HBM

Key Figures 15.03.2024

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Mercredi, avril 10, 2024
HBM, Fund, Investment, News, Mail

This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.

Key Points: 
  • This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.
  • If you have received this message by error, please advise the sender immediately and delete this message.
  • The publication is for information purposes only and does not constitute an offer to sell or a solicitation to buy securities.
  • Performance data does not take into account any commissions and costs charged when units of the Fund are issued and redeemed.

Key Figures 31.03.2024

Retrieved on: 
Mercredi, avril 10, 2024
HBM, Fund, Investment, News, Mail

This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.

Key Points: 
  • This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.
  • If you have received this message by error, please advise the sender immediately and delete this message.
  • The publication is for information purposes only and does not constitute an offer to sell or a solicitation to buy securities.
  • Performance data does not take into account any commissions and costs charged when units of the Fund are issued and redeemed.

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

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Lundi, mars 25, 2024
Wide Open West, Cleveland Avenue, HBM, Samsung Catalyst Fund, Growth, Intel Capital, AI, Tiger Global Management, Telescopic sight

Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.

Key Points: 
  • Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million.
  • The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.
  • Eliyan's chiplet interconnect technology achieves up to 4x the performance and half the power of other solutions.
  • The company's NuLink PHY, proven on advanced process nodes, addresses both Die-to-Die and Die-to-Memory interconnect with its highly efficient performance metrics.

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

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Mercredi, avril 3, 2024
CHIPS, Second Continental Congress, HBM, Congress, MediaTek, Federation, Partnership, Technology policy, SK Hynix, Saab, Research, I-65, News, Rolls-Royce, AI, Social responsibility, Semiconductor, Bayer, Silicon, Workforce, ChatGPT, Purdue Research Park, Policy

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.

Key Points: 
  • WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “SK hynix is the global pioneer and dominant market leader in memory chips for AI,” Purdue President Mung Chiang said.
  • This historic announcement is the next step in Purdue University’s persistent pursuit of semiconductor excellence as part of the Purdue Computes initiative.

Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

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Mercredi, avril 3, 2024
CHIPS, Technology policy, Incentive, Naval Surface Warfare Center, Carbon, Commerce, Purdue Research Park, Investment, Policy, HBM, Duke Energy, Partnership, Research, News, AI, Architecture, Semiconductor, NSWC, South Korea, SK Hynix, Dynamic random-access memory, Engineering, Assistant, Recycling, DRAM, Organic, Silicon, Graphics processing unit, United States Commercial Service, Ecosystem, Purdue University, Renewable energy

The facility will also develop future generations of chips and house an advanced packaging R&D line.

Key Points: 
  • The facility will also develop future generations of chips and house an advanced packaging R&D line.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “We believe this project will lay the foundation for a new Silicon Heartland; a semiconductor ecosystem centered in the Midwest Triangle.
  • The IEDC also committed up to $45 million through the Industrial Development Grant Fund to support infrastructure improvements surrounding the new plant.

Pliops Unlocks Limitless Potential of AI at NVIDIA GTC 2024

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Lundi, mars 18, 2024
Honey, HBM, GTC, GPU, Cooper pair, Memory, Acceleration, RAG, SAN, NVM Express, DBS, AI, Honey badger, Graphics processing unit, Investment, XDP, Solid-state drive, Dell, NVIDIA, Central processing unit, Gen, CPU

Pliops , a leading provider of data processors for cloud and enterprise data centers, will be on hand at NVIDIA GTC this week to tackle these challenges head on.

Key Points: 
  • Pliops , a leading provider of data processors for cloud and enterprise data centers, will be on hand at NVIDIA GTC this week to tackle these challenges head on.
  • Pliops XDP-AccelKV universal data acceleration engine significantly minimizes the scalability challenges of AI/Gen AI applications.
  • The memory capacity and bandwidth limitations of GPUs to load AI/Gen AI models prevent them from fully utilizing their computational power.
  • It extends HBM memory with fast storage to enable terabytes-scale AI applications to run on a single GPU.

Broadcom Delivers Industry’s First 51.2-Tbps Co-Packaged Optics Ethernet Switch Platform for Scalable AI Systems

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Jeudi, mars 14, 2024
Cloud, Logic, HBM, Optics, CMOS, Bailly, Application-specific integrated circuit, CPO, Partnership, Broadcom Inc., Copper, GVP, Graphics processing unit, PALO, Investment, Exhibition, PHY, ByteDance, TBPS, AVGO, Silicon photonics, Silicon, Video game

The product integrates eight silicon photonics based 6.4-Tbps optical engines with Broadcom’s best-in-class StrataXGS® Tomahawk®5 switch chip.

