanced packaging.
- Additionally, unique substrates that are tailor-made for diverse applications in advanced chip packaging have entered the final stage of market-readiness.