Application-specific integrated circuit

SatixFy Announces Full Year 2023 Results

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금요일, 3월 29, 2024
Technology, Hardware, Satellite, LEO, Research, European Space Agency, Device, MDA, Application-specific integrated circuit, Cash, Travel, SATX, Insurance, Marketing, Alta Partners, Investment, Research and development, Annual report, RSU, Cryptocurrency

SatixFy Communications Ltd. (the “Company” or “SatixFy”) (NYSE AMERICAN: SATX), a pioneering force in next-generation satellite communication systems driven by in-house developed chipsets, has released its consolidated financial results for the full year period ended December 31, 2023.

Key Points: 
  • SatixFy Communications Ltd. (the “Company” or “SatixFy”) (NYSE AMERICAN: SATX), a pioneering force in next-generation satellite communication systems driven by in-house developed chipsets, has released its consolidated financial results for the full year period ended December 31, 2023.
  • The decrease in gross profit and margin due to the Company’s engagement in 2023 in projects which carry lower gross margins compared to 2022.
  • Nir Barkan, Acting Chief Executive Officer of SatixFy, commented, “2023 was marked by strategic advancements and solid progress within our product development and customer engagements.
  • “SatixFy is at a key inflection point in the industry, driven in-part by the fast-growing Low Earth Orbit ('LEO') low-latency satellite market providing broad data coverage anywhere, anytime.

AST SpaceMobile ASIC Chip Enters Tape-Out Phase in Collaboration with TSMC

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수요일, 3월 27, 2024
Telecommunications, Satellite, Networks, Internet, Technology, Aerospace, Manufacturing, Mobile, Wireless, Government, Millicom, Rakuten, Bell Canada, ASIC, Application-specific integrated circuit, Saudi Telecom Company, Telephone, Research, Smart Communications, AST SpaceMobile, Smartfren, Architecture, Bluebird, Data-rate units, AT&T, Indosat, Africell, Heart, Patent, Telefónica, Multimedia, TIM, Telecom Argentina, American Tower, ASTS, TSMC, Mobile phone

AST SpaceMobile, Inc. (“AST SpaceMobile”) (NASDAQ: ASTS), the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government use, proudly announces the commencement of the tape-out phase for its Application-Specific Integrated Circuit (ASIC), in collaboration with TSMC, the world's leading foundry.

Key Points: 
  • AST SpaceMobile, Inc. (“AST SpaceMobile”) (NASDAQ: ASTS), the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government use, proudly announces the commencement of the tape-out phase for its Application-Specific Integrated Circuit (ASIC), in collaboration with TSMC, the world's leading foundry.
  • "The commencement of the tape-out process for our ASIC, in collaboration with TSMC and other leaders in the semiconductor industry, is a testament to the unwavering commitment of our talented team," said Abel Avellan, Chairman and CEO of AST SpaceMobile.
  • AST SpaceMobile has more than 3,100 patent and patent-pending claims for its technology and operates state-of-the-art, vertically integrated manufacturing and testing facilities in Midland, Texas, which collectively span 185,000 square feet.
  • Rakuten, American Tower and Bell Canada are also existing investors in AST SpaceMobile.

LDG Tech Advisors Publish Guide to the AI Industry. Estimates $100 million Revenues "Realistic" for AI Industry in 2028 and Identifies Nine Key AI Opportunities

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수요일, 4월 3, 2024
Microsoft, Natural language processing, Apple, Artificiality, Amazon, Health, Application-specific integrated circuit, Trust, Bias, Internet, Meta, Policy, ARM, SAP, AI, IBM, Graphics processing unit, Machine learning, Marketing, TSMC, Medical device

RICHMOND, Va., April 3, 2024 /PRNewswire/ -- LDG Tech Advisors announces publication of "Gasman's Guide to the Artificial Intelligence Industry".

Key Points: 
  • RICHMOND, Va., April 3, 2024 /PRNewswire/ -- LDG Tech Advisors announces publication of "Gasman's Guide to the Artificial Intelligence Industry".
  • According to the Guide, the AI industry will generate around $35 billion in revenues in 2024 growing to nearly $100 billion in 2028 and it identifies nine key AI opportunities that will emerge in the next few years.
  • The Guide cuts through the AI hype, pointing out that the AI industry has gone through funding "winters" before and could go through another.
  • Which chips will drive tomorrow's AI data centers and what is the future of GPUs, QPUs and ASICs in AI?

SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product

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목요일, 3월 28, 2024
Cloud, Fin field-effect transistor, Head, SOC, DSP, Growth, ARIES, LPDDR4, Application-specific integrated circuit, Samsung Electronics, AI, Robotics, USB On-The-Go, Semiconductor, NPU, Ecosystem, Cloud computing, CPU, IPS, Silicon, Video game

SEOUL, South Korea , March 27, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea. This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.

Key Points: 
  • SEOUL, South Korea , March 27, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea.
  • This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.
  • Pre-verified and integrated, SEMIFIVE's 14nm AI Inference SoC Platform includes a quad-core high performance 64-bit CPU, 8 lanes of PCIe Gen4 and 4-channel LPDDR4 interfaces.
  • "We are proud to have collaborated with Mobilint, contributing to the rapid commercialization of AI semiconductors—a testament to the value of our AI SoC Platform.

Eoptolink Launches SFP112 Optical Transceiver Portfolio at OFC 2024

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금요일, 3월 22, 2024
MSA, Application-specific integrated circuit, SAN, LPO, SerDes, IEEE, SFP, KP4, PON

CHENGDU, China and SAN DIEGO, March 22, 2024 /PRNewswire/ -- Eoptolink Technology Inc., Ltd. (SZSE: 300502), a leading innovator and provider of advanced optical transceiver solutions, launches a family of 100G SFP112 transceivers at OFC 2024.

Key Points: 
  • CHENGDU, China and SAN DIEGO, March 22, 2024 /PRNewswire/ -- Eoptolink Technology Inc., Ltd. (SZSE: 300502), a leading innovator and provider of advanced optical transceiver solutions, launches a family of 100G SFP112 transceivers at OFC 2024.
  • SFP112 form-factor transceivers offer the highest single module port density for 100G connectivity.
  • Eoptolink's 100G SFP112 portfolio consists of DR, FR, LR and ER versions fulfilling IEEE 802.ck and 100G lambda MSA requirements.
  • Live demonstrations of the 100G SFP112 series modules will be conducted, together with 1.6T, 800G, LPO and 50g PON high-performance optical transceiver solutions, at Eoptolink's booth #3127 at OFC 2024, San Diego, CA and we welcome you to come along and see the results for yourself.

Eoptolink Demonstrates Industry 1st 200G/lane LPOs with 100G/lane 800G LPOs Entering Mass Production

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목요일, 3월 21, 2024
GPU, MSA, Application-specific integrated circuit, SAN, LPO, AI, DSPS, NIC, Supercomputer, QSFP-DD, PON, Ecosystem, Silicon, Video game

LPO transceivers are designed without DSPs or CDRs, resulting in lower power consumption and significantly less latency.

Key Points: 
  • LPO transceivers are designed without DSPs or CDRs, resulting in lower power consumption and significantly less latency.
  • Eoptolink 800G OSFP DR4 LPO transceivers utilize a silicon photonics PIC that transmits 4 parallel channels at 200Gb/s.
  • In addition, Eoptolink has launched the 2nd generation of its 100G/lane 800G and 400G LPO products for single-mode applications in OSFP, QSFP-DD and QSFP112 form-factors.
  • The second generation of Eoptolink 800G and 400G LPO products enables users to achieve full TP2 compliance at the optical transmit interface of the modules.

Space Semiconductor Market to Reach $4,813.8 million, Globally, by 2032 at 8.8% CAGR: Allied Market Research

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화요일, 3월 19, 2024
Xilinx, Statistics, Temperature, Radiation, Infineon Technologies, ICS, PDF, Longevity, Forecasting, Application-specific integrated circuit, Risk, International, Space Forge, Power ISA, RAD750, Electronics, Research, Architecture, Field-programmable gate array, Investment, Semiconductor, Ecosystem, Literature, Telecommunications, GlobalFoundries, Chart, Teledyne Technologies, SME, Table, BAE Systems, Weather, Video game

WILMINGTON, Del., March 19, 2024 /PRNewswire/ -- Allied Market Research published a report, titled, "Space Semiconductor Market by Type (Radiation Hardened Grade and Radiation Tolerant Grade), Component (Integrated Circuits, Discrete Semiconductors Devices, Optical Devices, Microprocessor, Memory, Sensors, and Others), and Application (Satellite, Launch Vehicles, Deep Space Probe, and Rover and Lander): Global Opportunity Analysis and Industry Forecast, 2023–2032. 