Key Points: 
  • The product integrates eight silicon photonics based 6.4-Tbps optical engines with Broadcom’s best-in-class StrataXGS® Tomahawk®5 switch chip.
  • The optical interconnect is critical for both front-end and back-end networks in large scale generative AI clusters.
  • Today, pluggable optical transceivers consume approximately 50% of system power and constitute more than 50% of the cost of a traditional switch system.
  • “Our partnership with Broadcom to design systems with highly integrated co-packaged optics will enable a more power efficient future network.

Hudbay and Marubeni Sign Flin Flon Option Agreement to Advance Exploration Partnership

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Mercredi, mars 13, 2024
Flin Flon greenstone belt, Uncertainty, HBM, Exercise, Agreement, Geology, Partnership, Risk, Option, VMS, Copper, Gold, News, Anomaly, Don Jon, TSX, Marubeni, IP, Legislation, Mining, Uranium mining

“This exploration partnership with Marubeni represents a significant milestone towards unlocking potential future value in the Flin Flon region,” said Peter Kukielski, Hudbay’s President and Chief Executive Officer.

Key Points: 
  • “This exploration partnership with Marubeni represents a significant milestone towards unlocking potential future value in the Flin Flon region,” said Peter Kukielski, Hudbay’s President and Chief Executive Officer.
  • “This arrangement allows us to partner with Marubeni and leverage our operational and exploration expertise to test our large Flin Flon land package to potentially bring another mine into production and utilize Hudbay’s idle processing infrastructure in Flin Flon.
  • Upon successful completion of Marubeni’s earn-in obligations, Marubeni may exercise its Option to form a joint venture with Hudbay for any of the designated projects.
  • Hudbay has granted Marubeni an option to acquire a 20% interest in three projects located within trucking distance of Hudbay’s processing facilities in Flin Flon, Manitoba.

Global Hybrid Memory Cube and High-Bandwidth Memory Industry Research 2023-2033: Increasing Focus on Energy-Efficient Technology Solutions and Growing Applications of Edge-Based Technologies - ResearchAndMarkets.com

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Lundi, avril 1, 2024
Telecommunications, Software, Networks, Artificial Intelligence, Data Management, Technology, IOT (Internet of Things), Security, Micrometre, HBM, Data wrangling, GPU, Memory, Name, Internet of things, HPC, Artificial intelligence, AI, Graphics processing unit, HMC, AMD, Region, Machine learning, Hybrid Memory Cube, NVIDIA, Video game

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.

Key Points: 
  • Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.
  • Hybrid memory cubes and high-bandwidth memory offer significant memory bandwidth improvements, particularly beneficial for GPUs in graphics rendering and parallel computing.
  • What are the major patents filed by the companies active in the global hybrid memory cube and high-bandwidth memory market?
  • What is the future outlook for the hybrid memory cube and high-bandwidth memory market in terms of growth potential and technological advancements?

Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024

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Mardi, mars 26, 2024
Data Management, Semiconductor, Consumer Electronics, Technology, Software, Artificial Intelligence, Hardware, Corporation, HBM, TC, Memory, Broadcom Inc., CMM, DRAM, Red Hat, Memorandum, Red, Peaberry, AI, Samsung Electronics, CXL, Supermicro, TCO, VMware, FPGA, Samsung, Ecosystem, Persistent memory, TB, Compute Express Link, Multimedia, CPU, IMDB, AIC, Computer data storage

View the full release here: https://www.businesswire.com/news/home/20240326037385/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240326037385/en/
    Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America – Memory at Samsung Electronics, unveiled the industry's first CXL Memory Module Hybrid for Persistent Memory (CMM-H PM) during his keynote presentation at Memcon 2024.
  • Samsung also partnered with Supermicro , a global leader in Plug and Play Rack-Scale IT solutions, to demonstrate the industry’s first Rack-Level memory solution for highly scalable and composable disaggregated infrastructure.
  • On stage, Samsung and VMware by Broadcom also introduced project Peaberry, the world’s first FPGA (Field Programmable Gate Arrays)-based tiered memory solution for hypervisors called CXL Memory Module Hybrid for Tiered Memory (CMM-H TM) .
  • To learn more about Samsung Semiconductor’s advanced memory technologies and solutions, please visit: https://semiconductor.samsung.com/us/