Key Points: 
  • In addition, large amounts of certain semiconductor materials, like neon gas, are made in Ukraine and are used in the semiconductor manufacturing process.
  • Recent Advancements in the Space Semiconductor Sector Showcase Notable Collaborations and Innovations:
    In August 2021, BAE Systems joined forces with Global Foundries to fabricate a radiation-hardened single-board computer tailored for space applications.
  • In September 2023, Northrop Grumman's U.K. division partnered with British startup Space Forge, which endeavors to manufacture semiconductors in space.
  • On the basis of component, the integrated circuits segment held the highest market share in 2022, accounting for around one-third of the global space semiconductor market revenue.

Space Semiconductor Market to Reach $4,813.8 million, Globally, by 2032 at 8.8% CAGR: Allied Market Research

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화요일, 3월 19, 2024
Xilinx, Statistics, Temperature, Radiation, Infineon Technologies, ICS, PDF, Longevity, Forecasting, Application-specific integrated circuit, Risk, International, Space Forge, Power ISA, RAD750, Electronics, Research, Architecture, Field-programmable gate array, Investment, Semiconductor, Ecosystem, Literature, Telecommunications, GlobalFoundries, Chart, Teledyne Technologies, SME, Table, BAE Systems, Weather, Video game

WILMINGTON, Del., March 19, 2024 /PRNewswire/ -- Allied Market Research published a report, titled, "Space Semiconductor Market by Type (Radiation Hardened Grade and Radiation Tolerant Grade), Component (Integrated Circuits, Discrete Semiconductors Devices, Optical Devices, Microprocessor, Memory, Sensors, and Others), and Application (Satellite, Launch Vehicles, Deep Space Probe, and Rover and Lander): Global Opportunity Analysis and Industry Forecast, 2023–2032. 

Key Points: 
  • In addition, large amounts of certain semiconductor materials, like neon gas, are made in Ukraine and are used in the semiconductor manufacturing process.
  • Recent Advancements in the Space Semiconductor Sector Showcase Notable Collaborations and Innovations:
    In August 2021, BAE Systems joined forces with Global Foundries to fabricate a radiation-hardened single-board computer tailored for space applications.
  • In September 2023, Northrop Grumman's U.K. division partnered with British startup Space Forge, which endeavors to manufacture semiconductors in space.
  • On the basis of component, the integrated circuits segment held the highest market share in 2022, accounting for around one-third of the global space semiconductor market revenue.

QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications

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목요일, 3월 14, 2024
LEO, Socs, Interest, Application-specific integrated circuit, Partnership, SAN, Australis, ZES, SWAP, Field-programmable gate array, Senior, Marketing, IP, LDAP, Intellectual property, Growth, PPA, FPGA

SAN JOSE, Calif., March 14, 2024 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI/ML solutions, today announced a strategic partnership with Zero-Error Systems America (ZES), a leading provider of radiation-hardened-by-design (RHBD) semiconductor solutions and intellectual property (IP). This partnership enables the creation of radiation-tolerant eFPGA IP for commercial space applications, targeting ASICs and SoCs that require high reliability in flight and space environments.

Key Points: 
  • This partnership enables the creation of radiation-tolerant eFPGA IP for commercial space applications, targeting ASICs and SoCs that require high reliability in flight and space environments.
  • However, conventional eFPGA IP, crucial for post-launch reprogrammability, lacks optimization for these radiation-tolerant commercial and space applications.
  • Utilizing ZES' robust RHBD cell libraries, QuickLogic and ZES will partner to address this need by delivering state-of-the-art, reliable, radiation-tolerant eFPGA IP cores and customization options.
  • Interested commercial customers can contact QuickLogic at [email protected] regarding their radiation-tolerant eFPGA IP needs.

Tenstorrent and MosChip Partner on High Performant RISC-V Design

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수요일, 3월 13, 2024
Application-specific integrated circuit, Partnership, CCO, DFT, RTL, Spirit level

SANTA CLARA, Calif., March 13, 2024 /PRNewswire/ --Tenstorrent and MosChip Technologies announced today that they are partnering on design for Tenstorrent's cutting-edge RISC-V solutions.

Key Points: 
  • SANTA CLARA, Calif., March 13, 2024 /PRNewswire/ --Tenstorrent and MosChip Technologies announced today that they are partnering on design for Tenstorrent's cutting-edge RISC-V solutions.
  • In selecting MosChip Technologies, Tenstorrent stands to strongly advance both its own and its customers' development of RISC-V solutions as they work together on Physical Design, DFT, Verification, and RTL Design services.
  • "MosChip Technologies is special in that they have unparalleled tape out expertise in design services, with more than 200 multi-million gate ASICs under their belt", said David Bennett, CCO of Tenstorrent.
  • "Partnering with MosChip enables us to design the strongest RISC-V solution we can to serve ourselves, our partners, and our customers alike."